A0220 Search Results

A0220 Result Highlights (2)

Part	ECAD Model	Manufacturer	Description	Download	Buy
TPS7A0220PDQNR		Texas Instruments	200mA, nanopower-IQ (25 nA), low-dropout (LDO) voltage regulator with enable 4-X2SON -40 to 125
TPS7A0220PDBVR		Texas Instruments	200mA, nanopower-IQ (25 nA), low-dropout (LDO) voltage regulator with enable 5-SOT-23 -40 to 125

A0220 Price and Stock

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Texas Instruments TPS7A0220PDQNR IC REG LINEAR 2V 200MA 4X2SON
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	TPS7A0220PDQNR	Digi-Reel	3,071		1	1 $0.69 10 $0.491 100 $0.3853 1000 $0.32999 10000 $0.32999	Buy Now
	TPS7A0220PDQNR	Cut Tape	3,071		1	1 $0.69 10 $0.491 100 $0.3853 1000 $0.32999 10000 $0.32999	Buy Now
	TPS7A0220PDQNR	Reel	3,000		3,000	1 - 10 - 100 - 1000 - 10000 $0.31384	Buy Now
Mouser Electronics	TPS7A0220PDQNR		1,676			1 $0.69 10 $0.441 100 $0.359 1000 $0.33 10000 $0.295	Buy Now
Ameya Holding Limited	TPS7A0220PDQNR		43,286			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Texas Instruments TPS7A0220PDBVR IC REG LINEAR 2V 200MA SOT23-5
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	TPS7A0220PDBVR	Digi-Reel	991		1	1 $1.3 10 $0.946 100 $0.7588 1000 $0.66056 10000 $0.66056	Buy Now
	TPS7A0220PDBVR	Cut Tape	991		1	1 $1.3 10 $0.946 100 $0.7588 1000 $0.66056 10000 $0.66056	Buy Now
Mouser Electronics	TPS7A0220PDBVR		1,905			1 $0.94 10 $0.831 100 $0.674 1000 $0.674 10000 $0.273	Buy Now
Ameya Holding Limited	TPS7A0220PDBVR		117,604			1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc DSC6001HE2A-022.0000 MEMS OSC XO 22.0000MHZ CMOS SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DSC6001HE2A-022.0000	Bag	793		1	1 $1.04 10 $1.04 100 $1.04 1000 $1.04 10000 $1.04	Buy Now
Bristol Electronics	DSC6001HE2A-022.0000		700			1 - 10 - 100 - 1000 - 10000 -	Get Quote
NAC	DSC6001HE2A-022.0000	Bag			1	1 - 10 - 100 - 1000 - 10000 -	Get Quote
Microchip Technology Inc DSC6001HI2A-022.0000 MEMS OSC XO 22.0000MHZ CMOS SMD
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	DSC6001HI2A-022.0000	Bag	775		1	1 $1.3 10 $1.3 100 $1.3 1000 $1.3 10000 $1.3	Buy Now
NAC	DSC6001HI2A-022.0000	Bag			300	1 $1.29 10 $1.29 100 $1.17 1000 $1.05 10000 $1.05	Buy Now
Master Electronics	DSC6001HI2A-022.0000					1 - 10 - 100 - 1000 $0.96 10000 $0.96	Buy Now
Vishay Sfernice RCMA0220001FEA20 SFERNICE FIXED RESISTORS
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	RCMA0220001FEA20	Cut Tape	500		1	1 $35.35 10 $22.572 100 $17.9512 1000 $17.9512 10000 $17.9512	Buy Now
	RCMA0220001FEA20	Ammo Pack	500		500	1 - 10 - 100 - 1000 $17.95124 10000 $17.95124	Buy Now

