CSR BC 05 Search Results

LM740

Abstract: BC05MM
Contextual Info: LM740 Bluetooth Multimedia Module Product: LM740 Part No: 740-0411 Datasheet Rev1.0/21-05-12 Class 2 Module with CSR BC05 MM Ext Chip 1 General Description LM LM T T A AVRCP UART A L C CSR B D T PIO T P B M B A DP M A B T F A DP S 2 Features BC MM E HFP H

2450FB15K0008

Abstract: 2450FB15K0008-EB1SMA CSR BC capacitor bc series ic 4001 2450FB15K0008E CSR BC 05
Contextual Info: "High Frequency Ceramic Solutions" 2450 MHz Matched Balun-Filter for CSR BC 04/05 Series Chipset P/N 2450FB15K0008 Page 1 of 3 Detail Specification: 1/14/11 General Specifications Part Number 2450FB15K0008 Frequency Range 2400~2500 MHz 30 min.@1710~1880 MHz

2450FB15K0008

Abstract: johanson antenna
Contextual Info: "High Frequency Ceramic Solutions" 2450 MHz Matched Balun-Filter for CSR BC 04/05/06 Series Chipset Detail Specification: P/N 2450FB15K0008 Page 1 of 3 3/6/2012 General Specifications Part Number 2450FB15K0008 Frequency Range 2400~2500 MHz 45 min.@ 880~960MHz

CSR BC04

Abstract: BC05 CSR CSR BC05 bc04 csr 2450FB15K0003 Bc-04 BC04 BC05
Contextual Info: High Frequency Ceramic Solutions 2.45 GHz, conjugate match for CSR Chipsets BC 04, 05 P/N 2450FB15K0003 Page 1 of 2 Detail Specification: 07/17/09 General Specifications Part Number 2450FB15K0003 Frequency MHz 2400~2500 Unbalanced Impedence 50 Ω Differential Balanced Imp.

CSR BC04

Abstract: CSR BC05 bc04 csr BC05 CSR 2450FB15K0003 Bc-04 BC05 BC04
Contextual Info: High Frequency Ceramic Solutions 2.45 GHz, conjugate match for CSR Chipsets BC 04, 05 P/N 2450FB15K0003 Page 1 of 2 Detail Specification: 07/02/08 General Specifications Part Number 2450FB15K0003 48 min.@ 880~960MHz Frequency MHz 2400~2500 30 min.@1710~1880 MHz

Contextual Info: LM730 Bluetooth Multimedia Module Product: LM730 Part No: 730-0330 Datasheet Rev1.1/15-05-12 Class 2 Module with CSR BC05 MM Ext Chip 1 General Description LM LM T T A AVRCP UART L C CSR B A D T M B A DP P T PIO B M A B T F A DP S 2 Features 4 S S B S MB R HS

MSM66301

Abstract: MSM66301 NX8 OKI nX-8 MSM66201 OLMS-66K RAS66K msm665x 09F0h nX-8 pcfad
Contextual Info: OKI nX-8/500S Core Instruction Manual CMOS 16-bit microcontroller SECOND EDITION ISSUE DATE: JUNE, 1999 NOTICE 1. The information contained herein can change without notice owing to product and/or technical improvements. Please make sure before using the product that the information you are referring to is up-to-date.

PC 1498H

Abstract: 1444H A6779 1484H PAR64 REQ64
Contextual Info: DMA Controller Unit 19 This chapter describes the integrated Direct Memory Access DMA Controller Unit. The operation modes, setup, external interface, and implementation of the DMA Controller are detailed in this chapter. 19.1 Overview The DMA Controller provides low-latency, high-throughput data transfer capability. The DMA

cpu aeroflex

Contextual Info: ACT–F2M32 High Speed 64 Megabit FLASH Multichip Module CIRCUIT TECHNOLOGY Features 4 Low Power 2M x 8 FLASH Die in One MCM Package • Organized as 2M x 32 ■ ● User ■ ■ Industry Standard Pinouts Packaging – Hermetic Ceramic 68 Lead, 1.56" x 1.56" x .140" Low Profile CQFP, Aeroflex

FB2012

Abstract: ACX balun ACX filter ACX band pass ACX Multilayer Chip bluetooth csr BC multilayer GHz
Contextual Info: ACX FB2012 Series Advanced Ceramic X Multilayer Chip Band Pass Filter + Balun Features ™ Monolithic SMD with small, low-profile and light-weight type. Applications ™0.8 ~ 6 GHz wireless communication systems, including DECT/PACS/PHS/GSM/DCS phones, WLAN card, Bluetooth

56-PIN

Abstract: LH28F016LL LH28F016SU camera with iCCD matrix BSR10
Contextual Info: LH28F016LL FEATURES • User-Configurable x8 or x16 Operation • 3 V Write/Erase Operation 3 V VPP – 2.7 - 3.6 V Write-Erase Operation • 120 ns Maximum Access Time (VCC = 3.0 V) • 150 ns Maximum Access Time (VCC = 2.7 V) • • • • 16M (1M x 16, 2M × 8) Flash Memory

MSM66301 NX8

Abstract: 09F0h OLMS66K OLMS-66K D16h MAC66K
Contextual Info: 1 FJXLNX-8-500S-01 OLMS 66K シリーズ nX-8/500S コア インストラクションマニュアル CMOS 16bit マイクロコントローラ 第 2 版 ’00.10 作成 ご注意 1. 本書に記載された内容は製品改善及び技術改良等により将来予告なしに変更することがあります。したがって、

