30A12M Search Results
30A12M Price and Stock
TDK-Lambda Corporation HWS30A-12-MEAC/DC CONVERTER 12V 30W |
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HWS30A-12-ME | Bulk | 5 | 1 |
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TDK-Lambda Corporation HWS30A-12/MESwitching Power Supplies 12Vout 2.5A 30W Medical 115-230VAC |
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HWS30A-12/ME | 4 |
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HWS30A-12/ME | Bulk | 1 |
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HWS30A-12/ME | Bulk | 15 Weeks | 1 |
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HWS30A-12/ME | 1 |
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HWS30A-12/ME | 1 |
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TDK-Lambda Corporation HWS30A-12/MEAPower supply: switching; for building in,modular; 30W; 12VDC |
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HWS30A-12/MEA | 1 |
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Carling Technologies CS1-B2-14-630-A12-MJ |
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CS1-B2-14-630-A12-MJ |
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CS1-B2-14-630-A12-MJ |
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Carling Technologies CA1-B0-12-630-A12-MJ |
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CA1-B0-12-630-A12-MJ |
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CA1-B0-12-630-A12-MJ |
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30A12M Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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Contextual Info: DENSE-PAC 16 Megabit High Speed CMOS SRAM DPS51 2X 3 2 M KV3 MICROSYSTEMS PRELIMINARY DESCRIPTION: The D PS512X32M KV 3 "V ER SA -S TA C K " module is a revolutionary new high speed memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip |
OCR Scan |
PS512X32M DPS512X32MKV3 surfa85 3QA128-02 | |
Contextual Info: 32 Megabit FLASH EEPROM D E N S E - P A C MICROSYSTEMS DPZ1MX32NV3 DESCRIPTION: The D P Z 1 M X 3 2 N V 3 " V E R S A -S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 32 |
OCR Scan |
DPZ1MX32NV3 DPZ1MX32NV3 100ns 120ns 150ns 30A126-02 | |
Contextual Info: 32 Megabit FLASH EEPROM D E N S E -P A C MICROSYSTEMS DPZ2MX16NV3 DESCRIPTION: T h e D P Z 2 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a revolutionary new m em ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless C hip Carriers |
OCR Scan |
100ns 120ns 150ns | |
Contextual Info: DENSE-PAC 16 Megabit FLASH EEPROM MICROSYSTEMS DPZ1MX16NV3 DESCRIPTION: T h e D P Z 1 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a re v o lu tio n a ry n e w m e m o ry su b syste m u sin g D en se-P ac M ic ro sy ste m s' c e ra m ic Stackab le Le ad le ss C h ip C a rrie rs |
OCR Scan |
DPZ1MX16NV3 -t-85 125-C 30A12M | |
Contextual Info: DENSE-PAC 64 Megabit FLASH EEPROM MICROSYSTEMS DPZ4MX16NV3 DESCRIPTION: The D P Z 4 M X 1 6 N V 3 "V E R S A -S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers 64 |
OCR Scan |
DPZ4MX16NV3 DPZ4MX16NV3 100ns 120ns 150ns 30A123-04 |