F2M32 Search Results

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Contextual Info: I I I I I I I I I I I I I I I I ACT-F2M32 High Speed 64 Megabit FLASH Multichip Module .i.i.i. i. i.i. i. i. i.i.i.i.i.i.i.i.i.i. i. i. i.i. i. ^EROFLEX Features i 4 Low Power 2M x 8 FLASH Die in One MCM

Contextual Info: ACT-F2M32A High Speed 64 Mei ib it M i l l Sector Erase I I I FLASH Multichip Module Q ero flex CIRCUIT TECHNOLOGY www.aeroflex.com/act1 .htm Features • 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package ■ Overall Configuration is 2M x 32 ■ +5V Power Supply / +5V Programing Operation

Contextual Info: m i >A_ym -AC?T- V S x x ê m Me i l bitr l y 1 cpip Mjoiu -4M Preliminary ÜEROFLEX Cl RCUIT TECHNOLOGY www.aeroflex.com/act1 .htm Features • 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One MCM Package ■ Overall Configuration is 2M x 32 ■ Ready/Busy output RY/BY - Hardware method for

WF1M32-XXX

Contextual Info: VZÀ F2M32-XXX M/HITE /V IICROELECTRONICS 2M x3212V FLASH MODULE PRELIMINARY * FEATURES • Access Tim es of 9 0 ,1 0 0 ,1 2 0 nS ■ 12 Volt Programming. 5V ±10% Supply. ■ Packaging: ■ Low Power CMOS, 8mA Standby Typical • 66-pin, PGA Type, 1.385 inch square, Herm etic Ceramic

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Abstract: CQFP 240 Aeroflex WW-S700 ACT-F2M32A AMD2M CQFP
Contextual Info: F LASH Multichip Module ÛEROFLEX CIRCUIT TECHNOLOGY www.aeroflex.com/act1 .htm Ready/Busy output RY/BY - Hardware method for • 4 Low Voltage/Power AMD 2M x 8 FLASH Die In One detection of program or erase cycle completion MCM Package Hardware RESET pin - Resets Internal state machine

cpu aeroflex

Contextual Info: ACT–F2M32 High Speed 64 Megabit FLASH Multichip Module CIRCUIT TECHNOLOGY Features 4 Low Power 2M x 8 FLASH Die in One MCM Package • Organized as 2M x 32 ■ ● User ■ ■ Industry Standard Pinouts Packaging – Hermetic Ceramic 68 Lead, 1.56" x 1.56" x .140" Low Profile CQFP, Aeroflex

ACT-F2M32A

Abstract: CQFP 240 Aeroflex
Contextual Info: ACT–F2M32A High Speed 64 Megabit Sector Erase FLASH Multichip Module CIRCUIT TECHNOLOGY Features www.aeroflex.com/act1.htm • 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One ■ Ready/Busy output RY/BY – Hardware method for MCM Package ■ Overall Configuration is 2M x 32

WF1M32-XXX

Contextual Info: a IM ITE /MICROELECTRONICS ™Î!on?6m A B lock Erase o p eratio n erases one of th e 32 blocks, w h ic h is PRINCIPLES OF OPERATION about 65% im provem ent over th e W F1M 32-XXX. The fo llo w in g P rinciples of O peration of th e W F2M 32-XX X Each b lo ck can be w ritte n and erased a m inim um of 100,000

ACT-F2M32

Contextual Info: ACT–F2M32A High Speed 64 Megabit Sector Erase FLASH Multichip Module Preliminary CIRCUIT TECHNOLOGY Features www.aeroflex.com/act1.htm • 4 Low Voltage/Power AMD 2M x 8 FLASH Die in One ■ Ready/Busy output RY/BY – Hardware method for MCM Package ■ Overall Configuration is 2M x 32