XILINX/PART MARKING HOT Search Results

xc3s400a ftg256

Abstract: xilinx MARKING CODE SPARTAN 3an XC3S700A FGG484 Xilinx XC3S200AN XC3S50A VQ100 Spartan-3an xc3s50an xilinx XC3S200A 8 bit binary numbers multiplication picoblaze UG331
Contextual Info: 6 R Extended Spartan-3A Family Overview DS706 v1.0.1 January 29, 2010 Product Specification General Description The Extended Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many highvolume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in

XC3S50A/AN VQ100

Abstract: SPARTAN 3an ttl to mini-lvds XC3S700A FGG484 xilinx XC3S200A Spartan-3an xc3s50an XC3S50AN xilinx MARKING CODE xc3s400a ftg256 spartan 3a
Contextual Info: 6 R Extended Spartan-3A Family Overview DS706 v1.0 July 31, 2008 Product Specification General Description The Extended Spartan -3A family of Field-Programmable Gate Arrays (FPGAs) solves the design challenges in many highvolume, cost-sensitive electronic applications. With 12 devices ranging from 50,000 to 3.4 million system gates (as shown in

xilinx topside marking

Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

BFG95

Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

XILINX/part marking Hot

Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

qfn 3x3 tray dimension

Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

xilinx part marking

Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the

XA2C128-8CPG132Q

Abstract: XA2C128-7CPG132I AEC-Q100 LVCMOS15 LVCMOS25 LVCMOS33 XA2C128 XAPP427 XA2C128 "pin compatible"
Contextual Info: XA2C128 CoolRunner-II Automotive CPLD R DS554 v1.2 June 9, 2009 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over

application of smart hearing aid

Abstract: teradyne lasar hearing aid schematic delco ic 95124 tokyo electron circuit of smart hearing aid Ericsson Base Station ic for hearing aid analysis DeCypher
Contextual Info: 1996 Xilinx Inc. All rights reserved. XCELL is published quarterly for customers of Xilinx, Inc. Xilinx, the Xilinx logo and XACT are registered trademarks; all XC-designated products, HardWire, Foundation Series, and XACTstep are trademarks; and “The Programmable Logic

SPARTAN-II xc2s200 pq208 block diagram

Abstract: Spartan-II pin details SPARTAN-II xc2s200 pq208 XC2S50 tq144 SPARTAN-II xc2s50 pq208 Spartan-II xc2s100 pin details XC2S50 XC2S100 XC2S150 xilinx XC17S00A DATE CODE MARKING
Contextual Info: 05 Spartan-II 2.5V FPGA Family: Introduction and Ordering Information R DS001-1 v2.4 September 3, 2003 Introduction Product Specification • The Spartan -II 2.5V Field-Programmable Gate Array family gives users high performance, abundant logic resources,

Contextual Info: XC2C32A CoolRunner-II CPLD R DS310 v1.8 March 20, 2006 Product Specification Features Description • The CoolRunner -II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment

COOLRUNNER-II ucf file

Abstract: COOLRUNNER-II examples XC9500XL XCR3064XL-PC44 CoolRunner XPLA3 CPLD Family COOLRUNNER-II XAPP150 DS012 DS090 XAPP382
Contextual Info: CPLD I/O User Guide UG445 v1.1 November 27, 2007 R R Xilinx is disclosing this Document and Intellectual Property (hereinafter “the Design”) to you for use in the development of designs to operate on, or interface with Xilinx FPGAs. Except as stated herein, none of the Design may be copied, reproduced, distributed, republished,

XC2C32A VQ44

Abstract: XC2C32A-6QFG32C XC2C32A-6VQG44C XC2C32A-6VQG44I XC2C32A-4VQG44C XC2C32A-6QFG32I LVCMOS15 LVCMOS25 LVCMOS33 XAPP427
Contextual Info: R DS310 v2.1 November 6, 2008 XC2C32A CoolRunner-II CPLD Product Specification Features Description • The CoolRunner -II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment

XC2S400E

Abstract: XC2S200E XC2S100E XC2S150E XC2S300E XC2S50E XC2S400-E XC2s600e XC2S600-E bga pin 676
Contextual Info: Spartan-IIE 1.8V FPGA Family: Introduction and Ordering Information R DS077-1 v2.1 July 9, 2003 Introduction Product Specification • The Spartan -IIE 1.8V Field-Programmable Gate Array family gives users high performance, abundant logic resources, and a rich feature set, all at an exceptionally low

Contextual Info: CPLD I/O User Guide UG445 v1.2 January 14, 2014 R R DISCLAIMER The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL

Contextual Info: R DS092 v3.0 November 30, 2005 XC2C64 CoolRunner-II CPLD Note: This product is being discontinued. You cannot order this part after April 24, 2006. Xilinx recommends replacing the XC2C64 device with the XC2C64A device in all designs as soon as possible. The XC2C64A device is

XC2C32A VQ44

Contextual Info: XC2C32A CoolRunner-II CPLD R DS310 v2.0 March 8, 2007 Product Specification Features Description • The CoolRunner -II 32-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment

Contextual Info: R DS091 v3.0 November 30, 2005 XC2C32 CoolRunner-II CPLD Note: This product is being discontinued. You cannot order this part after April 24, 2006. Xilinx recommends replacing the XC2C32 device with the XC2C32A device in all designs as soon as possible. The XC2C32A device is

XA2C128-8CPG132Q

Contextual Info: XA2C128 CoolRunner-II Automotive CPLD R DS554 v1.0 October 31, 2006 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over

LVCMOS33

Abstract: XA2C64A AEC-Q100 LVCMOS15 LVCMOS25 XAPP427 XA2C64A-8VQG44Q
Contextual Info: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.1 May 5, 2007 Features • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade • Guaranteed to meet full electrical specifications over TA = -40° C to +105° C with TJ Maximum = +125° C

vqg44

Contextual Info: XA2C64A CoolRunner-II Automotive CPLD R DS553 v1.0 October 31, 2006 Features • • • • • • AEC-Q100 device qualification and full PPAP support available in both I-grade and extended temperature Q-grade Guaranteed to meet full electrical specifications over

DS092

Abstract: LVCMOS15 LVCMOS25 LVCMOS33 XAPP427 XC2C64 XC2C64A VQ1001 5VQ10 G1142
Contextual Info: R DS092 v2.1 March 7, 2005 XC2C64 CoolRunner-II CPLD Note: This product is no longer recommended for new designs. It has been superseded by the XC2C64A, a device with I/O Banking and Pb-free package options. • • • Refer to the CoolRunner -II family data sheet for architecture description.

XC2C64A-7C

Abstract: XC2C64A-7CPG56I qfg48 dimensions XC2C64A-7QF
Contextual Info: XC2C64A CoolRunner-II CPLD R DS311 v2.0 March 20, 2006 Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and

CPLD XC2C64 from Xilinx CoolRunner-II family

Abstract: COOLRUNNER-II test circuit K8/50 marking g10 XC2C64-7VQ100C DS092 LVCMOS25 LVCMOS33 XAPP427 XC2C64
Contextual Info: R DS092 v1.8 October 7, 2004 XC2C64 CoolRunner-II CPLD Preliminary Product Specification Features Description • The CoolRunner-II 64-macrocell device is designed for both high performance and low power applications. This lends power savings to high-end communication equipment and