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    94V0 V03

    Abstract: No abstract text available
    Text: Shrouded headers CID07 4x15 - .100" Grid Features: • • • • • • • • • .100" 2.54 mm grid - 4 rows 60 straight shrouded pins selectively plated gold contact Ni underplate suitable for no-clean operation Sn/Pb plated contact leads for solderability


    Original
    PDF CID07 B10003) CA510 E10008 V03-1173 F0000013 A0784789 94V0 V03

    Untitled

    Abstract: No abstract text available
    Text: Shrouded headers CID07 4x15 - .100" Grid Features: • • • • • • • • • .100" 2.54 mm grid - 4 rows 60 straight shrouded pins selectively plated gold contact Ni underplate suitable for no-clean operation Sn/Pb plated contact leads for solderability


    Original
    PDF CID07 B10003) CA510 E10008 V03-1173 F0000013 A0784789

    Untitled

    Abstract: No abstract text available
    Text: Straight headers 2 rows, solder tails - .100" Grid Features: • • • • • • • .100" 2.54 mm grid - 2 rows straight unshrouded .025" [.64mm] square pins stackable in both directions: end to end and side to side selectively plated gold contact area


    Original
    PDF CBR30 CBR34 CTP22 CID07 A10030-31) A10034) A10001-09) B10001-02) E10001 A0641267

    1850R

    Abstract: dh 1117 U514 0QQ011
    Text: • H Enhanced Memory Systems Inc. Features ciD07S47 DDDG11G 21b DM2M36SJ/DM2M32SJ 2Mbx36/2Mbx32Enhanced DRAMSIMM Product Specification Architecture The DM2M36SJ achieves 2Mb x 36 density by mounting 18 1Mb x 4 EDRAMs, packaged in 28-pin plastic SOJ packages, on both sides


    OCR Scan
    PDF iD07S47 DDDG11G DM2M36SJ/DM2M32SJ 2Mbx36/2Mbx32Enhanced DM2202J-XX, DM2212J-XX, DM2M32SJ) DM2M36SJ 1850R dh 1117 U514 0QQ011