DSA0061027.pdf by Philips Semiconductors

Partial File Text APPLICATION NOTE Solder bumped ICs AN01028 Philips Semiconductors Application information Solder bumped ICs AN01028 © Koninklijke Philips Electronics N.V. 2001 All rights are re
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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90Pb 10Sn solder paste Flip Chip Substrate nitto chip underfill with or without underfill