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    D5470 Price and Stock

    KEMET Corporation PHE850ED5470MD13R06L2

    CAP FILM .047UF 20% 1.25KVDC RAD
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    DigiKey PHE850ED5470MD13R06L2 Bulk 490 1
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    Mouser Electronics PHE850ED5470MD13R06L2 2,385
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    KEMET Corporation PHE450TD5470JD19R06L2

    CAP FILM 0.047UF 5% 2.5KVDC RAD
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    DigiKey PHE450TD5470JD19R06L2 Tray 476 1
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    Mouser Electronics PHE450TD5470JD19R06L2 811
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    TTI PHE450TD5470JD19R06L2 Tray 704
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    KEMET Corporation PHE450RD5470JR06L2

    CAP FILM 0.047UF 5% 1.6KVDC RAD
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    DigiKey PHE450RD5470JR06L2 Tray 113 1
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    KEMET Corporation PME271YD5470MR30

    CAP FILM 0.047UF 20% 1KVDC RAD
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    DigiKey PME271YD5470MR30 Bulk 23 1
    • 1 $2.16
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    Avnet Americas PME271YD5470MR30 Bulk 28 Weeks 800
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    Mouser Electronics PME271YD5470MR30 245
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    Newark PME271YD5470MR30 Bulk 197 1
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    TME PME271YD5470MR30 350 1
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    KEMET Corporation PHE450MD5470JR06L2

    CAP FILM 0.047UF 5% 630VDC RAD
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    DigiKey PHE450MD5470JR06L2 Tray 6 1
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    Mouser Electronics PHE450MD5470JR06L2
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    Newark PHE450MD5470JR06L2 Bulk 1
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    Bristol Electronics PHE450MD5470JR06L2 234 3
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    TME PHE450MD5470JR06L2 44 1
    • 1 $2.14
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    Find more D5470 price and stock on Findchips.com

    D5470 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    ASTM D374

    Abstract: ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374
    Text: TG2030 Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC - CPU - MOS LED - M/B - P/S - Heat Sink LCD-TV - Notebook PC - PC Telecom Device - Wireless Hub.etc.


    Original     		PDF TG2030 D5470 D2240 ASTM D374 ASTM D2240, D412 ASTM D412 ASTM d412 ASTM D2240 D2240 ASTM d792 ASTM-D-257 ASTM-D-374

    bergquist

    Abstract: SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374
    Text: Sil-Pad 900S High Performance Insulator for Low-Pressure Applications Features and Benefits TYPICAL PROPERTIES OF SIL-PAD 900S PROPERTY Color • Thermal impedance: 0.61°C-in2/W @50 psi • Electrically isolating • Low mounting pressures • Smooth and highly compliant surface


    Original     		PDF D2240 bergquist SIL-PAD 1000 TO 247 ASTM D2240, D412 ASTM D374 SIL-PAD 900S D149 D150 D2240 D257 D374

    optically clear adhesive

    Abstract: ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746
    Text: 3M Electronics Assembly Solutions Product Selection Guide Smart Solutions for Building In Value 3M Company, operating in more than 60 countries, has over 60,000 products. These products, based on 40 technology platforms, have been developed by 6,500 3M Product Developers Worldwide.


    Original     		PDF 225-3S-06 7193HB optically clear adhesive ecg master replacement guide 1115b silver conductive ink resins QTM-500 MGC 7805 CONDUCTIVE INK FOR FLEX CIRCUITS 3m 7815 8880-S7 UL-746

    astm D150

    Abstract: D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM
    Text: Laird Technologies Web site: www.LairdTech.com Item # Tflex 2130 V0, Tflex 200 V0 Series Gap Filler Material Tflex™ 200 V0 Series Gap Filler Material The Tflex™ 200 V0 Series is a very soft, free standing gap filler that is more compressible than most gap fillers. Tflex™


    Original     		PDF D5470 IPC-TM-650 astm D150 D412 ASTM D412 ASTM D5470 ASTM D2240, D412 ASTM D2240 T-Flex 200 Outgassing CVCM ASTM

    D149

    Abstract: D2240 D257 D412 A15561-00
    Text: TgardTM 3000 Thermally Conductive Insulators Innovative Technology for a Connected World Electrically Insulating, Thermally Conductive Material The TgardTM 3000 is specifically designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance problems for today’s power


    Original     		PDF A15561-00 A15099-00 D149 D2240 D257 D412

    bergquist

    Abstract: 2500S2
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


    Original     		PDF 2500S20 2500S20 bergquist 2500S2

    Thermal Gap Filler

    Abstract: D149 D2240 D257 D412 E595
    Text: TflexTM 200 V0 Series Thermal Gap Filler Innovative Technology for a Connected World SOFT, FREESTANDING GAP FILLER Tflex 200 V0 is a very soft, freestanding gap filler that is more compliant than most other gap fillers. Combining good thermal conductivity of 1.1 W/mK with high conformability, this


    Original     		PDF A14175-00 Thermal Gap Filler D149 D2240 D257 D412 E595

    Untitled

    Abstract: No abstract text available
    Text: Bond-Ply 400 Thermally Conductive,Un-Reinforced,Pressure Sensitive Adhesive Tape Features and Benefits • Thermal impedance: 0.87°C-in 2/W @50 psi • Easy application • Eliminates need for external hardware (screws,clips,etc.) • Available with easy release tabs


    Original     		PDF E1356 D1002

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 1500S30 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 1500S30 • Thermal conductivity: 1.3 W/m-K PROPERTY Color • Highly conformable / low hardness Reinforcement Carrier


