Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TSOP PACKAGE Search Results

    TSOP PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5 Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    TSOP PACKAGE Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    tsop series

    Abstract: TSOP-16 TSOP tsop datasheet mitsumi transistor 20a mitsumi 22 TSOP-20A
    Text: Package MITSUMI Packages TSOP Series Units : mm TSOP-16B 0.15+0.10 -0.05 5.0±0.3 0.5±0.2 9 4.4±0.2 16 1 8 0.65 0~10° 0.10 0.22±0.10 TSOP-20A TSOP-24A 0.10 0.10±0.05 1.1±0.1 (1.0) 0.525 max. 6.4±0.3 TSOP-16A


    Original     		TSOP-16B TSOP-20A TSOP-24A TSOP-16A tsop series TSOP-16 TSOP tsop datasheet mitsumi transistor 20a mitsumi 22 TSOP-20A PDF

    atmel 134

    Abstract: TSOP 28 SPI memory Package 3316F tsop 17 atmel tsop
    Text: DataFlash TSOP Migration Path This application note describes how one can design a single PCBA to accommodate the full range of DataFlash products offered in the TSOP package. A board can be laid out for a larger TSOP e.g., 40-lead TSOP and smaller TSOP packages can be


    Original     		40-lead 28-lead 32-lead 3316F atmel 134 TSOP 28 SPI memory Package tsop 17 atmel tsop PDF

    TSOP 48 LAYOUT

    Abstract: TSOP 28 SPI memory Package tsop 38 atmel 134
    Text: DataFlash TSOP Migration Path This application note describes how one can design a single PCBA to accommodate the full range of DataFlash products offered in the TSOP package. A board can be laid out for a larger TSOP e.g., 48-lead TSOP and smaller TSOP packages can be


    Original     		48-lead 28-lead 32-lead, 40-lead 3316E TSOP 48 LAYOUT TSOP 28 SPI memory Package tsop 38 atmel 134 PDF

    TSOP-20A

    Abstract: TSOP-16A
    Text: MITSUMI Packages Packages Units : mm SSOP-24A TSOP-16A TSOP-20A


    Original     		SSOP-24A TSOP-16A TSOP-20A TSOP-20A TSOP-16A PDF

    tsop6

    Abstract: TSOP-6 SI3443DV TSOP-6 Marking Marking information part marking information 036 marking TSOP66
    Text: Si3443DV Package Outline TSOP-6 Part Marking Information TSOP-6 6 www.irf.com


    Original     		Si3443DV tsop6 TSOP-6 TSOP-6 Marking Marking information part marking information 036 marking TSOP66 PDF

    land pattern for TSOP

    Abstract: land pattern for TSOP 2 land pattern for TSOP 2 50 TSOP 50 Package land pattern for tsop package
    Text: Recommended Land Pattern for SST TSOP Devices Recommended Land Pattern for SST TSOP Devices Application Note October 2001 INTRODUCTION Designing in the 8mm x 14mm TSOP Package SST offers an 8mm x 14mm TSOP package for our bulk erase, Byte-Program SuperFlash MTP products and the


    Original     		S72015-02-000 land pattern for TSOP land pattern for TSOP 2 land pattern for TSOP 2 50 TSOP 50 Package land pattern for tsop package PDF

    H2JTDG8UD2MBR

    Abstract: H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix
    Text: Page 1 Product Tech Density Block Size Stack Vcc/ Org Package Availability HY27US08281A 9xnm class 128Mb 16KB SDP 3.3v/ X8 TSOP Now HY27US08561A 9xnm class 256Mb 16KB SDP 3.3v/ X8 TSOP/ FBGA Now H27U518S2C 5xnm class 512Mb 16KB SDP 3.3v/ X8 TSOP/ LGA Now H27U1G8F2B


    Original     		HY27US08281A 128Mb HY27US08561A 256Mb H27U518S2C 512Mb H27U1G8F2B 128KB H27S1G8F2B H2JTDG8UD2MBR H26M42003GMR H26M31003GMR H26M52002EQR H26M64002DQR H26M78003BFR H26M3100 H26M52002CKR H26M21001FPR H26M* hynix PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
    Text: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate


