A 2-layer or 4-layer PCB with a solid ground plane and a separate layer for the high-frequency switching node is recommended. Keep the switching node away from sensitive analog circuits and ensure good thermal conduction to the heat sink.
Monitor the drain-source voltage, drain current, and junction temperature to ensure they are within the specified limits. Use a thermal management system to keep the junction temperature below 150°C.
A low-ESR ceramic or film capacitor with a value of 1-10 μF is recommended. The capacitor should be placed close to the VIN pin and have a low inductance path to the power source.
Use a shielded enclosure, keep the switching node away from sensitive circuits, and use a common-mode choke or ferrite bead to filter the output. Ensure good grounding and decoupling of the power supply.
The maximum allowed voltage drop is 1.5 V. Exceeding this limit may reduce the device's reliability and lifespan.