The Datasheet Archive
Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers
Search
DSAE0072914.pdf
by Intel
Partial File Text
CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power
Datasheet Type
Original
RoHS
Unknown
Pb Free
Unknown
Lifecycle
Unknown
Price & Stock
Find it at Findchips.com
DSAE0072914.pdf
preview
Download Datasheet
User Tagged Keywords
240817
50 mil pitch ceramic package
64 CERAMIC LEADLESS CHIP CARRIER LCC
CERAMIC CHIP CARRIER LCC 68 socket
CERAMIC LEADLESS CHIP CARRIER
ic packages
INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE
intel packaging
QFP 64 Cavity dip
QFP 64 Cavity package
TSOP 56 socket
Price & Stock Powered by