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DSAUD0010795.pdf
by Laird Technologies
Partial File Text
TgonTM 800 Series Electrically and Thermally Conductive Interface Pad Innovative Technology for a Connected World High-PERFORMANCE, cost effective thermal interface material Used where e
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
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User Tagged Keywords
ASTM D2240
ASTM D5470
D2240
D5470
Tgon 800
tgon 805
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