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    ITT Interconnect Solutions CAB GASKET FRONT MOUNT # 20 ALUFL

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    Avnet Abacus CAB GASKET FRONT MOUNT # 20 ALUFL 15 Weeks 200
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    ITT Interconnect Solutions CAB GASKET FRONT MOUNT # 32

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    ITT Interconnect Solutions CAB GASKET FRONT MOUNT#10SL ALUFL

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    Avnet Abacus CAB GASKET FRONT MOUNT#10SL ALUFL 9 Weeks 200
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    ITT Interconnect Solutions CAB GASKET FRONT MOUNT # 32 ALUFL

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    ITT Interconnect Solutions CAB GASKET REAR MOUNT #14S ALUFL

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    CABGA Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    CABGA Amkor Technology ChipArray Packages Original PDF

    CABGA Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PM8354 QuadPHY 1G Preliminary 4-channel 1.0-1.25 Gbit/s Transceiver 25 :3 06 for the QuadPHY 1G. 03 PHYSICAL 20 • Ultra-low power operation using 0.18 µ CMOS technology. y, • Thermally enhanced, 289-pin, 19 mm x 19 mm CABGA package. • • • eb temperature range -40 to +85 °C and is


    Original     		PM8354 8B/10B PMC-2020026 PDF

    pal22v10h

    Abstract: MM74HC245AWM 96F8740 PCC473BCTND MC68340 PM4314 PM4388 PM6344 PM7364 PM7375
    Text: PM4388 TOCTL PRELIMINARY INFORMATION REFERENCE DESIGN PMC-980942 ISSUE 1 CABGA TOCTL WITH FREEDM-32 REFERENCE DESIGN PM4388 CABGA TOCTL WITH FREEDM-32 REFERENCE DESIGN PRELIMINARY INFORMATION ISSUE 1: SEPT 1998 PROPRIETARY AND CONFIDENTIAL TO PMC-SIERRA, INC., AND FOR ITS CUSTOMERS’ INTERNAL USE


    Original     		PM4388 PMC-980942 FREEDM-32 PM4388 FREEDM-32 pal22v10h MM74HC245AWM 96F8740 PCC473BCTND MC68340 PM4314 PM6344 PM7364 PM7375 PDF

    GR-253-CORE

    Abstract: ZL30119 ZL30119GGG ZL30119GGG2 "network interface cards"
    Text: ZL30119 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet December 2005 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30119GGG 100 Pin CABGA Trays ZL30119GGG2 100 Pin CABGA*


    Original     		ZL30119 ZL30119GGG ZL30119GGG2 -40oC GR-253-CORE ZL30119 ZL30119GGG "network interface cards" PDF

    ZL30123

    Abstract: GR-253-CORE STM-16 ZL30123GGG ZL30123GGG2 "network interface cards"
    Text: ZL30123 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet May 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30123GGG 100 Pin CABGA Trays ZL30123GGG2 100 Pin CABGA*


    Original     		ZL30123 ZL30123GGG ZL30123GGG2 -40oC GR-253-CORE ZL30123 STM-16 ZL30123GGG "network interface cards" PDF

    TQ32

    Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
    Text: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*


    Original     		Jul-00 Oct-00 Jan-01 Apr-01 Jul-01 Oct-01 10X10, TQ32 ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6 PDF

    E679

    Abstract: Amkor CSP mold compound chiparray amkor MO-192 Amkor mold compound Amkor Wafer level mold compound amkor polyimide
    Text: LAMINATE data sheet Stacked CSP Features: Stacked CSP SCSP : The Stacked CSP (SCSP) family leverages Amkor's industry leading ChipArray Ball Grid Array (CABGA) manufacturing capabilities. This broad high volume infrastructure enables the rapid deployment of advances in die stacking


    Original     		PDF

    "network interface cards"

    Abstract: No abstract text available
    Text: ZL30119 SONET/SDH OC-48/OC-192 Line Card Synchronizer Data Sheet June 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30119GGG 100 Pin CABGA Trays ZL30119GGG2 100 Pin CABGA*


    Original     		ZL30119 OC-48/OC-192 ZL30119GGG ZL30119GGG2 -40oC "network interface cards" PDF

    PEAK tray drawing

    Abstract: 12C-1313-119 daewon 89HPES4T4ZBBCGI TRAY MPPO DAEWON tray drawing PBGA144 daewon tray 72T1 PBGA-144
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: TB0908-03 DATE: 9/16/2009 Product Affected: 13 mm x 13 mm PBGA-144 & 13 mm x 13 mm CABGA-144 Date Effective: Contact: Title: Phone #:


