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    XILINX 8 PIN DIP PACKAGE DIMENSIONS Search Results

    XILINX 8 PIN DIP PACKAGE DIMENSIONS Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    XILINX 8 PIN DIP PACKAGE DIMENSIONS Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: PA20-08-2PD Z 3(6) Data Sheet 20 pin PLCC Auto-eject Dead-Bug socket/8 pin DIP 0.3” (0.6") plug or 20 pin PLCC Lidded ZIF Live-Bug socket/8 pin DIP 0.3" (0.6") plug Supported Device/Footprints Adapter Part Numbers This adapter allows several Xilinx devices in the PLCC package


    Original     		PDF PA20-08-2PD XC1701P XC1701L XC1736E XC1765E XC17128E XC17256E XC17128EL XC17256EL XC17512L

    Untitled

    Abstract: No abstract text available
    Text: PA20-08-5-2808-3 6 Data Sheet 20 Pin SO socket/8 Pin DIP 0.3” or 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, several Xilinx EEPROM's in their 20 pin SO package can be programmed in their 8 pin DIP footprint. This adapter is general purpose, and is known to work for the


    Original     		PDF PA20-08-5-2808-3 XC1701 XC17512L 20SO8-5

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
    Text: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228

    schematic impulse sealer

    Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
    Text: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF FG860 FG900 FG1156 schematic impulse sealer leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481

    schematic impulse sealer

    Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
    Text: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").


    Original     		PDF PK100 060ROM schematic impulse sealer qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN

    footprint jedec MS-026 TQFP

    Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    schematic impulse sealer

    Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
    Text: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    JEDEC Package Code MS-026-AED

    Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
    Text: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or


    Original     		PDF

    R50-E2Y2-24

    Abstract: sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001
    Text: Ironwood Electronics PC.1 IC Package and Device Converters We offer over 500 adapters for converting IC packaging and device pinouts, solving many IC availability and performance issues. We also offer "fix" adapters to solve layout problems and some known chip deficiences. Custom, quick turn solutions are our speciality.


    Original     		PDF PC-ZIP/DIP20-01 PC-ZIP/DIP28-01 PC-ZIP/DIP28-02 PC-ZIP20/DIP18-01 R50-E2Y2-24 sk 8085 84 pin plcc ic base Aromat TQ2E-24V UT1553BCRTM INTEL 486 dx2 soic40 plcc44 pinout numbers XE4006E 68hc001

    PCB footprint cqfp 132

    Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
    Text: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 PCB footprint cqfp 132 schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318

    camera-link to hd-SDI converter

    Abstract: Virtex-4QV DS-KIT-FX12MM1-G AES-S6DEV-LX150T-G VHDL code for ADC and DAC SPI with FPGA spartan 3 ADQ0007 XC6SL AES-XLX-V4FX-PCIE100-G SPARTAN-3 XC3S400 based MXS3FK ADS-XLX-SP3-EVL400
    Text: Product Selection Guides Table of Contents February 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    XC3S250E TQ144 STARTER KIT BOARD

    Abstract: AES-S6DEV-LX150T-G connector FMC LPC samtec DS-KIT-FX12MM1-G ADS-XLX-SP3-EVL1500 xcf128x SPARTAN-3 XC3S400 SPARTAN-3 XC3S400 pq208 architecture SPARTAN-3 XC3S400 based MXS3FK XQ4VSX55
    Text: Product Selection Guides Table of Contents January 2010 Virtex Series . 2 Spartan Series . 6


    Original     		PDF

    xilinx XC3S200A

    Abstract: XC3S200A-4FTG256C XC3S200A ft2232h spi xc3s400a ftg256 ft2232h Xilinx jtag cable Schematic FPGA program uart vhdl fpga Xilinx jtag cable pcb Schematic
    Text: DLP-HS-FPGA LEAD-FREE USB - FPGA MODULE PRELIMINARY APPLICATIONS: FEATURES: - Rapid Prototyping - Educational Tool - Industrial / Process Control - Data Acquisition / Processing - Embedded Processor - Xilinx XC3S200A-4FTG256C FPGA - Micron 32M x 8 DDR2 SDRAM Memory


