CY27S03A
Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Text: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability
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CY7C122
CY27S03A
15JC10
CY7C190
cy7c9101
cy7c122 die
VIC068A user guide
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CY7C9101
Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Text: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the
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CY7C2901
Abstract: No abstract text available
Text: ÌB Ìcy p ress • Table 10. Die Sizes of Cypress Devices continued P a rt N um ber Size (mil2) P a rt N um ber Size (mil2) ECL Logic CY 2909A 7968 CY100E301L 14875 CY2910A 21750 CY100E302L 14875 CY2911A 7968 CY100E422 6960 11800 CY100E474 10830 CY7C510
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CY100E301L
CY2910A
CY100E302L
CY2911A
CY100E422
CY100E474
CY7C510
CY100E494
CY7C516
CY10E301L
CY7C2901
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