DSASW00420429.pdf by Xilinx

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90Pb 10Sn solder paste 9500XL Alpha WS609 Alpha WS609 solder Anti Corrosive tape for pipe BFG DIODE BGA 31 x 31 mm BGA 6x6 tray BGA Ball Crack BGA reflow guide bga rework CCGA 484 socket CF1752 code marking CIJ CP132 cpga material declaration cs324 CSG324 CSG324* reflow cte table epoxy substrate Digital Weighing Scale PCB layout EF668 FF1148 raw material properties FF676 FFG1136 FFG676 FG484 FGG484 ipc 9850 JEDEC tray standard 490 4x4 QFN land pattern for TSOP input id Lead Free reflow FG484 Lead Free reflow soldering profile BGA MAGNETIC HEAD tape deck mercury wetted oyster marking bga parameters of FR4 substrate with dielectric parameters of FR4 substrate with dielectric const PCB design for very fine pitch csp package pcb footprint FS48, and FSG48 PEAK TRAY QFN 4x4 peltier element schematic qfn 3x3 tray dimension reballing recommended layout CSG324 SF363 SFG363 SMD BGA 672 DRAWING SMD MARKING CODE C1G thermoelectric generator by using peltier top marking 957 so8 Triton Services TsoP 20 Package XILINX TT 2076 UG112 VQG44 WS609 XC18V XC2V6000-ff1152 XC2VP7 reflow profile XC4VLX60-10FFG668C XC5VLX XCDAISY XCS20 TQ144 country of origin xilinx MARKING CODE xilinx part marking xilinx pq100 xilinx spartan topside marking xilinx topside marking xilinx topside marking 1700E xilinx XC2V6000-FF1152