    Original     		PDF XC3S200A-4FTG256C 50-Pin, xilinx XC3S200A XC3S200A ft2232h spi xc3s400a ftg256 ft2232h Xilinx jtag cable Schematic FPGA program uart vhdl fpga Xilinx jtag cable pcb Schematic

    LM-XCV2000

    Abstract: IC525 latest computer motherboard circuit diagram ICS525 ahb apb bridge vhd XVC1000E xilinx jtag cable XVC600E XVC2000E
    Text: Integrator /LM-XCV600E+ Integrator /LM-EP20K600E+ ™ User Guide Copyright 2000-2001. All rights reserved. ARM DUI 0146C Integrator/LM-XCV600E+ Integrator/LM-EP20K600E+ User Guide Copyright © 2000-2001. All rights reserved. Release Information Date


    Original     		PDF /LM-XCV600E+ /LM-EP20K600E+ 0146C Integrator/LM-XCV600E+ Integrator/LM-EP20K600E+ LM-XCV2000 IC525 latest computer motherboard circuit diagram ICS525 ahb apb bridge vhd XVC1000E xilinx jtag cable XVC600E XVC2000E

    footprint jedec MS-026 TQFP 128

    Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
    Text: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336


    Original     		PDF XC7236A XC7272A XC7318 XC7336 XC7336Q XC7354 XC7372 XC73108 XC73144 XC9536 footprint jedec MS-026 TQFP 128 schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208

    usb to sata cable schematic

    Abstract: XCF32PFS48C EG-2121CA-200 XAPP870 XC5VLX50T-FFG1136C-1 XC5VLX50T-FFG1136 ML555 qse-028 B81 MB V4.1 xc5vlx50tffg1136
    Text: Virtex-5 FPGA ML555 Development Kit for PCI and PCI Express Designs User Guide UG201 v1.4 March 10, 2008 R R Xilinx is disclosing this Document and Intellectual Property (hereinafter “the Design”) to you for use in the development of designs to operate


    Original     		PDF ML555 UG201 ML555 usb to sata cable schematic XCF32PFS48C EG-2121CA-200 XAPP870 XC5VLX50T-FFG1136C-1 XC5VLX50T-FFG1136 qse-028 B81 MB V4.1 xc5vlx50tffg1136

    XC1700E

    Abstract: XC17128EV08I XQ1701LS020N XC1701-PD8C XC17128EPD8C xilinx 8 pin dip package dimensions XC17512LS020C
    Text: £ XILINX XC1700E Family of Serial Configuration PROMs December 7, 1998 Version 1.4 Product Specification Features Description • The XC1700 family of serial configuration PROMs (SPROMs) provides an easy-to-use, cost-effective method for storing Xilinx FPGA configuration bitstreams.


    OCR Scan     		PDF XC1700E XC17128E/EL XC17256E/EL XC4000EX/XL/XLA/XV 20-pin Progra65 5M-1982. MD-047 XC17128EV08I XQ1701LS020N XC1701-PD8C XC17128EPD8C xilinx 8 pin dip package dimensions XC17512LS020C

    XC1736ES08C

    Abstract: XC17256EV08I XC17128EV08I XC1765ES08C XC17256EV08C XC17128EV08C XC1736ES08I XC1765ES08I XC1701LS020C XC1736EV08I
    Text: £ XILINX XC1700E Family of Serial Configuration PROMs December 7, 1998 Version 1.4 Product Specification Features Description • The XC1700 family of serial configuration PROMs (SPROMs) provides an easy-to-use, cost-effective method for storing Xilinx FPGA configuration bitstreams.


    OCR Scan     		PDF XC17128E/EL XC17256E/EL XC4000EX/XL/XLA/XV 20-pin Programming985 5M-1982. MD-047 84-PIN XC1736ES08C XC17256EV08I XC17128EV08I XC1765ES08C XC17256EV08C XC17128EV08C XC1736ES08I XC1765ES08I XC1701LS020C XC1736EV08I

    Untitled

    Abstract: No abstract text available
    Text: XC1700L Series High Density Serial Y|LIN X@ Configuration PROMs Including XQ1701L QPRO Series January 27, 1999 Version 2.2 Product Specification Features Description Serial Configuration one-time programmable (OTP) read-only memory designed to store configuration


