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    XILINX/PART MARKING HOT Search Results

    XILINX/PART MARKING HOT Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    0201DS-0N6XKL Coilcraft Inc OLD PART NUMBER.(Change 'L' to 'E' for new halogen-free part number.) Visit Coilcraft Inc
    0201DS-2N3XJL Coilcraft Inc OLD PART NUMBER.(Change 'L' to 'E' for new halogen-free part number.) Visit Coilcraft Inc
    0201DS-4N8XJL Coilcraft Inc OLD PART NUMBER.(Change 'L' to 'E' for new halogen-free part number.) Visit Coilcraft Inc
    0201DS-9N6XJL Coilcraft Inc OLD PART NUMBER.(Change 'L' to 'E' for new halogen-free part number.) Visit Coilcraft Inc
    LPS3008-124 Coilcraft Inc OLD PART NUMBER.(Change final L\\ to \\R\\ for new halogen-free part number.)\\ Visit Coilcraft Inc

    XILINX/PART MARKING HOT Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    xc3s400a ftg256

    Abstract: xilinx MARKING CODE SPARTAN 3an XC3S700A FGG484 Xilinx XC3S200AN XC3S50A VQ100 Spartan-3an xc3s50an xilinx XC3S200A 8 bit binary numbers multiplication picoblaze UG331
    Text: 6 R Extended Spartan-3A Family Overview DS706 v1.0.1 January 29, 2010 Product Specification General Description The Extended Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many highvolume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in


    Original     		DS706 xc3s400a ftg256 xilinx MARKING CODE SPARTAN 3an XC3S700A FGG484 Xilinx XC3S200AN XC3S50A VQ100 Spartan-3an xc3s50an xilinx XC3S200A 8 bit binary numbers multiplication picoblaze UG331 PDF

    XC3S50A/AN VQ100

    Abstract: SPARTAN 3an ttl to mini-lvds XC3S700A FGG484 xilinx XC3S200A Spartan-3an xc3s50an XC3S50AN xilinx MARKING CODE xc3s400a ftg256 spartan 3a
    Text: 6 R Extended Spartan-3A Family Overview DS706 v1.0 July 31, 2008 Product Specification General Description The Extended Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many highvolume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in


    Original     		DS706 XC3S50A/AN VQ100 SPARTAN 3an ttl to mini-lvds XC3S700A FGG484 xilinx XC3S200A Spartan-3an xc3s50an XC3S50AN xilinx MARKING CODE xc3s400a ftg256 spartan 3a PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    BFG95

    Abstract: No abstract text available
    Text: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    XA2C128-8CPG132Q

    Abstract: XA2C128-7CPG132I AEC-Q100 LVCMOS15 LVCMOS25 LVCMOS33 XA2C128 XAPP427 XA2C128 "pin compatible"
    Text: XA2C128 CoolRunner-II Automotive CPLD R DS554 v1.2 June 9, 2009 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over


    Original     		XA2C128 DS554 AEC-Q100 100-pin 132-ball XA2C128-8CPG132Q XA2C128-7CPG132I LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XA2C128 "pin compatible" PDF

    application of smart hearing aid

    Abstract: teradyne lasar hearing aid schematic delco ic 95124 tokyo electron circuit of smart hearing aid Ericsson Base Station ic for hearing aid analysis DeCypher
    Text: 1996 Xilinx Inc. All rights reserved. XCELL is published quarterly for customers of Xilinx, Inc. Xilinx, the Xilinx logo and XACT are registered trademarks; all XC-designated products, HardWire, Foundation Series, and XACTstep are trademarks; and “The Programmable Logic


    Original     		PDF

    SPARTAN-II xc2s200 pq208 block diagram

    Abstract: Spartan-II pin details SPARTAN-II xc2s200 pq208 XC2S50 tq144 SPARTAN-II xc2s50 pq208 Spartan-II xc2s100 pin details XC2S50 XC2S100 XC2S150 xilinx XC17S00A DATE CODE MARKING
    Text: 05 Spartan-II 2.5V FPGA Family: Introduction and Ordering Information R DS001-1 v2.4 September 3, 2003 Introduction Product Specification • The Spartan -II 2.5V Field-Programmable Gate Array family gives users high performance, abundant logic resources,


    Original     		DS001-1 DS001-1, DS001-2, DS001-3, DS001-4, SPARTAN-II xc2s200 pq208 block diagram Spartan-II pin details SPARTAN-II xc2s200 pq208 XC2S50 tq144 SPARTAN-II xc2s50 pq208 Spartan-II xc2s100 pin details XC2S50 XC2S100 XC2S150 xilinx XC17S00A DATE CODE MARKING PDF

    Untitled

    Abstract: No abstract text available
    Text: XC2C32A CoolRunner-II CPLD R DS310 v1.8 March 20, 2006 Product Specification Features Description • The CoolRunner -II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		XC2C32A DS310 32-land 44-pin 56-ball IEEE1149 tSLEW25, tSLEW33 TIN25, PDF

    COOLRUNNER-II ucf file

    Abstract: COOLRUNNER-II examples XC9500XL XCR3064XL-PC44 CoolRunner XPLA3 CPLD Family COOLRUNNER-II XAPP150 DS012 DS090 XAPP382
    Text: CPLD I/O User Guide UG445 v1.1 November 27, 2007 R R Xilinx is disclosing this Document and Intellectual Property (hereinafter “the Design”) to you for use in the development of designs to operate on, or interface with Xilinx FPGAs. Except as stated herein, none of the Design may be copied, reproduced, distributed, republished,


    Original     		UG445 XAPP382) COOLRUNNER-II ucf file COOLRUNNER-II examples XC9500XL XCR3064XL-PC44 CoolRunner XPLA3 CPLD Family COOLRUNNER-II XAPP150 DS012 DS090 XAPP382 PDF

    XC2C32A VQ44

    Abstract: XC2C32A-6QFG32C XC2C32A-6VQG44C XC2C32A-6VQG44I XC2C32A-4VQG44C XC2C32A-6QFG32I LVCMOS15 LVCMOS25 LVCMOS33 XAPP427
    Text: R DS310 v2.1 November 6, 2008 XC2C32A CoolRunner-II CPLD Product Specification Features Description • The CoolRunner -II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		DS310 XC2C32A 32-macrocell LVCMOS18; LVCMOS33. xcn07022 XC2C32A VQ44 XC2C32A-6QFG32C XC2C32A-6VQG44C XC2C32A-6VQG44I XC2C32A-4VQG44C XC2C32A-6QFG32I LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 PDF

    XC2S400E

    Abstract: XC2S200E XC2S100E XC2S150E XC2S300E XC2S50E XC2S400-E XC2s600e XC2S600-E bga pin 676
    Text: Spartan-IIE 1.8V FPGA Family: Introduction and Ordering Information R DS077-1 v2.1 July 9, 2003 Introduction Product Specification • The Spartan -IIE 1.8V Field-Programmable Gate Array family gives users high performance, abundant logic resources, and a rich feature set, all at an exceptionally low


    Original     		DS077-1 DS077-2, DS077-3, DS077-4, XC2S400E XC2S600E. XC2S150E XC2S50E XC2S200E XC2S100E XC2S300E XC2S50E XC2S400-E XC2s600e XC2S600-E bga pin 676 PDF

    Untitled

    Abstract: No abstract text available
    Text: CPLD I/O User Guide UG445 v1.2 January 14, 2014 R R DISCLAIMER The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG445 XAPP382) PDF

    Untitled

    Abstract: No abstract text available
    Text: R DS092 v3.0 November 30, 2005 XC2C64 CoolRunner-II CPLD Note: This product is being discontinued. You cannot order this part after April 24, 2006. Xilinx recommends replacing the XC2C64 device with the XC2C64A device in all designs as soon as possible. The XC2C64A device is


