DPZ1MX16NV3 Search Results

ERA3E

Contextual Info: 16 Megabit FLASH EEPROM DPZ1MX16NV3 M IC R O S Y S T H M S DESCRIPTION: The D PZ 1M X 16 N V 3 "V E R S A - S T A C K ” module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: DENSE-PAC 16 Megabit FLASH EEPROM DPZ1MX16NV3 MICROSYSTEMS PRELIM INARY DESCRIPTION: The D PZ 1 M X 1 6 N V 3 "V ER S A - S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: DENSE-PAC 16 Megabit FLASH EEPROM MICROSYSTEMS DPZ1MX16NV3 DESCRIPTION: T h e D P Z 1 M X 1 6 N V 3 " V E R S A - S T A C K " m o d u le is a re v o lu tio n a ry n e w m e m o ry su b syste m u sin g D en se-P ac M ic ro sy ste m s' c e ra m ic Stackab le Le ad le ss C h ip C a rrie rs

Contextual Info: 16 Megabit FLASH EEPROM DPZ1MX16NV3 DESCRIPTION: The DPZ1MX16NV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

DPZ1MX16n

Abstract: 30A117 DPZ1M
Contextual Info: DENSE-PAC 32 M EGABIT FLASH EEPROM MICROSYSTEMS DPZ2M X16Nn3 PRELIMINARY D E S C R IP T IO N : The D PZ2M X16N n3 " S T A C K " modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . A vailable in straight leaded, " J " leaded or gullwing leaded

Contextual Info: „ ^ f[/ J}L I DENSE-PAC S* rty V 1v M I C R O S Y S T E M S 32 MEGABIT FLASH EEPROM \\ DPZ2MX16Nn3 PRELIMINARY D ESC RIPT IO N : The DPZ2MX16Nn3 “ STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip

Contextual Info: 16 Megabit FLASH EEPROM DPZ1MX16Nn3 DESCRIPTION: The DPZ1MX16Nn3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded