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Cornell Dubilier Electronics Inc PCDGV24A125J572S CAP FILM 125UF 5% 240VAC RADIAL
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Catalog Datasheet	MFG & Type	PDF	Document Tags
Alpha WS609 Abstract: Yamaichi TQFP 244 MO-194AA MO-193 MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx Text: TVSOP Application Brief December 1996 SCBA009B List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Draft 1.3 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete	Original	PDF	SCBA009B MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF Alpha WS609 Yamaichi TQFP 244 MO-194AA MO-194 tssop 16 exposed pad stencil Alpha WS609 solder TSSOP YAMAICHI SOCKET MO-194AC SN74LVC16xxx
solder paste alpha WS609 Abstract: ic51-0142 WS609 Alpha WS609 solder AHC244 AKXXX TSSOP YAMAICHI SOCKET MO-194 MO-194AF 194-AA Text: Thin Very Small-Outline Package TVSOP SCBA009D February 2001 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest	Original	PDF	SCBA009D solder paste alpha WS609 ic51-0142 WS609 Alpha WS609 solder AHC244 AKXXX TSSOP YAMAICHI SOCKET MO-194 MO-194AF 194-AA
PHD64 Abstract: land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14 Text: PowerPAD - A Method To Create Thermally Enhanced Plastic Package Solutions for Semiconductors Milton L. Buschbom, Mark Peterson, Shih-Fang Chuang, David Kee, and Buford Carter Texas Instruments, Incorporated Dallas, Texas f = switching frequency in Hz N = number of gates switched/clock cycle	Original	PDF	100MHz PHD64 land pattern for vsop 8 pins land pattern for vsop DCA56 PFC80 PZT10 DED28 DFD64 DAP38 PWD14
solder paste alpha WS609 Abstract: WS609 ic51-0142 TSSOP YAMAICHI SOCKET MO-194 028089 CM92 MO-194AB MO-194AD Text: Thin Very Small-Outline Package TVSOP SCBA009E April 2001 1 IMPORTANT NOTICE Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue any product or service without notice, and advise customers to obtain the latest	Original	PDF	SCBA009E solder paste alpha WS609 WS609 ic51-0142 TSSOP YAMAICHI SOCKET MO-194 028089 CM92 MO-194AB MO-194AD
Alpha WS609 Abstract: solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000 Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A The Thin Very Small Outline Package (TVSOP) Acknowledgment The authors wish to acknowledge the following persons and corporations for their invaluable assistance in the preparation of this document.	Original	PDF	SCBA009A IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF IC51-0142-2074 Alpha WS609 solder paste alpha WS609 WS609 Screen Printer DEK 265GS TSSOP YAMAICHI Socket 14 leads cc fuji IC51-0562 socket TSSOP YAMAICHI SOCKET SCBA009A mutual capacitance touch screens 2000
solder paste alpha WS609 Abstract: WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000 MO-193 Text: TVSOP Application Brief August 1996 draft 1.2 SCBA009A List of Revisions Draft 1.00 Draft 1.01 Draft 1.20 Initial Issue Minor formatting changes Rename to Application Brief, change JEDEC registration number references to MO-193 for all TVSOP, update thermal graphs, delete	Original	PDF	SCBA009A MO-193 IC51-0142-2074-MF IC51-0162-2073-MF IC51-0202-2072-MF IC51-0242-2071-MF IC51-0482-2069-MF IC51-0562-2067-MF IC51-0802-2077-MF IC51-1002-2076-MF solder paste alpha WS609 WS609 TSSOP YAMAICHI SOCKET Alpha WS609 Yamaichi Electronics ic51-0142 cc fuji CM92 DELL PWB mutual capacitance touch screens 2000
solder paste alpha WS609 Abstract: WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile Text: Thin Very Small-Outline Package TVSOP SCBA009C March 1997 1 IMPORTANT NOTICE Texas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest	Original	PDF	SCBA009C solder paste alpha WS609 WS609 Alpha WS609 solder cc fuji TSSOP YAMAICHI SOCKET Alpha WS609 dell monitor circuit diagram MO-194 scba009c reflow profile