27C210L-12
Abstract: 27C210L WSI 57C257 57c257
Text: WAFER SCALE INTEGRATION 31E D ^53^=10 QOQQbt.3 h I lilAF WS27C210L PRELIMINARY WAFERSCALE INTEGRATION, INC. 1 Meg 64K x 16 CMOS EPROM KEY FEATURES • Ultra-High Performance • EPI Processing — 100 ns — Latch-Up Immunity to 200 mA — ESD Protection Exceeds 2000 Volts
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OCR Scan
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WS27C210L
WS27C210L
576-bit
to20J
WS27C210L-20L
WS27C210L-20LMB
MIL-STD-883C
27C210L-12
27C210L
WSI 57C257
57c257
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40 PIN CERDIP
Abstract: 1822-J WS27C210L12J 40-pin EPROM pinout WS27C210L12L
Text: WS27C210L LOW POWER 1 MEG 64K x 16 CMOS EPROM KEY FEATURES • High Performance CMOS — • • 100 ns Access Time * DESC SMD No. 5962-86805 JEDEC Standard Pin Configuration • Standby Current <100 EPI Processina — . . . Latch-Up Immunity to 200 mA
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OCR Scan
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WS27C210L
WS27C210L
40 PIN CERDIP
1822-J
WS27C210L12J
40-pin EPROM pinout
WS27C210L12L
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PDF
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Untitled
Abstract: No abstract text available
Text: WS27C210L LOW POWER 1 MEG 64K x 16 CMOS EPROM KEY FEATURES • High Performance CMOS • DESC SMD No. 5962-86805 • JEDEC Standard Pin Configuration — 100 ns Access Time • Standby Current <100 |jA — 40 Pin c e r d ip Package • EPI Processing — 44 Pin plastic Leaded Chip Carrier (PLDCC)
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OCR Scan
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WS27C210L
WS27C210L
self-aligned7C210L-12L
WS27C210L-12LI
WS27C210L-15D
WS27C210L-15J
WS27C210L-15L
00032MD
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