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    CPG132 Price and Stock

    AMD XC2C128-7CPG132C

    IC CPLD 128MC 7NS 132CSPBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2C128-7CPG132C Tray 41,281 1
    • 1 $25.94
    • 10 $25.94
    • 100 $25.94
    • 1000 $25.94
    • 10000 $25.94
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    AMD XC2C256-7CPG132C

    IC CPLD 256MC 6.7NS 132CSPBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2C256-7CPG132C Tray 2,828 1
    • 1 $55.2
    • 10 $55.2
    • 100 $55.2
    • 1000 $55.2
    • 10000 $55.2
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    AMD XC3S500E-4CPG132C

    IC FPGA 92 I/O 132CSBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC3S500E-4CPG132C Tray 2,779 1
    • 1 $66.7
    • 10 $66.7
    • 100 $66.7
    • 1000 $66.7
    • 10000 $66.7
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    AMD XC2C128-7CPG132I

    IC CPLD 128MC 7NS 132CSPBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2C128-7CPG132I Tray 1,098 1
    • 1 $28.69
    • 10 $28.69
    • 100 $28.69
    • 1000 $28.69
    • 10000 $28.69
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    AMD XC2C256-7CPG132I

    IC CPLD 256MC 6.7NS 132CSPBGA
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey XC2C256-7CPG132I Tray 474 1
    • 1 $66.24
    • 10 $66.24
    • 100 $66.24
    • 1000 $66.24
    • 10000 $66.24
    		Buy Now
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    CPG132 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    CPG132

    Abstract: CP132 132-ball CP132/CPG132
    Text: R Chip Scale BGA CP132/CPG132 Package PK373 (v1.3) June 25, 2008 132-BALL CHIP SCALE BGA 0.50mm PITCH (CP132/CPG132) 2004-2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.


    Original     		PDF CP132/CPG132) PK373 132-BALL maCPG132) CPG132 CP132 CP132/CPG132

    PK494

    Abstract: No abstract text available
    Text: 100% Material Declaration Data Sheet for Spartan -3/-3E CPG132 Cu Wire PK494 (v1.1) March 19, 2012 Average Weight: 0.1190 g Component Silicon Die (FPGA) Die Attach Adhesive Substance Description Silicon (Si) CAS Number or Description 7440-21-3 Percentage of


    Original     		PDF CPG132 PK494 00046linx PK494

    SPARTAN-3 XC3S400 PQ208

    Abstract: SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XC3S4000FG676 XILINX SPARTAN VQG100
    Text: 06 Spartan-3 FPGA Family: Introduction and Ordering Information R DS099-1 v1.4 January 17, 2005 Preliminary Product Specification Introduction - The Spartan -3 family of Field-Programmable Gate Arrays is specifically designed to meet the needs of high volume,


    Original     		PDF DS099-1 XC3S50CP132, XC3S2000FG456, XC3S4000FG676 DS099-1, DS099-2, DS099-3, DS099-4, DS313, DS314-1, SPARTAN-3 XC3S400 PQ208 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 tq144 SPARTAN-3 XC3S400 Spartan-3 FPGA Family XC3S4000-FG676 SPARTAN-3 XC3S400 pin SPARTAN-3 XC3S400 architecture XILINX SPARTAN VQG100

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga

    xc3s500e fg320

    Abstract: intel strataflash j3d SPARTAN 3E STARTER BOARD transistor tt 2222 pin configuration 500K variable resistor eeprom programmer schematic winbond AT45DB AT49 jtag cable Schematic XC3S500E spartan 3a
    Text: Spartan-3E FPGA Family: Complete Data Sheet R DS312 April 18, 2008 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312-1 v3.7 April 18, 2008 DS312-3 (v3.7) April 18, 2008 • • • •


    Original     		PDF DS312 DS312-1 DS312-3 DS312-2 XC3S500E VQG100 DS312-4 xc3s500e fg320 intel strataflash j3d SPARTAN 3E STARTER BOARD transistor tt 2222 pin configuration 500K variable resistor eeprom programmer schematic winbond AT45DB AT49 jtag cable Schematic spartan 3a

    spartan MultiBoot trigger

    Abstract: XA3S250E XA3S500E RPT081 3s250e FGG400 AEC-Q100 DSA00434924 BLVDS-25
    Text: 36 XA Spartan-3E Automotive FPGA Family Data Sheet R DS635 v1.0 August 31, 2007 Product Specification Summary The XA Spartan -3E family of Field-Programmable Gate Arrays (FPGAs) is specifically designed to meet the needs of high-volume, cost-sensitive automotive electronics applications. The five-member family offers densities ranging