    Original     		MS-024 TSOP 48 thermal resistance TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024 PDF

    2fu smd transistor

    Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
    Text: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR


    Original     		TC55V1001ASTI/ASRI TC55V2001STI/SRI TC55V020FT/TR TC55V2161FTI TC55V200FT/TR TC55V040FT/TR TC55V400FT/TR TC58VT TC75S55FU 2fu smd transistor Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT PDF

    2 pin male connector 5mm pitch

    Abstract: tsop 48 PIN SOCKET CLIP-048-TS01-FLEX TSOP 48 socket TSOP 50 socket TSOP 56 socket HASL board TS02 TS04 TSOP 48 Package
    Text: TSOP Clip TSOP Clip™ CLIP-048-TS01-FLEX Introducing the first clip designed especially for TSOP packages w w w w w World Leader in Adapters, Clips, and Test Accessories Minimum clearance of .030" 0.76mm for side-by-side connection Uses directionally conductive elastomeric connectors instead of pins


    Original     		CLIP-048-TS01-FLEX 56-pin AX-48-TS01-FLEX CLIP048TS01MALE AX-48-TS01 CLIP-048-TS01 DOD-5007) 2 pin male connector 5mm pitch tsop 48 PIN SOCKET CLIP-048-TS01-FLEX TSOP 48 socket TSOP 50 socket TSOP 56 socket HASL board TS02 TS04 TSOP 48 Package PDF

    TSOP 32 socket

    Abstract: Yamaichi socket adapters Intel 48 TSOP Yamaichi SSOP socket adapters wand intel manual TSOP 48 socket
    Text: SOCKETS/SOCKET TOOLS INTEL TSOP Precision Vacuum Wand • ■ ■ ■ ■ ■ ■ Reduces bent leads Increases process throughput time Minimizes handling Utilizes guide pins Eliminates manual alignments Works with Yamaichi* TSOP sockets and Intel TSOP trays


    Original     		flashwandkit/807908 TSOP 32 socket Yamaichi socket adapters Intel 48 TSOP Yamaichi SSOP socket adapters wand intel manual TSOP 48 socket PDF

    SIGNETICS

    Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
    Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches


    Original     		12x20 SIGNETICS JEDEC tray standard 13 Signetics OR Mullard package tray outline signetics data PDF

    pd0008

    Abstract: tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST
    Text: PD0008 Packing information Tray for TSOP packages type 1 Introduction TSOP type-1 packages can be supplied in tray packing. Refer to Table 1 for the list of TSOP type-1 packages supplied in trays. The objective of this document is provide a detailed description of the tray. It applies to all


    Original     		PD0008 105cm. PD0008 tray 8 x 8 TSOP TRAY 40 PIN TSOP package tray N1N213 Package and Packing Information ST PDF

    TSOP 48 thermal resistance

    Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
    Text: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead


    Original     		12x20 TSOP 48 thermal resistance TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48 PDF

    TSOP 86 Package

    Abstract: A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin
    Text: 1999 DRAM Design Guidelines Options Package Width Data Rate Voltage I/O 16Mb 64Mb 128Mb 256Mb Clock MHz 1 54 TSOP x4 SDR 3.3V LVTTL na 16Mx4 32Mx4 64Mx4 PC100/133 2 54 TSOP x8 SDR 3.3V LVTTL na 8Mx8 16Mx8 32Mx8 PC100/133 3 54 TSOP x16 SDR 3.3V LVTTL na 4Mx16 8Mx16 16Mx16


    Original     		128Mb 256Mb 16Mx4 32Mx4 64Mx4 PC100/133 16Mx8 32Mx8 4Mx16 TSOP 86 Package A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin PDF

    KM416S8030BN

    Abstract: KM416S8030B
    Text: shrink-TSOP KM416S8030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 Aug. 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.1 Aug. 1999 shrink-TSOP


