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    UP175A Search Results

    UP175A Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    UP175A National Semiconductor 175 Pin Molded Plastic Pin Grid Array Original PDF

    UP175A Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    UP175A

    Abstract: No abstract text available
    Text: 175 Pin Molded Plastic Pin Grid Array NS Package Number UP175A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


    Original     		PDF UP175A UP175A

    SmD TRANSISTOR a42

    Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
    Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


    Original     		PDF

    NS32532

    Abstract: U175A NS32032 lfsr fibonacci C1995 NS32381 NS32GX32-20 NS32GX32-25 NS32GX32-30
    Text: May 1991 NS32GX32-20 NS32GX32-25 NS32GX32-30 High-Performance 32-Bit Embedded System Processor General Description Features The NS32GX32 is a high-performance 32-bit embedded system processor in the Series 32000 family It is software compatible with the previous microprocessors in the family


    Original     		PDF NS32GX32-20 NS32GX32-25 NS32GX32-30 32-Bit NS32GX32 NS32532 U175A NS32032 lfsr fibonacci C1995 NS32381 NS32GX32-30

    vjp44a

    Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
    Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


    Original     		PDF MS011798 vjp44a MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		PDF MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		PDF MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray

    T03A

    Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
    Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


    Original     		PDF

    UP124A

    Abstract: UP159A UP175A
    Text: Plastic Pin Grid Array PPGA 124 Pin Molded Plastic Pin Grid Array NS Package Number UP124A 159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A 2000 National Semiconductor Corporation MS101166 www.national.com Plastic Pin Grid Array (PPGA) May 1999


    Original     		PDF UP124A UP159A MS101166 UP175A UP124A UP159A UP175A

    NS32GX32

    Abstract: No abstract text available
    Text: & PRELIMINARY May 1991 NS32GX32-20/NS32GX32-25/NS32GX32-30 High-Performance 32-Bit Embedded System Processor General Description Features The NS32GX32 is a high-performance 32-bit embedded system processor in the Series 32000* family. It is software compatible with the previous microprocessors in the family


    OCR Scan     		PDF NS32GX32-20/NS32GX32-25/NS32GX32-30 32-Bit NS32GX32 0-1B0-530 b5D112fl

    ic laf 0001

    Abstract: laf 0001 power p40x laf 0001 NS32032 berh NS32532 OBG 88 s3 trio NS32381
    Text: JUN ‘o PRELIMINARY April 1991 NS32GX32-20/NS32GX32-25/NS32GX32-30 High-Performance 32-Bit Embedded System Processor General Description Features The NS32GX32 is a high-performance 32-bit embedded system processor in the Series 32000 family. It is software


    OCR Scan     		PDF NS32GX32-20/NS32GX32-25/NS32GX32-30 32-Bit NS32GX32 ic laf 0001 laf 0001 power p40x laf 0001 NS32032 berh NS32532 OBG 88 s3 trio NS32381