8X13
Abstract: No abstract text available
Text: SANYO Semiconductor Thin Small Outline Package 28Pin Plastic TSOP28A 8X13.4 Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the
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28Pin
TSOP28A
ED-7303A)
TSOP28A
8X13
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PDF
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IC63LV1024
Abstract: IC63LV1024-10B IC63LV1024-8B IC63LV1024-8J IC63LV1024-8K IC63LV1024-8T IS63LV1024
Text: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error Obsolete "H" type
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Original
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IC63LV1024
36-pin
32-pin
AHSR025-0D
R024-12KI
400mil
300mil
IC63LV1024-15B
IC63LV1024
IC63LV1024-10B
IC63LV1024-8B
IC63LV1024-8J
IC63LV1024-8K
IC63LV1024-8T
IS63LV1024
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PDF
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Untitled
Abstract: No abstract text available
Text: Figure 12: 28-Lead 8x13.4mm Plastic Thin Small Outline Package TSOP Type I (E) Table 13: Plastic Thin Small Outline Package (TSOP) Type I (E) Dimensions INCHES Min Nom Max Min Nom Max
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28-Lead
600-Inch
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PDF
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ZR28
Abstract: No abstract text available
Text: Package Diagram Reverse Thin Small Outline Package 28-Lead Reverse Type 1 Thin Small Outline Package 8x13.4 mm ZR28 51-85074-*F 1 Package Diagram 32-Lead Reverse Thin Small Outline Package ZR32 51-85089-*C 2
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28-Lead
32-Lead
ZR28
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PDF
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P28GW-55-9JL-2
Abstract: No abstract text available
Text: 28-PIN PLASTIC TSOP I (8x13.4) 1 28 detail of lead end S R 14 Q 15 P A J I G S L B C H N S D M M K NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.4mm MAX.)
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Original
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28-PIN
P28GW-55-9JL-2
P28GW-55-9JL-2
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PDF
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32-PIN
Abstract: No abstract text available
Text: 32-PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 S T R L 16 17 U Q P I J A G S H K B C N S NOTES D M M ITEM MILLIMETERS 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. A B 8.0±0.1 0.45 MAX.
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32-PIN
P32GU-50-9JH-2
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PDF
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8x13
Abstract: 32-PIN
Text: 32-PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 U Q L R T 16 17 N K S D S M M C H B S G I J A P NOTES 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.3 mm MAX.)
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Original
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32-PIN
P32GU-50-9KH-2
8x13
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PDF
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32PIN
Abstract: No abstract text available
Text: 32PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 S T R L 16 17 U Q P I A J G H K B C N NOTE (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition. (2) "A" excludes mold flash. (Includes mold flash : 8.3 mm MAX.
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32PIN
P32GU-50-9JH-1
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PDF
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Untitled
Abstract: No abstract text available
Text: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 1.5 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Remove 28L TSOP 1-8x13.4mm Issue Date Jul. 22, 2005 Mar. 10,2006 Jun. 12,2006 Remark P1 Rev. 1.5 Chiplus reserves the right to change product or specification without notice.
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32K-Word
CS18HS02565
1-8x13
CS18HS02565
768-words
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PDF
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IC63LV1024-8BI
Abstract: No abstract text available
Text: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type To correct the TYPO error September 12,2001
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Original
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IC63LV1024
36-pin
32-pin
AHSR025-0C
IC63LV1024-15B
IC63LV1024-15H
IC63LV1024-15T
IC63LV1024-15J
IC63LV1024-15K
IC63LV1024-8BI
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PDF
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IC63LV1024
Abstract: IC63LV1024-10T IC63LV1024-8B IC63LV1024-8J IC63LV1024-8K IC63LV1024-8T IC63L
Text: IC63LV1024 Document Title 128K x 8 Hight Speed SRAM with 3.3V Central Power Revision History Revision No History Draft Date Remark 0A 0B Initial Draft Add B 36-pin TF-BGA 6x8mm and H (32-pin TSOP-1 8x13.4mm) package type September 12,2001 June 20,2002 The attached datasheets are provided by ICSI. Integrated Circuit Solution Inc reserve the right to change the specifications and
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Original
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IC63LV1024
36-pin
32-pin
AHSR025-0B
IC63LV1024-8B
IC63LV1024-8H
IC63LV1024-15T
IC63LV1024-15J
IC63LV1024-15K
IC63LV1024
IC63LV1024-10T
IC63LV1024-8B
IC63LV1024-8J
IC63LV1024-8K
IC63LV1024-8T
IC63L
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PDF
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Untitled
Abstract: No abstract text available
Text: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Issue Date Jul. 22, 2005 Mar. 10,2006 P1 Rev. 1.4 Chiplus reserves the right to change product or specification without notice.