D1553

Abstract: 3100-CC
Contextual Info: SHARP LH28F016LLT 16 MBIT 1 MBIT x 16, 2 MBIT x 8 3V SINGLE VOLTAGE FLASH MEMORY FEATURES • 3V Write/Erase Operation (3V Vpp) - 2.7V-3.6V Write»Erase»Read Operation • User-Configurable x8 or x16 Operation • 120 ns Maximum Access Time (Vcc=3.0V) • 150ns Maxumam Access Time (Vcc=2.7V)

LH28F008SA

Abstract: LH28F016SA
Contextual Info: LH28F016SA 16M 1M x 16/2M × 8 Flash Memory FEATURES DESCRIPTION • User-Selectable 3.3 V or 5 V VCC SHARP’s LH28F016SA 16M Flash Memory is a revolutionary architecture which enables the design of truly mobile, high-performance, personal computing and

tec cf4

Contextual Info: I I I I I I I I I I I I I I I I ACT-F2M32 High Speed 64 Megabit FLASH Multichip Module .i.i.i. i. i.i. i. i. i.i.i.i.i.i.i.i.i.i. i. i. i.i. i. ^EROFLEX Features i 4 Low Power 2M x 8 FLASH Die in One MCM

VMIVME 1129

Abstract: harting 8 pin connector erni 32 pins connector 913.031 harting 48 pin VMIACC-0130 idc 20 pin data ribbon connector 913.031 913-031 ERNI 913.049 vmic 1129
Contextual Info: VMIVME-1129 128-bit High-Voltage Digital Input Board with Built-in-Test and Input Filter • 128 bits of high-voltage digital inputs • 3 ms input noise suppression filter • Each group of eight inputs are jumper-selectable to monitor voltage source or current sinking signals

56-PIN

Abstract: LH28F008SA LH28F016SA
Contextual Info: LH28F016SA FEATURES • • • • • • • 16M 1M x 16, 2M × 8 Flash Memory 56-PIN TSOP TOP VIEW User-Configurable x8 or x16 Operation User-Selectable 3.3 V or 5 V VCC 3/5 1 56 CE1 2 55 WE 70 ns Maximum Access Time NC 3 54 OE 0.43 MB/sec Write Transfer Rate

56-PIN

Abstract: LH28F008SA LH28F016SU
Contextual Info: LH28F016SU FEATURES • • • • • • • 16M 1M x 16, 2M × 8 Flash Memory 56-PIN TSOP TOP VIEW User-Configurable x8 or x16 Operation 3/5 1 56 WP CE1 2 55 WE 70 ns Maximum Access Time NC 3 54 OE 0.32 MB/sec Write Transfer Rate A20 4 53 RY/BY A19

Contextual Info: 16M 1M FEATURES x 16, 2M x 8 Flash Memory 56-PIN TSOP TOP VIEW • User-Configurable x8 or x16 Operation -s 3/5 C 1« 56 □ WP CË, Z 2 55 □ WE • 70 ns Maximum Access Time NCZ 3 54 □ ÔË • 0.32 MB/sec Write Transfer Rate A20 z 4 53 □ RY/BY

56-PIN

Abstract: LH28F008SA LH28F800SU TSOP056-P-1420 LH28F800SUT
Contextual Info: LH28F800SU FEATURES • User-Configurable x8 or x16 Operation • User-Selectable 3.3 V or 5 V VCC • 5 V Write/Erase Operations 5 V VPP – No Requirement for DC/DC Converter to Write/Erase • 70 ns Maximum Access Time • Minimum 2.7 V Read capability

Contextual Info: SHARP November 1995 r FLASH MEMORY LH28F032SUTD-70 SHARP CORPORATION NOTICE • This publication is the proprietary product of Sharp and is copyrighted, with all rights reserved. Under the copy­ right taws, no part of this publication may be reproduced or transmitted in any form or by any means, electronic or

Contextual Info: June 1997 FLASH MEMORY LH28F016SANS-70 Ver. 1.0 SHARP CORPORATION Engineering Department 2 Rash Memory Development Center Tenri Integrated Circuits 1C Group 1 LH28F016SANS-70 16 Mbit (1 Mbit x 16, 2 Mbit x 8) Flash Memory CONTENTS FEATURES PAGE . 2

28F008SA

Abstract: 28F016SA DD28F032SA 29042
Contextual Info: DD28F032SA 32-MBIT 2 MBIT X 16 4 MBIT X 8 FlashFile TM MEMORY Y Y Y Y Y Y Y User-Selectable 3 3V or 5V VCC User-Configurable x8 or x16 Operation 70 ns Maximum Access Time 28 6 MB sec Burst Write Transfer Rate 1 Million Typical Erase Cycles per Block 56-Lead 1 2 x 14 x 20 mm Advanced

Contextual Info: SHARP J a n .1998 FLASH MEMORYÌ LH28F016SANS-70 Ver.1.1 V_ J SHARP CORPORATION Flash Memory Engineering Department 2 Memory Engineering Center Tenri Integrated C irc u its Development 1C Group SHARP L HF 1 6 S Z B 1 LH28F016SANS-70 16 Mbit (1 Mbit x 16, 2 Mbit x 8)