    Original     		PDF DS635 AEC-Q100 spartan MultiBoot trigger XA3S250E XA3S500E RPT081 3s250e FGG400 DSA00434924 BLVDS-25

    LVCMOS15

    Abstract: LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C128 Xilinx XC2C128-7VQ100C
    Text: R DS093 v2.9 June 28, 2005 XC2C128 CoolRunner-II CPLD Product Specification Features Description • The CoolRunner-II 128-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF DS093 XC2C128 128-macrocell LVCMOS15 LVCMOS25 LVCMOS33 XAPP399 XAPP427 Xilinx XC2C128-7VQ100C

    xc3s500e vq100

    Abstract: No abstract text available
    Text: 1 Spartan-3E FPGA Family Data Sheet DS312 July 19, 2013 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312 v4.1 July 19, 2013 DS312 (v4.1) July 19, 2013 • Introduction • • Features


    Original     		PDF DS312 DS312 xc3s500e vq100

    XC2C128-7CPG132I

    Abstract: No abstract text available
    Text: R DS093 v2.6 January 30, 2005 XC2C128 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 128-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF DS093 XC2C128 128-macrocell multi2C128 XC2C128-7CPG132I

    vhdl code of floating point adder

    Abstract: 11F32 AEC-Q100 LVCMOS15 LVCMOS25 LVCMOS33 XA2C128 XAPP427 XAPP399
    Text: XA2C128 CoolRunner-II Automotive CPLD R DS554 v1.1 May 5, 2007 Features • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade • Guaranteed to meet full electrical specifications over TA = -40° C to +105° C with TJ Maximum = +125° C


    Original     		PDF XA2C128 DS554 AEC-Q100 100-pin 132-ball XAPP399: vhdl code of floating point adder 11F32 LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XAPP399

    XC2C128

    Abstract: XC2C128-7VQG100I LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C128-7CPG132I part marking 499A3
    Text: R DS093 v2.4 July 30, 2004 XC2C128 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 128-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF DS093 XC2C128 128-macrocell XC2C128-7VQG100I LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C128-7CPG132I part marking 499A3

    XC2C256 vq100

    Abstract: TQG144
    Text: XC2C256 CoolRunner-II CPLD R DS094 v2.9 March 20, 2006 Product Specification Features Description • The CoolRunner -II 256-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF XC2C256 DS094 100-pin 144-pin 132-ball 208-pin 256-ball XC2C256-7TQ144. TIN25, OUT25, XC2C256 vq100 TQG144

    xc3s1200e fg320

    Abstract: XC3S250E vqg100 SST25LFxxxA xc3s100 LVCMOS12 XC3S500E-FT256 Macronix Lot Identifier XC3S1200E-FG320 IPL34 MX25Lxxxx
    Text: Spartan-3E FPGA Family: Complete Data Sheet R DS312 November 23, 2005 Advance Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312-1 v2.0 November 23, 2005 8 pages DS312-3 (v2.0) November 23, 2005


    Original     		PDF DS312 DS312-1 DS312-3 DS312-2 FG400 DS312-1, DS312-2, DS312-3, DS312-4, DS312-4 xc3s1200e fg320 XC3S250E vqg100 SST25LFxxxA xc3s100 LVCMOS12 XC3S500E-FT256 Macronix Lot Identifier XC3S1200E-FG320 IPL34 MX25Lxxxx

    XC3S100E TQG144

    Abstract: XC3S500E FGG320 FR 309 diode
    Text: Spartan-3E FPGA Family: Complete Data Sheet R DS312 May 19, 2006 Preliminary Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312-1 v3.0 March 22, 2006 DS312-3 (v3.2) May 19, 2006 • •


    Original     		PDF DS312 DS312-1 DS312-3 DS312-2 XC3S100E CP132 XC3S1600E FG320 XC3S100E TQG144 XC3S500E FGG320 FR 309 diode

    XC2C256-7VQG100C

    Abstract: No abstract text available
    Text: R DS094 v2.8 June 28, 2005 XC2C256 CoolRunner-II CPLD Product Specification Features Description • The CoolRunner -II 256-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF XC2C256 DS094 100-pin 144-pin 132-ball 208-pin 256-ball XC2C256-7TQ144. TIN25, OUT25, XC2C256-7VQG100C

    xc3s500e fg320

    Abstract: xc3s500e VQG100 XC3S500E FGG320 NUMONYX xilinx bpi intel j3d XC3S250E M25PXX xc3s1600e fg320 XC3S500E DS312-3
    Text: Spartan-3E FPGA Family: Data Sheet R DS312 v3.8 August 26, 2009 Product Specification Module 1: Spartan-3E FPGA Family: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312-1 (v3.8) August 26, 2009 • • • • • •