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Original
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32K-Word
CS18HS02565
1-8x13
CS18HS02565
768-words
500mV
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PDF
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TSOP32 Package
Abstract: TSOP32
Text: ZMD-Standard February 2004 MDS 768 Package TSOP32 I/8x13,4 Dimensions in millimetres 1 Dimensions Detail Z bp e 0,1 M E 32 1 A1 LP D HD Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 − Amax 1,20 Amin bPmin 0,17 A1min 0,05 bPmax 0,27 A1max 0,15 enom
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Original
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TSOP32
I/8x13
QS-000768-HD-01
TSOP32 Package
TSOP32
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PDF
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Untitled
Abstract: No abstract text available
Text: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 1.5 1.6 1.7 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Remove 28L TSOP 1-8x13.4mm Revise speed option and DC/AC Characteristics. Remove 28L PDIP 300mil Issue Date
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Original
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32K-Word
CS18HS02565
1-8x13
300mil
CS18HS02565
768-words
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PDF
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Untitled
Abstract: No abstract text available
Text: HY62UF08401C Series 512K x8bit full CMOS SRAM DESCRIPTION FEATURES Fully static operation and Tri-state output TTL compatible inputs and outputs Battery backup 1.2V min data retention Standard pin configuration -. 32 - sTSOP - 8X13.4(Standard) The HY62UF08401C is a high speed, super low
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OCR Scan
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HY62UF08401C
HY62UF08401C-I
HY62UF08401C
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PDF
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K4X56323PN-8G
Abstract: K4X56323PN
Text: Rev. 1.0, Mar. 2010 K4X56323PN 256Mb N-die Mobile DDR SDRAM 8x13, 90FBGA, 8M x32 VDD / VDDQ = 1.8V / 1.8V datasheet SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND SPECIFICATIONS WITHOUT NOTICE. Products and specifications discussed herein are for reference purposes only. All information discussed
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K4X56323PN
256Mb
90FBGA,
K4X56323PN-8G
K4X56323PN
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PDF
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ZA32
Abstract: No abstract text available
Text: Package Diagram Shrunk Thin Small Outline Package 32-Lead Shrunk Thin Small Outline Package 8x13.4 mm ZA32 51-85094-*D 1
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32-Lead
ZA32
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PDF
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8X13
Abstract: No abstract text available
Text: MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TSOP 28, 8x13.4 CASE 318AE−01 ISSUE O DATE 19 DEC 2008 D1 A PIN 1 b E1 e A1 A2 D TOP VIEW END VIEW q1 c q L2 L L1 SIDE VIEW SYMBOL MIN NOM MAX A 1.00 1.10 1.20 A1 0.05 A2 0.90 1.00 1.05 b 0.17 0.22 0.27 c 0.10 0.15
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Original
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318AE-01
98AON34386E
318AE
8X13
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PDF
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a634
Abstract: No abstract text available
Text: for ChipCorder Products Table 1: ISD Device Package Options Package Options1 E ISD Series G P S T X W Z 8x13.4mm 0.350 inch 0.600 inch 0.300 inch 8x20mm Die Wafer Chip Scale
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8x20mm
ISD4003
a634
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PDF
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Untitled
Abstract: No abstract text available
Text: HY57V283220T/ HY5V22F 4 Banks x 1M x 32Bit Synchronous DRAM Revision History Revision No. History 0.1 Defined Preliminary Specification 0.2 1 2) 3) 4) 5) 6) 0.3 Defined IDD Spec. 0.4 Delited Preliminary. 0.5 Changed IDD Spec. 0.6 133MHz Speed Added 0.7 Changed FBGA Package Size from 11x13 to 8x13.
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HY57V283220T/
HY5V22F
32Bit
133MHz
11x13
an283220T
400mil
86pin
HY57V283220T
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PDF
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Untitled
Abstract: No abstract text available
Text: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. 1.3 1.4 1.5 1.6 History Add green code in part no. Add in 28L TSOP 1-8x13.4mm Remove 28L TSOP 1-8x13.4mm Revise speed option and DC/AC Characteristics. Issue Date Jul. 22, 2005 Mar. 10,2006
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Original
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32K-Word
CS18HS02565
1-8x13
CS18HS02565
768-words
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PDF
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CS18HS02565
Abstract: No abstract text available
Text: High Speed SRAM 32K-Word By 8 Bit CS18HS02565 Revision History Rev. No. History Issue Date 1.3 Add green code in part no. Jul. 22, 2005 1.4 Add in 28L TSOP 1-8x13.4mm Mar. 10,2006 1.5 Remove 28L TSOP 1-8x13.4mm Jun. 12,2006 1.6 Revise speed option and DC/AC Characteristics.
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Original
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32K-Word
CS18HS02565
1-8x13
300mil
CS18HS02565
768-words
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PDF
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32PIN
Abstract: No abstract text available
Text: 32PIN PLASTIC TSOP I (8x13.4) detail of lead end 1 32 U Q L R T 16 17 S D N K M M C H B G I A J P NOTE (1) Each lead centerline is located within 0.08 mm (0.003 inch) of its true position (T.P.) at maximum material condition. (2) "A" excludes mold flash. (Includes mold flash : 8.3 mm MAX.
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Original
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32PIN
P32GU-50-9KH-1
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PDF
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Untitled
Abstract: No abstract text available
Text: 28-PIN PLASTIC TSOP I (8x13.4) 1 28 detail of lead end Q R 14 15 S K N H D S L M M C B S G I J A P NOTE 1. Each lead centerline is located within 0.08 mm of its true position (T.P.) at maximum material condition. 2. "A" excludes mold flash. (Includes mold flash : 8.4mm MAX.)
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Original
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28-PIN
P28GW-55-9KL-2
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PDF
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