    Original     		KM416S8030BN 128Mb 16Bit A10/AP KM416S8030BN KM416S8030B PDF

    Untitled

    Abstract: No abstract text available
    Text: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP


    Original     		KM44S32030AN 128Mb KM44S32030AT, 54-sTSOP PDF

    Untitled

    Abstract: No abstract text available
    Text: shrink-TSOP KM48S16030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 shrink-TSOP


    Original     		KM48S16030BN 128Mb A10/AP PDF

    M312L5623MTS

    Abstract: TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3
    Text: 2GB TSOP Registered DIMM Preliminary DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 1Gb M-die with 1,200mil Height & 72-bit ECC Revision 0.0 February 2004 Revison 0.0 February, 2004 2GB TSOP Registered DIMM Preliminary


    Original     		184pin 200mil 72-bit M312L5620MTS-CB3/A2/B0 M312L5623MTS-CB3/A2/B0 256Mx4( K4H1G0438M) 128Mx8( K4H1G0838M) M312L5623MTS TSOP 173 g M312L5620MTS-CB3 m312l5623mts-cb3 PDF

    TSOP package tray

    Abstract: JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1
    Text: TRAY CONTAINER 119.9 HEAT PROOF 7 135° CMAX PPE A' 8.15 10.90 8.00 A NEC TSOP 1 8x13.4 12×18=216 17.20 11.30 13.74 292.4 315.0 (322.6) SECTION A – A' 13.74 5.62 (6.35) 10.00 7.62 135.9 UNIT : mm Applied Package 28-pin Plastic TSOP (I) (8×13.4) 32-pin Plastic TSOP (I) (8×13.4)


    Original     		28-pin 32-pin SSD-A-H7033-1 TSOP package tray JEDEC TRAY DIMENSIONS tsop 28 PIN tray JEDEC tray standard tsop TSOP I SSD-A-H7033-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: 512MB, 1GB, 2GB TSOP Registered DIMM DDR SDRAM DDR SDRAM Registered Module TSOP-II 184pin Registered Module based on 512Mb B-die with 1,700 / 1,200mil Height & 72-bit ECC Revision 1.0 December. 2003 Revison 1.0 December, 2003 512MB, 1GB, 2GB TSOP Registered DIMM


    Original     		512MB, 184pin 512Mb 200mil 72-bit M383L6523BTS- PDF

    48-PIN

    Abstract: FBGA048-P-0808 LH28F800BGH-L LH28F800BG-L TSOP048-P-1220
    Text: SHARP LH28F800BG-L/BGH-L FOR TSOP, CSP LH28F800BG-L/BGH-L (FOR TSOP, CSP) CONTENTS DESCRIPTION. 447 COMPARISON TABLE. 448


    OCR Scan     		LH28F800BG-L/BGH-L OPERAT85 48-pin TSOP048-P-1220) 48-ball FBGA048-P-08Ã LH28F800BGXX-XL85 FBGA048-P-0808 LH28F800BGH-L LH28F800BG-L TSOP048-P-1220 PDF

    Untitled

    Abstract: No abstract text available
    Text: c Mounting pad of TSOP (type I) The nominal dimensions of the TSOP (thin small outline package) (type I) are determined by the combination of the width of the plastic body (E) and the total length (HD). For example, “32-pin 8 x 20 TSOP (type I)” means that the package width is 8 mm, and that the total


    Original     		32-pin P28GW-55-9JL-1 P28GW-55-9KL-1 S32GX-50-EJA-1 S32GX-50-EKA-1 S32GZ-50-KJH-3 S32GZ-50-KKH-3 P32GU-50-9JH P32GU-50-9KH S40GZ-50-LJH-2 PDF

    PA32TS14-OT

    Abstract: 32TS14
    Text: PA32TS14-OT Data Sheet 32 pin TSOP socket/32 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA32TS14-OT adapter converts the pinout of a 32 pin TSOP device to its 32 pin DIP equivalent. It accepts the TSOP device and plugs into a DIP socket.


    Original     		PA32TS14-OT socket/32 E28F010 32TS14 PDF