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    TUNNEL DIODE SPICE MODEL Search Results

    TUNNEL DIODE SPICE MODEL Datasheets Context Search

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    TUNNEL DIODE

    Abstract: mbd1057 MBD3057 MBD2057 MBD-1057 Characteristics curve of diode TUNNEL DIODE spice model "tunnel diode" diode tunnel tunnel
    Contextual Info: 1 Spice Model for Metelics Tunnel Diode Spice does not contain a model for the Tunnel Diode. To correct this omission, use the macromodel shown below. Anode 1 C1 G1 Cathode (2) G1 models the reverse and forward bias IV curve. The model does not accurately represent the negative


    Original     		MBD1057 MBD1057 3E-12 7203328E-5 MBD2057 MBD3057 MBD4057 MBD5057 TUNNEL DIODE MBD-1057 Characteristics curve of diode TUNNEL DIODE spice model "tunnel diode" diode tunnel tunnel PDF

    Tunnel diode

    Abstract: MBD1057 DATASHEET TUNNEL DIODE "tunnel diode" MBD3057 TUNNEL DIODE spice model Characteristics curve of diode MBD2057 switch diode tunnel MBD-1057
    Contextual Info: Spice Model for Metelics Tunnel Diode 1 Spice does not contain a model for the Tunnel Diode. To correct this omission, use the macromodel shown below. E1, R1, D2 and G1 model the reverse bias curve and the forward bias curve through the valley. D1 models the forward bias curve beyond the valley. The model does not accurately represent the negative differential


    Original     		MBD1057 MBD1057 3E-12 263E-6 3533E-3 688E-3 Tunnel diode DATASHEET TUNNEL DIODE "tunnel diode" MBD3057 TUNNEL DIODE spice model Characteristics curve of diode MBD2057 switch diode tunnel MBD-1057 PDF

    spice model Tunnel diode

    Abstract: dpsN TUNNEL DIODE spice model
    Contextual Info: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation


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    CMOS

    Abstract: hv 102 mos fet transistor varactor diode model in ADS bsim3 ADS varactor diode 0.18 micron 1.8V pspice model BSIM3V3 bsim3 model bsim3 model for 0.18 micron technology for hspice N-Channel jfet 100V depletion
    Contextual Info: 0.6 m CMOS Process XC06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Mixed Signal Technology Description Key Features The XC06 Series completes X-FAB‘s 0.6 Micron Modular Mixed Signal Technology with embedded Non Volatile Memory and High Voltage options.


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    TUNNEL DIODE

    Abstract: oscillator tunnel diode "tunnel diode" oscillator "tunnel diode" tunnel diode application TUNNEL DIODE spice model DATASHEET TUNNEL DIODE Design Guidelines for Quartz Crystal Oscillators negative resistance amplifier oscillator tunnel diode datasheet
    Contextual Info: Crystal Oscillator Design And Negative Resistance by Anthony M Scalpi, Cypress Semiconductor Timing is a critical part of almost every electronics application. Communication and data transfer generally require a reference signal or source to enable system synchronization


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    hot wire anemometer

    Abstract: TA7802 G43-87 THE POWER OF MYTH JESD 51-7, ambient measurement FLUID level measurement kapton 5413 G30-88 G38-87 G42-88
    Contextual Info: u Chapter 5 Package Characterization CHAPTER 5 PACKAGE CHARACTERIZATION Introduction Terminology Measurement Methods Thermal Characterization Parameter ψJT Thermal Test Boards Thermal Data Reports Electrical Characterization Methodology Bond Wire Series Inductance and Resistance


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    high resolution reflective optocoupler

    Abstract: 894nm motion sensor doppler effect Balluff ROTARY ENCODER vcsel 1300nm VCSEL multimode 1300nm vcsel spice model motion DOPPLER 1550nm vcsels VCSEL
    Contextual Info: VCSELs in Various Sensor Applications By: Dr. Jim Tatum First published in Proceedings of Sensors Expo 2005 FINISAR CORPORATION January 9, 2007 Contents VCSEL 101 ƒ What is a VCSEL? Where is it used? Why? VCSEL Sensor Attributes ƒ Advantages, Uniqueness, etc.