    Original     		TB0908-03 PBGA-144 CABGA-144 72V36110L7-5BB 72V36110L7-5BBG 72V36110L7-5BBGI 72V36110L7-5BBI 72V3640L6BB 72V3640L6BBG 72V3640L7-5BB PEAK tray drawing 12C-1313-119 daewon 89HPES4T4ZBBCGI TRAY MPPO DAEWON tray drawing PBGA144 daewon tray 72T1 PBGA-144 PDF

    GR-253-CORE

    Abstract: ZL30117 ZL30117GGG ZL30117GGG2 "network interface cards"
    Text: ZL30117 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet February 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30117GGG 64 Pin CABGA Trays ZL30117GGG2 64 Pin CABGA*


    Original     		ZL30117 ZL30117GGG ZL30117GGG2 -40oC GR-253-CORE ZL30117 ZL30117GGG "network interface cards" PDF

    Untitled

    Abstract: No abstract text available
    Text: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a


    Original     		DS550R PDF

    ge100lfcsv

    Abstract: GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG
    Text: Integrated Device Technology, Inc. 6024 Silver Creek Valley Road, San Jose, CA - 95138 PRODUCT/PROCESS CHANGE NOTICE PCN PCN #: A1008-03 Product Affected: DATE: September 10, 2010 MEANS OF DISTINGUISHING CHANGED DEVICES: 19mm x 19mm CABGA-324 (Standard & Green)


    Original     		A1008-03 CABGA-324 89HPES12N3A2ZCBCI8 89HPES12N3AZCBC 89HPES12N3AZCBCG 89HPES12N3AZCBCI 89HPES12N3AZGBC 89HPES12N3AZGBCG 89HPES12N3AZGBCGI 89HPES12N3AZGBCI ge100lfcsv GE100LFCS SPIL mold compound aus308 GE-100LFCS-V HL832NX Ablestik 89HPES12N3AZGBCGI AUS-308 89HPES10T4G2ZBBCG PDF

    vFBGA* 96 bALL

    Abstract: Amkor Wafer level mold compound amkor cabga thermal resistance BGA 256 PACKAGE thermal resistance Amkor Technology CABGA CTBGA MO-195 BGA PACKAGE thermal resistance amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: ChipArray® BGA CABGA / LFBGA Thin ChipArray® BGA (CTBGA / TFBGA) Very Thin ChipArray® BGA (CVBGA / VFBGA) Amkor’s ChipArray® packages are laminatebased Ball Grid Array (BGA) packages that are


    Original     		PDF

    ARM940T

    Abstract: router CX24611 CX82100 usb ethernet single chip switch
    Text: personal computing products Home Network Processor HNP CX82100 Conexant’s CX82100 home network processor (HNP) is a single-chip, high-performance, ARM940T-based processor integrated with multiple network interface hardware functions and packaged in a 196-pin CABGA. This 158 MIPs processor


    Original     		CX82100 CX82100 ARM940T-based 196-pin ARM940T 144-MHz 100MHz router CX24611 usb ethernet single chip switch PDF

    Untitled

    Abstract: No abstract text available
    Text: ZL30347 IEEE 1588-2008 Synchronization PLL Short-Form Data Sheet June 2012 Features • • • • Ordering Information Frequency, Phase and Time Synchronization over IP, MPLS and Ethernet Packet Networks ZL30347GGG 100 Pin CABGA ZL30347GGG2 100 Pin CABGA*


    Original     		ZL30347 PDF

    ZL30117

    Abstract: ZL30117GGG ZL30117GGG2 GR-253-CORE "network interface cards"
    Text: ZL30117 SONET/SDH OC-48/OC-192 Line Card Synchronizer Data Sheet June 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30117GGG 64 Pin CABGA Trays ZL30117GGG2 64 Pin CABGA*


    Original     		ZL30117 OC-48/OC-192 ZL30117GGG ZL30117GGG2 -40oC GR-253-CORE ZL30117 ZL30117GGG "network interface cards" PDF

    GR-1244-CORE

    Abstract: ZL30120 ZL30120GGG ZL30120GGG2 "network interface cards"
    Text: ZL30120 SONET/SDH/Ethernet Multi-Rate Line Card Synchronizer Data Sheet May 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30120GGG 100 Pin CABGA Trays ZL30120GGG2 100 Pin CABGA* Trays


