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    050I

    Abstract: No abstract text available
    Text: DENSE-PAC 4 MEGABIT FLASH EEPROM DPZ256X16ln3 M I C R O S Y S T E M S D E S C R IP T IO N : The DPZ256X16ln3 "STA C K" modules are a revolutionary new memory subsystem using D ense-Pac M icrosystem s' ceram ic Stackable Leadless Chip Carriers SLCC . Available in straight


    OCR Scan     		PDF DPZ256X16ln3 50-pin DPZ256X16ln3 120ns 150ns 170ns 200ns 250ns 30A071-12 050I

    Untitled

    Abstract: No abstract text available
    Text: 4 Megabit FLASH EEPROM B E M E - F A C M IC'RÙ& YST E-MsS D P Z 2 5 6 X 1 6 ln 3 D E S C R IP T IO N : The DPZ256X16ln3 '"STACK'7 modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Lead less Chip Carriers SLCQ. Available in straight


    OCR Scan     		PDF DPZ256X16ln3 50-pin DPZ256X16ln3 120ns 173ns 200ns 250ns -t-85 30A071-12

    Untitled

    Abstract: No abstract text available
    Text: DENSE-PAC ,A s .v MICROSYSTEMS 4 MEGABIT FLASH EEPROM J DPZ256X16ln3 D E S C R IP T IO N : The D P Z 256X 16ln3 "STACK" modules are a revolutionary new m em ory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight


    OCR Scan     		PDF 16ln3 50-pin -t-70 120ns 150ns 170ns 200ns 250ns

    Untitled

    Abstract: No abstract text available
    Text: 4 Megabit FLASH EEPROM D E N S E -P A C MICROSYSTEMS DPZ256X16ln3 DESCRIPTION: The DPZ256X16ln3 "STACK" modules are a revolutionary new memory subsystem using Dense-Pac Microsystems' ceramic Stackable Leadless Chip Carriers SLCC . Available in straight leaded, "J" leaded or gullwing leaded packages, or mounted on a


    OCR Scan     		PDF DPZ256X16ln3 50-pin DPZ256X16ln3 120ns 150ns 170ns 200ns 30A071-12

    DP5Z

    Abstract: No abstract text available
    Text: n INDEX GENERAL PRODUCT INFORMATION Dense-Pac Memory Module and Monolithic E merging T echnology / Products. Quality and R e lia b ilit y . Warranty . . 6 . 7 . 8 14 SRAM PRODUCTS


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