    Original     		850nm 1300nm 780nm 1550nm 1999m 650nm 1550nm high resolution reflective optocoupler 894nm motion sensor doppler effect Balluff ROTARY ENCODER vcsel 1300nm VCSEL multimode 1300nm vcsel spice model motion DOPPLER 1550nm vcsels VCSEL PDF

    CMOS

    Contextual Info: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications


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    NMOS depletion pspice model

    Abstract: NMOS MODEL PARAMETERS SPICE "X-Fab" Core cell library PSPICE MODEL R2R bsim3 ADS bsim3 model SPECTRE MODEL QS 100 NPN Transistor RP20 analog devices transistor tutorials
    Contextual Info: 1.0 m CMOS Process XC10 MIXED-SIGNAL FOUNDRY EXPERTS One Micron Modular Mixed Signal Technology Description Key Features Applications Quality Assurance Deliverables The XC10 Series is X-FAB‘s One-Micron Modular Mixed Signal Technology. Main target applications


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    60 SMD 5050 Ultra Bright LEDs

    Abstract: MMA 0204 HV - Professional
    Contextual Info: Vishay Intertechnology, Inc. One of the World’s Largest Manufacturers of www.vishay.com Discrete Semiconductors and Passive Components To view datasheets of the products contained in the Engineer’s Toolbox, please visit www.vishay.com/ref/et1 Alternative


    Original     		VMN-MS6495-1011 60 SMD 5050 Ultra Bright LEDs MMA 0204 HV - Professional PDF

    LMC662 equivalent spice model

    Abstract: LMV211 LF356 FET input op-amp LF356 op-amp application fast photodiode amplifier photodiode amplifier AN1244 LF356 LF411 LMH6624
    Contextual Info: Photodiode Amplifiers: Changing Light Into Electricity INTRODUCTION [slide 1] MODERATOR: Hello and welcome to National Semiconductor’s Online Seminar. We recommend using Internet Explorer for viewing these events. Please select your preferred media player,


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    AN-1059

    Abstract: IRF6603 IRF6607 mathematical calculator chip PD-94574A
    Contextual Info: Application Note AN-1059 DirectFET Technology Thermal Model and Rating Calculator Table of Contents Page Introduction. 2 Equivalent circuits . 3 Thermal resistance values . 3


    Original     		AN-1059 AN-1059 IRF6603 IRF6607 mathematical calculator chip PD-94574A PDF

    AN1059

    Abstract: mathematical calculator chip AN-1059 IRF6601 IRF6602 IRF6603 IRF6604 IRF6607 IRF6608 IRF6618
    Contextual Info: Application Note AN-1059 DirectFET Thermal Model and Rating Calculator By Doug Butchers Table of Contents Page Introduction . 1 Thermal Circuit for DirectFETs in application . 1


    Original     		AN-1059 AN1059 mathematical calculator chip AN-1059 IRF6601 IRF6602 IRF6603 IRF6604 IRF6607 IRF6608 IRF6618 PDF

    OP-37 siemens

    Abstract: OPA371 OPA275 AD510 op372 ISO102 op37 spice OP07 "direct replacement" OP27 replacement OPA27P
    Contextual Info: OPA27 OPA37 OPA 27 OPA 27 Ultra-Low Noise Precision OPERATIONAL AMPLIFIERS FEATURES APPLICATIONS ● LOW NOISE: 4.5nV/√Hz max at 1kHz ● PRECISION INSTRUMENTATION ● LOW OFFSET: 100µV max ● LOW DRIFT: 0.4µV/°C ● DATA ACQUISITION ● TEST EQUIPMENT


    Original     		OPA27 OPA37 117dB 100dB OP-07, OP-05, AD510, AD517 OPA27/37 UAF42 OP-37 siemens OPA371 OPA275 AD510 op372 ISO102 op37 spice OP07 "direct replacement" OP27 replacement OPA27P PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    BFG95

    Contextual Info: Device Package User Guide UG112 v3.7 September 5, 2012 R R Notice of Disclaimer The information disclosed to you hereunder (the “Materials”) is provided solely for the selection and use of Xilinx products. To the maximum extent permitted by applicable law: (1) Materials are made available "AS IS" and with all faults, Xilinx hereby DISCLAIMS ALL