    OCR Scan     		PDF XC1700L XQ1701L XC4000EX/XL/XLA/XV XC1704L, XC1702L, 1701L, 1701L XC17512L XC1701 S-026-AC

    XC1765-DD8M

    Abstract: XC1765 XC1736A 1736a XC1736APD8 bytek XC1765-PC20C XC1736A-PC20C XC1765PD8C XC17XX
    Text: XC1736A/XC1765 Serial Configuration PROM Product Specification Vpp FEATURES • One-Time Programmable OTP 36,288 x 1 bit and 65,536 x 1 bit serial memories designed to store configuration programs for Programmable Gate Arrays • Simple interface to Logic Cell Arrays (LCA) requires


    OCR Scan     		PDF XC1736A/XC1765 XC2000 XC3000 XC1765R MIL-STD-883, XC1765 20-Pin XC17XX- PC20C XC1736A XC1765-DD8M XC1765 1736a XC1736APD8 bytek XC1765-PC20C XC1736A-PC20C XC1765PD8C XC17XX

    XC1736A-PD8C

    Abstract: XC1765-DD8M XC1765-PD8C XC1736APD8C unipro xilinx 1736a XC1765-CD8M XC1765-PC20C AM1736 pc20c
    Text: K XC1736A/XC1765 Serial Configuration PROM Product Specification Vpp FEATURES • One-Time Programmable OTP 36,288 x 1 bit and 65,536 x 1 bit serial m em ories designed to store configuration programs for Programmable Gate Arrays • Simple interface to Logic Cell Arrays (LCA) requires


    OCR Scan     		PDF XC2000 XC3000 XC1765R MIL-STD-883, XC1765 20-pin XC17XX PC20C XC1736A XC1736A-PD8C XC1765-DD8M XC1765-PD8C XC1736APD8C unipro xilinx 1736a XC1765-CD8M XC1765-PC20C AM1736 pc20c

    XC17S20XLV08C

    Abstract: XC17S20V08C XC17S05V08C XC17S30V08C
    Text: £ XILINX Spartan and Spartan-XL Families of Serial Configuration PROMs July 21, 1998 Version 1.1 Product Specification Introduction Spartan SPROM Features The Spartan family of Serial Configuration PROMs (SPROM) provides and easy-to-use, cost-effective method


    OCR Scan     		PDF 5M-1982. MS-013-AC XC17S20XLV08C XC17S20V08C XC17S05V08C XC17S30V08C

    Xilinx 17128

    Abstract: xilinx 1765 ATT ORCA fpga ATT17128P8 DS92-108FPGA ATT Microelectronics ATT17128-P8 ATT1736 ATT1700 ATT3030
    Text: Data Sheet June 1992 ü m A rc r >Microelectronics ATT1736/1765/17128 Serial PROM Features Description • 36,288 x 1 bit, 65,536 x 1 bit, and 131072 x 1 bit serial PROMs for FPGA configuration The ATT1736/1765/17128 Serial Configuration PROM devices serve as easy-to-use, cost-effective non­


    OCR Scan     		PDF ATT1736/1765/17128 XC1700* DS92-108FPGA Xilinx 17128 xilinx 1765 ATT ORCA fpga ATT17128P8 ATT Microelectronics ATT17128-P8 ATT1736 ATT1700 ATT3030

    ATT ORCA fpga

    Abstract: Xilinx 17128 17128 ATT17128-P8 att1736 att1765 ATT1700 ATT3020 ATT3030 ATT3042
    Text: Data Sheet June 1992 = i. ATflX Iri 1 , Microelectronics ATT 17 3 6 /1 7 6 5 /1 7 1 2 8 Serial PROM Features Description 36,288 x 1 bit, 65,536 x 1 bit, and 131072 x 1 bit serial PROMs tor FPGA configuration Designed to store configuration programs for programmable gate arrays


    OCR Scan     		PDF ATT1736/1765/17128 XC1700* 005002b 0013S77 ATTI736 736-P8 ATTI765 ATT1765-P8 ATTI7128 ATT ORCA fpga Xilinx 17128 17128 ATT17128-P8 att1736 att1765 ATT1700 ATT3020 ATT3030 ATT3042