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A0220 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Protection Relays & Controls ARC Detectors A0220 Description Arc Detecting Point Sensor The A0220 Arc Detector is a photo electric sensor. It has a sensitive area of 180˚. Sensor signal is a mA current signal of 0.5 mA / klux. The sensor includes 10 m of shielded	Original	PDF	A0220 A0220 D0100, D0900, D0910, D0920, D1000 PGR-8800
VN10K Abstract: No abstract text available Text: VN10K Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN10K 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain Al/Cu/Si	Original	PDF	VN10K VN10K A022009
2N7000 Abstract: No abstract text available Text: 2N7000 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7000 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	2N7000 2N7000 A022009
TN2124 Abstract: No abstract text available Text: TN2124 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2124 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	TN2124 TN2124 A022009
Untitled Abstract: No abstract text available Text: bulgin a brand of Elektron Technology Mains Filters Designed to reduce conducted mains borne EMI, this extensive range provides many solutions to EMI problems. To meet individual design requirements the filters are available with two attenuation options –	Original	PDF	136-137ith PX0587, PX0587/SE, PX0588 PS25/Axx20/xx00 PS26/Axx20/xxxx PS25/A0220/xx
A0100 Abstract: No abstract text available Text: 65 & 100 Amp Filter Connector Female Power Connector ACARA ORDERING INFORMATION Crimp Termination Pre-wired Termination Part Number AFC065-PC/4AWG AFC065-PC/6AWG AFC065-PC/M25 AFC065-PC/M16 AFC100-PC/2AWG AFC100-PC/4AWG AFC100-PC/M35 AFC100-PC/M25 C/M25	Original	PDF	fC065-PC/6AWG AFC065-PC/M25 AFC065-PC/M16 AFC100-PC/2AWG AFC100-PC/4AWG AFC100-PC/M35 AFC100-PC/M25 AFC065-PE/020 AFC065-PE/030 AFC065-PE/050 A0100
3.5mm female 5 pole pcb mount Abstract: Tyco PBT 007 298-08-01100 PM318MOOLSC Socket strip 2x3 0.1 inch 701-23-02107 PM208FOOLOO 701-13-02107 Tyco ELCON Drawer Series Connectors EMC 2309 power supply connector Text: Anderson Power Products Index Anderson Power Products®, an ISO 9001:2000 certified company, is a world leader in the design and manufacture of quick-disconnect power connectors. Our connectors are rated from 30 amps to 450 amps and up to 250 or 600 volts, AC/DC and comply with major worldwide specifications. With over one hundred years of power connection	Original	PDF
2N6660 Abstract: 2N6660-1 Text: 2N6660 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N6660 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	2N6660 2N6660 A022009 2N6660-1
VN0808 Abstract: No abstract text available Text: VN0808 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN0808 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	VN0808 VN0808 A022009
TN2130 Abstract: No abstract text available Text: TN2130 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) TN2130 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	TN2130 TN2130 A022009
VP2106 Abstract: No abstract text available Text: VP2106 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VP2106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	VP2106 VP2106 A022009
B1000 Abstract: No abstract text available Text: 150 & 250 Amp p Filter Connector Female Power Connector lim ry ina Pre ACARA Pre-wired Termination Part Number AFC150-PC/2/0 AFC150-PC/1/0 AFC150-PC/M70 AFC150-PC/M50 AFC250-PC/4/0 AFC250-PC/2/0 AFC250-PC/M95 AFC250-PC/M70 Part Number AFC150-PE/020 AFC150-PE/030	Original	PDF	AFC150-PC/1/0 AFC150-PC/M70 AFC150-PC/M50 AFC250-PC/4/0 AFC250-PC/2/0 AFC250-PC/M95 AFC250-PC/M70 AFC150-PE/020 AFC150-PE/030 AFC150-PE/050 B1000
2n6661 bonding pad lay-out Abstract: 2N6661 Text: 2N6661 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N6661 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	2N6661 2N6661 A022009 2n6661 bonding pad lay-out
2N7002 Die Specification Abstract: 2N7002 Text: 2N7002 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7002 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	2N7002 2N7002 A022009 2N7002 Die Specification