    Original     		UG112 UG072, UG075, XAPP427, BFG95 PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Contextual Info: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


    Original     		UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    induction cooker fault finding diagrams

    Abstract: induction cooker schematic diagram EDS SHIELD DOMESTIC GAS DETECTOR schematic diagram induction cooker 3 gun sound generator UM 3562 NEC plasma tv schematic diagram ultrasonic flaw detector LS 2027 Final Audio LS 2027 audio Ultrasonic humidifier circuit
    Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid


    Original     		C12769EJ2V0IF induction cooker fault finding diagrams induction cooker schematic diagram EDS SHIELD DOMESTIC GAS DETECTOR schematic diagram induction cooker 3 gun sound generator UM 3562 NEC plasma tv schematic diagram ultrasonic flaw detector LS 2027 Final Audio LS 2027 audio Ultrasonic humidifier circuit PDF

    ASX 12 D Germanium Transistor

    Abstract: 1394 audio subunit domino logic,dynamic logic ibm 6X86MX IBM-6x86MX Japan dvd cjc Transistor Data Book nand flash HET PR333 PR300 APPLE LM INVERTER
    Contextual Info: v ol 4 3 ume A publication of IBM Microelectronics IBM’s Blue Logic Strategy In This Issue Third Quarter 1998, Vol. 4, No.3 1 IBM’s Blue Logic Strategy 4 High-Speed Design Styles Leverage IBM Technology Prowess 8 Low-Power Methodology and Design Techniques


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    relay 12 volts ras 1210

    Abstract: GE-MOV 275L40B MOV GE V150 LA10 275l40b Disc ceramic capacitor GE 130L20 hahn transformer VDE 0551 ge 130l10 c106d spice HARRIS V481DB40 G1 capacitor 275L20
    Contextual Info: $5.00 Technical Assistance Transient Voltage Suppression Technical Assistance Electronic Technical Support Ask our experienced staff of engineers for assistance with: Electronic services from Littelfuse offer you the most current information possible. • Device Selection


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    TRANSISTOR ED203

    Abstract: FND10 MAN-3A 2N3980 LA 4301 do ic 4532A free germanium Germanium drift transistor texas instruments LED Display TIL epitaxial mesa
    Contextual Info: T H E O P T O E L E C T R O N IC S D A T A B O O K Few people in the electronics industry realize that optoelectronics technology has a history which precedes the invention of the integrated circuit. It is also a relatively unknown fact that Texas instruments was a pioneer in the


    OCR Scan     		1N2175 TRANSISTOR ED203 FND10 MAN-3A 2N3980 LA 4301 do ic 4532A free germanium Germanium drift transistor texas instruments LED Display TIL epitaxial mesa PDF

    JD 1803

    Abstract: philips diode PH 33D Schematics bosch AL 1450 DV bosch al 1450 dv JD 1803 52B jd 1803 IC jd 1803 data sheet quartz kds 9j shockley diode application Yokogawa yf 104
    Contextual Info: High-Frequenty Analog Integrated Cirtuit Design Edited by R a v en d er G oyal W ILEY SERIES IN MICROWAVE AND OPTICAL ENGINEERING K a i Chang Series Editor , INSUME OF MICROELECTRONICSUBßARY High-Frequency Analog Integrated-Circuit Design W ILEY SERIES IN MICROWAVE AN D O PTICAL


    OCR Scan     		PDF

    TMPRFE2G5

    Abstract: MARS2G5 bey34 DIODE BA40 LVTTL25
    Contextual Info: Hardware Design Guide September 8, 2004 MARS2G5 P-VC-XTRM TMPRFE2G5 Datamapper 2488/622/155 Mbits/s SONET/SDH x 10/100/1000 Mbits/s Ethernet 1 Introduction The documentation package for the Datamapper device consists of the following documents, available on a password protected website:


    Original     		DS04-011MPIC TMPRFE2G5 MARS2G5 bey34 DIODE BA40 LVTTL25 PDF