CY7B186 Search Results

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Contextual Info: CY7B185 CY7B186 CYPRESS SEMICONDUCTOR 8,192 x 8 Static RAM Features Functional Description • BiCMOS for optimum speed/power T h e C Y 7 B 1 8 5 a n d C Y 7 B 1 8 6 a re h ig h -p e r­ fo rm a n c e B iC M O S s ta tic R A M s o rg a ­ n iz ed as 8,192 w o rd s b y 8 bits. T h e s e

CY7B185

Abstract: cy7b185-12pc CY7b185-10vc cy7b185-12dmb CY7B185-12VC CY7B185-12DC CY7B186 B1852 7B185 CY7B185-15
Contextual Info: r^ y p p rcç 'W CY7B185 CY7B186 8K x 8 Static RAM = SEMICONDUCTOR Features • BiCMOS for optimum speed/power • Ultra high speed — 9 ns • Low active power — 750 mW • Low standby power — 250 mW • TTL-compatible inputs and outputs • Capable of withstanding greater than

CY7B185-12PC

Contextual Info: CY7B185 CY7B186 _ PR ELIM IN AR Y SEMICONDUCTOR 8,192 x 8 Static RAM Features Functional Description • BiCM OS for optim um speed/power T he CY7B185 and CY7B186 are high-performance BiCM OS static R A M s orga­ nized as 8,192 words by 8 bits. These

CY7C169

Abstract: 54600
Contextual Info: Thermal Management CYPRESS Part Number CY7B173 CY7B174 CY7B180 CY7B181 CY7B185 CY7B186 CY7B191 CY7B192 CY7B194 CY7C122 CY7C123 CY7C128 CY7C128A CY7C130 CY7C131 CY7C132 CY7C136 CY7C140 CY7C141 CY7C142 CY7C146 CY7C147 CY7C148 CY7C149 CY7C150 CY7C157 CY7C161A

Contextual Info: CY7B185 CY7B186 rvp p rcQ — 8K x 8 Static RAM SEMICONDUCTOR Features Functional Description • BiCMOS for optimum speed/power • Ultra high speed — 9 ns • Low active power — 750 mW • Low standby power — 250 mW • TTL-compatible inputs and outputs

7B185

Contextual Info: CY7B185 CY7B186 CYPRESS SEMICONDUCTOR 8K x 8 Static RAM Features Functional Description • BiCMOS for optimum speed/power • U ltra high speed — 9 ns • Low active power — 750 mW • Low standby power — 250 mW • TTL-compatible inputs and outputs

CY27S03A

Abstract: 15JC10 CY7C190 cy7c9101 cy7c122 die VIC068A user guide
Contextual Info: Thermal Management and Component Reliability slope of the logarithmic plots is given by the activation energy of the failure mechanisms causing thermally activated wear out of the device see Figure 1 . One of the key variables determining the long-term reliability

CY7C9101

Abstract: CY7C510 CY7C190 cy7c189 G30-88 CY7c910 EA 9394 cy3341 CY6116 cy7c901
Contextual Info: fax id: 8511 Thermal Management Thermal Management and Component Reliability One of the key variables determining the long-term reliability of an integrated circuit is the junction temperature of the device during operation. Long-term reliability of the semiconductor chip degrades proportionally with increasing temperatures following an exponential function described by the