    Original     		ZL30120 ZL30120GGG ZL30120GGG2 -40oC GR-1244-CORE, GR-253CORE, GR-1244-CORE ZL30120 ZL30120GGG "network interface cards" PDF

    CABGA 6x6

    Abstract: CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56
    Text: CABGA Color.FRM Page 1 Tuesday, February 9, 1999 3:58 PM CABGA Packaging Capabilities Surface Mount Description 11 mm square in 1mm increments. Ball pitches are 0.5 to 1.0 mm. Rectangular packages are also available in a variety of package sizes. The maximum mounted height is


    Original     		GA98111PDF2/99 CABGA 6x6 CABGA CABGA 8X8 bga 6x8 BGA Package 14x14 CABGA 48 7x7 CABGA 56 PDF

    ZL30107GGG2

    Abstract: ZL30107 ZL30107GGG
    Text: ZL30107 GbE Line Card Synchronizer Shortform Data Sheet March 2007 A full Data Sheet is available to qualified customers. To register, please send an email to TimingandSync@zarlink.com. Ordering Information ZL30107GGG 64 Pin CABGA Trays ZL30107GGG2 64 Pin CABGA*


    Original     		ZL30107 ZL30107GGG ZL30107GGG2 -40oC ZL30107 ZL30107GGG PDF

    ZL30122GGG

    Abstract: GR-253-CORE STM-16 ZL30122 ZL30122GGG2 phase failure "network interface cards"
    Text: ZL30122 SONET/SDH Low Jitter Line Card Synchronizer Data Sheet May 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30122GGG 64 Pin CABGA Trays ZL30122GGG2 64 Pin CABGA*


    Original     		ZL30122 ZL30122GGG ZL30122GGG2 -40oC GR-253-CORE ZL30122GGG STM-16 ZL30122 phase failure "network interface cards" PDF

    Untitled

    Abstract: No abstract text available
    Text: ZL30116 SONET/SDH OC-48/OC-192 System Synchronizer Data Sheet June 2006 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30116GGG ZL30116GGG2 Features • 100 Pin CABGA


    Original     		ZL30116 OC-48/OC-192 ZL30116GGG ZL30116GGG2 GR-253 GR-1244 OC-192/STM-64 PDF

    GR-1244

    Abstract: GR-253 ZL30106 ZL30116 ZL30117 ZL30119
    Text: ZL30116 SONET/SDH OC-48/OC-192 System Synchronizer Data Sheet June 2008 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30116GGGV2 100 Pin CABGA ZL30116GGG2V2100 Pin CABGA*


    Original     		ZL30116 OC-48/OC-192 ZL30116GGGV2 ZL30116GGG2V2100 -40oC GR-253 GR-1244 OC-192/STM-64 ZL30106 ZL30116 ZL30117 ZL30119 PDF

    GR-1244

    Abstract: GR-253 ZL30106 ZL30116 ZL30116GGG ZL30116GGG2 ZL30117 ZL30119 wand
    Text: ZL30116 SONET/SDH Low Jitter System Synchronizer Data Sheet December 2005 A full Design Manual is available to qualified customers. To register, please send an email to TimingandSync@Zarlink.com. Ordering Information ZL30116GGG 100 Pin CABGA Trays ZL30116GGG2 100 Pin CABGA* Trays


    Original     		ZL30116 ZL30116GGG ZL30116GGG2 GR-253 GR-1244 OC-48/STM-16 ZL30106 ZL30116 ZL30116GGG ZL30117 ZL30119 wand PDF

    DS7409HGB

    Abstract: DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G
    Text: Data Sheet LAMINATE FlipStack CSP Features FlipStack® CSP The FlipStack CSP family utilizes Amkor's industry leading ChipArray® Ball Grid Array CABGA manufacturing capabilities, in combination with Amkor's fcCSP technology. This broad high volume infrastructure enables the rapid deployment of


    Original     		DS820C DS7409HGB DS7409HG FCCSP DS-7409HG HL832 nx-a HL832 E700G PDF

    amkor CABGA 56

    Abstract: chiparray amkor CABGA 8X8 CTBGA CABGA 17 x 17 thermal resistance CABGA CVBGA MO-195 8x8 64 footprint amkor cabga
    Text: LAMINATE data sheet CABGA/CTBGA/CVBGA Features: ChipArray Packages: Amkor’s ChipArray® packages are laminatebased Ball Grid Array BGA packages that are compatible with established SMT mounting processes. The near-chip-size standard outlines offer a broad selection of ball array pitch, count,


    Original     		PDF