    Original     		XC2C64 DS092 XC2C64A XCN05017 64-macrocell VQ100 PDF

    XC2C32A VQ44

    Abstract: No abstract text available
    Text: XC2C32A CoolRunner-II CPLD R DS310 v2.0 March 8, 2007 Product Specification Features Description • The CoolRunner -II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment


    Original     		XC2C32A DS310 32-land 44-pin 56-ball IEEE1149 tSLEW25, tSLEW33 TIN25, XC2C32A VQ44 PDF

    Untitled

    Abstract: No abstract text available
    Text: R DS091 v3.0 November 30, 2005 XC2C32 CoolRunner-II CPLD Note: This product is being discontinued. You cannot order this part after April 24, 2006. Xilinx recommends replacing the XC2C32 device with the XC2C32A device in all designs as soon as possible. The XC2C32A device is


    Original     		XC2C32 DS091 XC2C32A XCN05017 32-macrocell PDF

    XA2C128-8CPG132Q

    Abstract: No abstract text available
    Text: XA2C128 CoolRunner-II Automotive CPLD R DS554 v1.0 October 31, 2006 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over


    Original     		XA2C128 DS554 AEC-Q100 100-pin XAPP784: XAPP375: XAPP376: XAPP378: XAPP382: XAPP389: XA2C128-8CPG132Q PDF

    LVCMOS33

    Abstract: XA2C64A AEC-Q100 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q
    Text: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.1 May 5, 2007 Features • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade • Guaranteed to meet full electrical specifications over TA = -40° C to +105° C with TJ Maximum = +125° C


    Original     		XA2C64A DS553 AEC-Q100 44-pin 100-pin XAPP375: XAPP376: XAPP378: XAPP382: XAPP389: LVCMOS33 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q PDF

    vqg44

    Abstract: No abstract text available
    Text: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.0 October 31, 2006 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over


    Original     		XA2C64A DS553 AEC-Q100 44-pin XAPP784: XAPP375: XAPP376: XAPP378: XAPP382: XAPP389: vqg44 PDF

    DS092

    Abstract: LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XC2C64 XC2C64A VQ1001 5VQ10 G1142
    Text: R DS092 v2.1 March 7, 2005 XC2C64 CoolRunner-II CPLD Note: This product is no longer recommended for new designs. It has been superseded by the XC2C64A, a device with I/O Banking and Pb-free package options. • • • Refer to the CoolRunner -II family data sheet for architecture description.


    Original     		DS092 XC2C64 XC2C64A, 44-pin VQ100 XC2C64A DS092 LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 VQ1001 5VQ10 G1142 PDF

    XC2C64A-7C

    Abstract: XC2C64A-7CPG56I qfg48 dimensions XC2C64A-7QF
    Text: XC2C64A CoolRunner-II CPLD R DS311 v2.0 March 20, 2006 Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		XC2C64A DS311 44-pin 48-land 56-ball 100-pin IEEE1149 tOUT25 tOUT33, XC2C64A-7C XC2C64A-7CPG56I qfg48 dimensions XC2C64A-7QF PDF

    CPLD XC2C64 from Xilinx CoolRunner-II family

    Abstract: COOLRUNNER-II test circuit K8/50 marking g10 XC2C64-7VQ100C DS092 LVCMOS25 LVCMOS33 XAPP427 XC2C64
    Text: R DS092 v1.8 October 7, 2004 XC2C64 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and


    Original     		DS092 XC2C64 64-macrocell VQ100 XC2C64A CPLD XC2C64 from Xilinx CoolRunner-II family COOLRUNNER-II test circuit K8/50 marking g10 XC2C64-7VQ100C DS092 LVCMOS25 LVCMOS33 XAPP427 PDF