    Original     		PDF DS312 DS312-1 DS312-3 DS312-2 XC3S500E XC3S1600E VQG100 DS312-4 xc3s500e fg320 xc3s500e VQG100 XC3S500E FGG320 NUMONYX xilinx bpi intel j3d XC3S250E M25PXX xc3s1600e fg320 DS312-3

    Untitled

    Abstract: No abstract text available
    Text: R DS093 v2.8 April 21, 2005 XC2C128 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 128-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF DS093 XC2C128 128-macrocell

    ug230

    Abstract: xc3s500e fg320 intel strataflash j3d xc3s1200e fg320 M25PXX XAPP485 XC3S500E XC3S250E-PQ208 XC3S500E FGG320 matrix tv m21 service mode manual
    Text: Spartan-3E FPGA Family: Complete Data Sheet R DS312 May 29, 2007 Product Specification Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics DS312-1 v3.4 November 9, 2006 DS312-3 (v3.6) May 29, 2007 • • • • •


    Original     		PDF DS312 DS312-1 DS312-3 DS312-2 XC3S100E CP132 XC3S500E XC3S1600E DS312-4 ug230 xc3s500e fg320 intel strataflash j3d xc3s1200e fg320 M25PXX XAPP485 XC3S250E-PQ208 XC3S500E FGG320 matrix tv m21 service mode manual

    xc2c64a vqg44

    Abstract: xc2c32a vqg44 XC2C32A qfg48 COOLRUNNER-II examples VQG44 interfacing 8051 XC9500 XAPP784 XC2C256 XC2C64A
    Text: R DS090 v2.7 July 24, 2006 CoolRunner-II CPLD Family Product Specification Features • • • - Optimized for 1.8V systems - Industry’s fastest low power CPLD - Densities from 32 to 512 macrocells Industry’s best 0.18 micron CMOS CPLD - Optimized architecture for effective logic synthesis


    Original     		PDF DS090 IEEE1149 XC2C128. xc2c64a vqg44 xc2c32a vqg44 XC2C32A qfg48 COOLRUNNER-II examples VQG44 interfacing 8051 XC9500 XAPP784 XC2C256 XC2C64A

    xc2c256-7cpg132i

    Abstract: XC2C256 LVCMOS15 LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C256-7FTG256I xc256 XC2C256-7VQ100C
    Text: R DS094 v2.7 March 7, 2005 XC2C256 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner -II 256-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF DS094 XC2C256 256-macrocell XC2C256-7TQ144. xc2c256-7cpg132i LVCMOS15 LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C256-7FTG256I xc256 XC2C256-7VQ100C

    XC3S400 PQ208

    Abstract: socket 1156 pinout TQG144 XC3S200 TQ144 xc3s400fg456 XC3S1000-FG676 XC3S5000-FG676 SPARTAN-3 XC3S400 tq144 XC3S200 PQ208 pin diagram Socket 1156 VID pinout
    Text: Spartan-3 FPGA Family: Complete Data Sheet R DS099 November 30, 2007 Product Specification This document includes all four modules of the Spartan -3 FPGA data sheet. Module 1: Introduction and Ordering Information Module 3: DC and Switching Characteristics


    Original     		PDF DS099 DS099-1 DS099-3 DS099-2 XC3S1500 FG676. XC3S5000 DS099-4 XC3S400 PQ208 socket 1156 pinout TQG144 XC3S200 TQ144 xc3s400fg456 XC3S1000-FG676 XC3S5000-FG676 SPARTAN-3 XC3S400 tq144 XC3S200 PQ208 pin diagram Socket 1156 VID pinout

    Virtex-6 reflow

    Abstract: WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320
    Text: Device Reliability Report First Quarter 2010 UG116 v5.9 May 4, 2010 Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, p∅ost, or transmit the


    Original     		PDF UG116 611GU FGG676 FFG1152 Virtex-6 reflow WS609 xc3s3400a xcv400e-b UG116 XCS20XL pqg208 UG-116 XC1702L XCE4VSX25 xc3s500e fg320

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		PDF UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G

    XC2C256

    Abstract: LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C256-7VQ100I XC2C256-6VQG100C xc2c256-7vqg100c xc2c256-7cpg132c 1117H-3
    Text: R DS094 v2.4 August 3, 2004 XC2C256 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner -II 256-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		PDF DS094 XC2C256 256-macrocell XC2C256-7TQ144. LVCMOS25 LVCMOS33 XAPP399 XAPP427 XC2C256-7VQ100I XC2C256-6VQG100C xc2c256-7vqg100c xc2c256-7cpg132c 1117H-3