    Original     		PDF 1500S30 E1269 D2240 1500S30

    Untitled

    Abstract: No abstract text available
    Text: Hi-Flow 225U Un-Reinforced Phase Change Thermal Interface Material Features and Benefits T YPICAL PROPERT IES OF H I-FLOW 225U PROPERTY Color • Thermal impedance:0.07°C-in /W @25 psi • Hi-Flow coating will resist dripping • Thermally conductive 55°C phase change


    Original     		PDF D3418

    a3000

    Abstract: No abstract text available
    Text: Gap Pad A3000 Thermally Conductive, Reinforced Gap Filling Material Features and Benefits • Thermal conductivity: 2.6 W/m-K • Fiberglass reinforced for puncture, shear and tear resistance • Reduced tack on one side to aid in application assembly • Electrically isolating


    Original     		PDF A3000 E1269 a3000

    Untitled

    Abstract: No abstract text available
    Text: Sil-Pad 800 High Performance Insulator for Low-Pressure Applications Features and Benefits T YPICAL PROPERT IES OF SIL-PAD 800 PROPERTY Color • Thermal impedance: 0.45°C-in 2/W @50 psi • High value material • Smooth and highly compliant surface


    Original     		PDF D2240

    D150

    Abstract: D257 INCOMING MATERIAL FLOW PROCESS
    Text: 45 Features • Out-of-the-Box Convenience • Exceptional Thermal Performance • Simplifies Bill of Materials and Purchasing Data Sheet ThermScreen TM Factory Applied Thermal Interface Product Overview ThermScreen is a factory applied thermal interface material available as an option for


    Original     		PDF 6/03/10M D150 D257 INCOMING MATERIAL FLOW PROCESS

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad 2500S20 Highly Conformable,Thermally Conductive, Reinforced “S-Class” Gap Filling Material Features and Benefits TYPICAL PROPERTIES OF GAP PAD 2500S20 • Thermal conductivity: 2.4 W/m-K PROPERTY Color • Low “S-Class” thermal resistance at


    Original     		PDF 2500S20 E1269 D2240 2500S20

    TIC 220

    Abstract: D257 D792 TIC1000A
    Text: TIC 1000A High Performance, Value Compound for High-End Computer Processors Features and Benefits • High thermal performance: 0.32°C/W TO-220 thermal test @ 50 psi • Good screenability • Room temperature storage • No post “cure” required


    Original     		PDF O-220 D5470 TIC1000A TIC 220 D257 D792

    C351

    Abstract: D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240
    Text: Gap Pad 2000S40 Highly Conformable,Thermally Conductive “S-Class” Gap Filling Material Features & Benefits TYPICAL PROPERTIES OF GAP PAD 2000S40 PROPERTY Color • Thermal conductivity = 2.0 W/mK • Low S-Class thermal resistance at very low pressures


    Original     		PDF 2000S40 C351 D149 D150 D2240 D257 D374 D575 D792 ASTM d792 ASTM D2240

    Untitled

    Abstract: No abstract text available
    Text: TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing


    Original     		PDF 50psi, 300-H A15293-00

    Untitled

    Abstract: No abstract text available
    Text: TgardTM 20 Thermally Conductive Insulators Innovative Technology for a Connected World LOW COST, MEDIUM PERFORMANCE INSULATOR MATERIAL The TgardTM 20 is designed to solve over heating issues such as lower component efficiency, premature component failures, size limitations and other performance


    Original     		PDF A15561-00

    a13514

    Abstract: D149 D150 D2240 D257 D412 E595 ASTM D2240, D412 ASTM-D257 Dielectric Constant Silicon Nitride
    Text: T-gardTM 200 Series global solutions : local support TM T-gard 200 Series Features and Benefits: High Performance Thermal Interface Products • High thermal Conductivity of 5.0 W/mK The T-gard™ 200 is a high performance interface pad. Consisting of silicon/


    Original     		PDF

    D149

    Abstract: D150 D2240 D257 D412 E595
    Text: T-flex 600 Series Thermal Gap Filler global solutions : local support ™ T-flexTM 600 Series Thermal Gap Filler Exceptionally soft, highly compressible gap filler T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: Poly-Pad 400 Polyester-Based,Thermally Conductive Insulation Material Features and Benefits • Thermal impedance: 1.13°C-in2/W @50 psi • Polyester based • For applications requiring conformal coatings • Designed for silicone-sensitive standard


    Original     		PDF D2240 D1458

    Untitled

    Abstract: No abstract text available
    Text: Gap Pad VO Conformable,Thermally Conductive Material for Filling Air Gaps Features and Benefits TYPICAL PROPERTIES OF GAP PAD VO • Thermal conductivity: 0.8 W/m-K • Enhanced puncture, shear and tear resistance • Conformable gap filling material • Electrically isolating


    Original     		PDF E1269

    Untitled

    Abstract: No abstract text available
    Text: TG-X Ultra Soft Thermal Conductive Pad Features Superior thermal conductivity Highly compressible Naturally tacky Low Shore OO hardness Low oil bleed Electrically insulating Applications Electronic components: IC / CPU / MOS LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /


    Original     		PDF D5470 320-320mm D2240

    Untitled

    Abstract: No abstract text available
    Text: DC0040/01/PC99AL-0.10-0.1 Die Cut PCM SCR Darlington Module Features Low thermal resistance Natural tack Applications SCR Darlington Module REACH Compliant Properties RoHS Compliant Property PC99AL Unit Test Method Colour Grey - Visual Thickness 0.10 mm ASTM D374


    Original     		PDF DC0040/01/PC99AL-0 PC99AL D5470 DC0040/01 DC0040/02 DC0040/03 DC0040/04 DC0040/05 DC0040/06