d46b Abstract: k399 a06407 p935 a0540 7F39 q231 ML-ND M315 50436 Text: !"#$%&' & >+17-0.,G,(B(H!"#$%&%'(" * )$AI%@A'D,J!$A@K@A')@L% MLN$D,%LB!"#$%&'(& A:7402+1O7,A0./-1234-0. N34+ P= !>@O7,A0./-1234-0. A0./-12+6,P= !1+<31+6,P= !"#$%&'#%&#()%"()#+(,&-+./,)0. ,"CD@,JI@%,QNB,&CJA@$%A$RP'J$N,@%NSJ)Q@'D ,!'QTCIJ@%AISC)'@U'%CQBLBAB	Original	PDF	-B502B4? 6-741-E I-7401= E0316b d46b k399 a06407 p935 a0540 7F39 q231 ML-ND M315 50436
A01103 Abstract: A020 Herotek A0105116A A0105216A A0105316A A0215115A herotek, a01202 Text: MINIATURE WIDEBAND RF AMPLIFIERS 0.1 – 2.0 GHz FEATURES • More Than One Octave Band Frequency Range • Small Size With Removable Connectors for Drop-In Integration • Low Power Consumption Options • Flat Gain Response • Internal Regulator Circuit for Unregulated Power	Original	PDF	100mW A0220105A A0220205A A0220305A A0120106A A0120206A A0120306A 0606-3-1B A01103 A020 Herotek A0105116A A0105216A A0105316A A0215115A herotek, a01202
DN3145 Abstract: No abstract text available Text: DN3145 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) DN3145 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	DN3145 DN3145 A022009
2N7008 Abstract: No abstract text available Text: 2N7008 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) 2N7008 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	2N7008 2N7008 A022009
VN2106 Abstract: No abstract text available Text: VN2106 Die Speciﬁcation Pad Layout 1 0,0 2 Backside: Drain Die Speciﬁcations Die Dimensions Device Length Width Thickness mils Back Side Metal 30 30 8.0 ± 1.0 Au 1 (mils) VN2106 1 (mils) Back Side Bonding Pad Material Bond Wire Bond Wire Size Drain	Original	PDF	VN2106 VN2106 A022009
7408, 7404, 7486, 7432 Abstract: RF400U functional diagram of 7400 and cd 4011 ls 7404 180 nm CMOS standard cell library TEXAS INSTRUMENTS 74191 4BITS s273 buffer 74374 7408 CMOS cmos 7404 Text: TGC100 Series CMOS Gate Arrays RELEASE 3.0, REVISED JANUARY 1990 • Twelve Arrays with up to 26K Available Gates • Fast Prototype Turnaround Time • Extensive Design Support - Design Libraries Compatible with Daisy, Valid, and Mentor CAE Systems - Tl Regional ASIC Design Centers	OCR Scan	PDF	TGC100 20-mA Sink/12mA TDB10LJ 120LJ TDC11LJ TDN11LJ 100MHz 7408, 7404, 7486, 7432 RF400U functional diagram of 7400 and cd 4011 ls 7404 180 nm CMOS standard cell library TEXAS INSTRUMENTS 74191 4BITS s273 buffer 74374 7408 CMOS cmos 7404
HY53C464LS Abstract: HY53C464F hy53c464 hy53c464lf HY53C464LF70 HY53C464S An-313 Text: HY53C464 Seríes " H Y U N D A I 64K X 4-bit CMOS DRAM DESCRIPTION Hie HY53C464 is fast dynamic RAM organized 65,536 x 4-bit. The HY53C464 utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins to the users.	OCR Scan	PDF	HY53C464 330mil 18pin CMO442) 335ie P-021 A02-20-MA HY53C464LS HY53C464F hy53c464lf HY53C464LF70 HY53C464S An-313
434 289 Abstract: 54175 S085 54151 gen 24lJ IPI04LJ NA220 DTB20 Text: TGC100M MILITARY SERIES 1-/im CMOS GATE ARRAYS Release 2.0, A PR IL 1989 * AC PERFORMANCE TEST STRUCTURE Fully Characterized for M ilitary Applications — Product Fully Compliant w ith the Requirements of M IL -S T D -883 Paragraph 1.2.1 Is Available — Production Processing Is in Accordance	OCR Scan	PDF	TGC100M 0010LJ LH110LJ 434 289 54175 S085 54151 gen 24lJ IPI04LJ NA220 DTB20
TSC500 Abstract: 324 EZ 948 BU221 bf063 ST EZ 728 358 ez 802 bfs 417 130 nm CMOS standard cell library ST BF080 bf068 Text: TSC500 SERIES 1-pm CMOS STANDARD CELLS RELEASE 1.2, APRIL 1989 • High-Performance, 1-pin EPIC CMOS Efficiently Achieves System-Level Designs BOND PAD COMPILER RAM MSI FUNCTION • TSC500 Library Includes Macros for - Static RAMs, Register Files - First-In First-Out Memories	OCR Scan	PDF	TSC500 64-mA TP000LJ TP006LJ TP008LJ TP009LJ TP010LJ 324 EZ 948 BU221 bf063 ST EZ 728 358 ez 802 bfs 417 130 nm CMOS standard cell library ST BF080 bf068
HY53C464LS Abstract: LASCR HY53C464S HY53C464 MCS131 MAY94 HY53C464LF HY53C464LS70 hy53c464lf70 Text: HY53C464 Series »HYUNDAI 64K X 4-bit CMOS DRAM DESCRIPTION The HY53C464 is feist dynamic RAM organized 65,536 x 4-bit. The HY53C464 utilizes Hyundai’s CMOS silicon gate process technology as well as advanced circuit techniques to provide wide operating margins to the users.	OCR Scan	PDF	HY53C464 330mil 18pin 1AA02-20-MAY94 4b750flÃ HY53C464S HY53C464LS LASCR MCS131 MAY94 HY53C464LF HY53C464LS70 hy53c464lf70

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A0220 Search Results

A0220 Result Highlights (2)

A0220 Price and Stock

Texas Instruments TPS7A0220PDQNR

Texas Instruments TPS7A0220PDBVR

Microchip Technology Inc DSC6001HE2A-022.0000

Microchip Technology Inc DSC6001HI2A-022.0000

Vishay Sfernice RCMA0220001FEA20

A0220 Datasheets Context Search

Untitled

VN10K

2N7000

TN2124

Untitled

A0100

3.5mm female 5 pole pcb mount

2N6660

VN0808

TN2130

VP2106

B1000

2n6661 bonding pad lay-out

2N7002 Die Specification

d46b

A01103

DN3145

2N7008

VN2106

7408, 7404, 7486, 7432

HY53C464LS

434 289

TSC500

HY53C464LS