30A07 Search Results

Contextual Info: NON-ISOLATED DC/DC CONVERTERS 12V Input / Programmable Output / 30A VRM VRNB-30A07A PRELIMINARY • High efficiency means less power dissipation • Remote on/off • 2-Wire Remote sense • 5 bit voltage programming scheme • Adaptive voltage positioning Load Line

Contextual Info: 526Kx8/128Kx16, 150 - 250ns, SLCC/PGA 30A071-13 D 2 Megabit FLASH EEPROM DPZ128X16IY/IIY/IJY/IHY/IA3 DESCRIPTION: The DPZ128X16IY/IIY/IJY/IHY/IA3 devices are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers

40404040H

Abstract: 6115 l500m DPZ256
Contextual Info: RPR 1 3 1993 DPZ256X32V3 256K X 32 FLASH ELPROM VERSA-STACK M ODULE PRELIM IN ARY DESCRIPTION: The D P Z 2 5 6 X 3 2 V 3 "V E R S A -S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

Contextual Info: '! 93 D P Z 1 2 8 X 1 6 A 3 o _ 128K x 16 FLASH EEPROM DENSE-STACK M O D U LE PRELIMINARY DESCRIPTION: The DPZ128X16A3 "DENSE-STACK" module is a revolutionary new mem ory subsystem using Dense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC) mounted on a co-fired

30021

Abstract: L48C L41C IC L44C DATASHEET L30C l31c L43C ORSO42G5 ORSO82G5 ORT42G5
Contextual Info: ORCA ORSO42G5 and ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs August 2005 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and

Contextual Info: D E N S E -P A C 8 Megabit FLASH EEPROM M IC R f S YS TE M S DPZ256X32IV3 D E S C R IP T IO N : The DPZ256X32IV3 "VERSA-STACK" module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC) mounted on a co-fired ceramic substrate. It offers

30A-075

Contextual Info: Yuan Dean Scientific CO.,LTD 30A SERIES 8 PIN SINGLE-IN-LINE TTL ACTIVE DELAY LINE FEATURES • 8-PIN SIP PACKAGE. • 5EQUALLY-SPACED TAPS. • TTL SCHOTTKY INTERFACED. • TOTAL DELAYS FROM 25-1000nS. ELECTRICAL CHARACTERISTICS IIH Logic”1” Input Current

Contextual Info: 4 Megabit FLASH EEPROM DPZ256X16In3 DESCRIPTION: The DPZ256X16In3 ‘’STACK’’ modules are a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, ‘’J’’ leaded or gullwing leaded packages, or mounted on a

310CB

Abstract: transistor 30945 30945 30A27 k3264 TN1073 30A07 30A45
Contextual Info: ORSPI4 Provisioning September 2004 Technical Note TN1073 Introduction The ORSPI4 is a next generation FPSC targeted at high speed data transmission, built on the Series 4 reconfigurable embedded System-on-Chip SoC architecture. The ORSPI4 device has been designed to support a broad

bma 023

Abstract: DPZ128X32IV3
Contextual Info: DENSE-PAC MICROSYSTEMS 4 M E G A B IT FLASH E EP R O M DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8X 3 2 IV 3 "V E R S A - S T A C K " module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

050I

Contextual Info: DENSE-PAC 4 MEGABIT FLASH EEPROM DPZ256X16ln3 M I C R O S Y S T E M S D E S C R IP T IO N : The DPZ256X16ln3 "STA C K" modules are a revolutionary new memory subsystem using D ense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight

AL437

Abstract: L97c L235C L103T L41C L140C L94C l165c L239C L43C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC November 2003 Preliminary Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

30AQ

Contextual Info: 16 Megabit FLASH EEPROM D E N S E -P A C M ICRO SYSTEM S DPZ512X32IV3 D E S C R IP T IO N : The DPZ512X32IV3 "VERSA-STACK" module ¡s a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

Contextual Info: DENSE-PAC T K W MICROSYSTEMS 4 M EGABIT FLASH EEPROM \l DPZ128X32IV3 D E S C R IP T IO N : The D PZ 1 2 8 X 3 2 IV 3 "V E R S A - S T A C K " module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

L130C

Abstract: L74c l31c l97c l65c A311TC l146c l48c L202C L235C
Contextual Info: ORCA ORSPI4 Dual SPI4 Interface and High-Speed SERDES FPSC May 2009 Data Sheet Lattice Semiconductor has developed a next-generation FPSC targeted at high-speed data transmission. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSPI4 FPSC contains two

10A07

Abstract: 30h1
Contextual Info: C B p D P Z 5 1 2 X 3 2 V 3 j ^ 512K X 32 FLASH EEPROM VERSA-STACK M ODULE O PRELIM IN A RY DESCRIPTION: The D P Z 5 1 2 X 3 2 V 3 “ V ER S A -S T A C K " module is a revolulionary new memory subsyslem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers

Contextual Info: f n n i M ' • DPZ256X8A3 - * V * Dense-Pac Microsystems, Inc. ^ _ 256K X 8 FLASH EEPROM DENSE-STACK MODULE PRELIMINARY DESCRIPTION: The DPZ256X8A3 "DENSE-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic

ah7al

Abstract: NC-641 TIT lot trace code
Contextual Info: nD M ^ DPZ1MX16V3 I l / l D ens^ P a c M icrosystem s, Inc^ _1 M EC X 16 FLASH EEPROM VERSA-STACK M ODULE ADVANCED INFORMATION DESCRIPTION: The D P Z 1 M X 1 6V 3 "V E R S A -S T A C K " m odule is a revolutionary new memory subsystem using Dense-Pac

Contextual Info: 4 Megabit FLASH EEPROM B E M E - F A C M IC'RÙ& YST E-MsS D P Z 2 5 6 X 1 6 ln 3 D E S C R IP T IO N : The DPZ256X16ln3 '"STACK'7 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ. Available in straight

Contextual Info: P A C 16 M EGABIT f l a s h e e p ro m MICROS YSTEMS DPZ512X32IV3 D E S C R IP T IO N : The DPZ512X32IV3 "VERSA-STACK" module is a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

DPZ128X32IV3

Abstract: 40404040H
Contextual Info: 4 Megabit FLASH EEPROM DPZ128X32IV3 DESCRIPTION: The DPZ128X32IV3 ‘’VERSA-STACK’’ module is a revolutionary new memory subsystem using Dense-Pac Microsystems’ ceramic Stackable Leadless Chip Carriers SLCC mounted on a co-fired ceramic substrate. It offers

L62C

Abstract: 30021 3080e equivalent L41C Transistor BC 177 Datasheet 3080e l48c verilog code BIP-8 L71C l31c
Contextual Info: ORCA ORSO42G5 and ORSO82G5 0.6 to 2.7 Gbps SONET Backplane Interface FPSCs July 2008 Data Sheet DS1028 Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO42G5 and ORSO82G5 devices. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO42G5 and

3080e equivalent

Contextual Info: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSC April 2003 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s that is targeted toward users needing high-speed backplane

Contextual Info: ORCA ORSO82G5 0.6 - 2.7 Gbps SONET Backplane Interface FPSCs January 2004 Data Sheet Introduction Lattice has extended its family of high-speed serial backplane devices with the ORSO82G5 device. Built on the Series 4 reconfigurable embedded System-on-a-Chip SoC architecture, the ORSO82G5 is a high-speed transceiver with an aggregate bandwidth of over 20 Gbits/s. This device is targeted toward users needing high-speed