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    TSOP 44 PACKAGE Search Results

    TSOP 44 PACKAGE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation
    XPH2R106NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 110 A, 0.0021 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    XPH3R206NC Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 70 A, 0.0032 Ω@10V, SOP Advance(WF) Visit Toshiba Electronic Devices & Storage Corporation
    TPH4R008QM Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 86 A, 0.004 Ohm@10V, SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation

    TSOP 44 PACKAGE Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TSOP44 Package Unknown Scan PDF

    TSOP 44 PACKAGE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TSOP 44 Package

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) * : Resin protrusion. (Each side : 0.15 (.006) Max) 44-pin plastic TSOP (II)


    Original     		PDF FPT-44P-M18 400mil 44-pin FPT-44P-M18) F44025S-1C-1 120mil TSOP 44 Package

    FPT-44P-M08

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M08 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-44P-M08) 44-pin plastic TSOP (II) (FPT-44P-M08)


    Original     		PDF FPT-44P-M08 44-pin FPT-44P-M08) F44017S-1C-2 FPT-44P-M08

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18) 44-pin plastic TSOP (II) (FPT-44P-M18)


    Original     		PDF FPT-44P-M18 44-pin FPT-44P-M18) F44025S-1C-1

    29f800 29f400

    Abstract: No abstract text available
    Text: PA48TS29F Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of AMD flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While these devices are not available in 44 pin DIP


    Original     		PDF PA48TS29F socket/44 29F100 29F200 29F400 29F800 29f800 29f400

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M17 44-pin plastic TSOP II Lead pitch 0.80mm Package width 300mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M17) 44-pin plastic TSOP (II) (FPT-44P-M17) * : Resin protrusion. (Each side : 0.15 (.006) Max)


    Original     		PDF FPT-44P-M17 300mil 44-pin FPT-44P-M17) F44024S-2C-1

    TSOP044-P-0400-1

    Abstract: MAX4435
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold 44-pin plastic TSOP II (FPT-44P-M07) 44-pin plastic TSOP (II)


    Original     		PDF FPT-44P-M07 TSOP044-P-0400-1 44-pin FPT-44P-M07) TSOP044-P-0400-1 MAX4435

    TSOP044-P-0400-3

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M09 EIAJ code : TSOP044-P-0400-3 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Normal bend Sealing method Plastic mold (FPT-44P-M09) 44-pin plastic TSOP (II)


    Original     		PDF FPT-44P-M09 TSOP044-P-0400-3 44-pin FPT-44P-M09) TSOP044-P-0400-3

    29F800 equivalent

    Abstract: No abstract text available
    Text: PA48TS29F-800 Data Sheet 48 pin TSOP socket/44 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction The PA48TS29F adapter converts the pinout of the AMD 29F800 flash memories in 48 pin TSOP packages to the 44 pin DIP equivalent. While this device is not available in 44 pin DIP


    Original     		PDF PA48TS29F-800 socket/44 PA48TS29F 29F800 29F800 29F100, 29F800 equivalent

    BGA and QFP Package mounting

    Abstract: THIN QUAD FLAT L-LEADED PACKAGE PLASTIC BGA and QFP Package 70SOP BGA 256 PACKAGE power dissipation ceramic QFP Package 100 lead
    Text: 1. PACKAGE CLASSIFICATIONS 2 Surface mounting type package Type Package Types Package Symbol Pin count MS 8, 16 GS 24, 28, 32, 40, 44 MS 20 GS 28, 30, 32, 60, 64, 70 SOP SSOP GS-B TSOP TypeI) TSOP (TypeII) TS QFP GS-2 Plastic GS-B 26/20, 26/24, 28/24, 28, 44/40, 44, 48,


    Original     		PDF

    2fu smd transistor

    Abstract: Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT
    Text: Memory MOS Memory Lineup • Static RAM Capacity bits Device TC55V1001ASTI/ASRI 1M Organization Access time (ns) Power supply voltage (V) 128 K X 8 TC55V2001STI/SRI Package Pins TSOP(8 X 13.4) 32 TSOP- (10 X 14) 40 TSOP- (0.4 inch) 44 256 K X 8 TC55V020FT/TR


    Original     		PDF TC55V1001ASTI/ASRI TC55V2001STI/SRI TC55V020FT/TR TC55V2161FTI TC55V200FT/TR TC55V040FT/TR TC55V400FT/TR TC58VT TC75S55FU 2fu smd transistor Infrared sensor TSOP 1738 diode ESM 765 tsop Ir sensor smd 1608 TSOP44 Package layout TSOP infrared infrared sensor (TSOP 1738)data sheet Compact High-Current and Low VF Surface Mounting Device SBD TC58V16BFT

    TSOP Type II

    Abstract: 9749 cel 9200 140C 8361H JESD22 Cypress 44LD
    Text: Cypress Semiconductor Qualification Report QTP# 97491, Version 1.0 March, 1998 44 Ld TSOP Type II OSE, Taiwan Assembly Cypress Semiconductor Assembly: OSE, Taiwan Assembly Package: 44Ld TSOP Type II QTP# 97491, V. 1.0 2 of 4 March, 1998 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


    Original     		PDF 8361H JESD22-A112 CY7C1021-ZSC 619708844L 619708845L TSOP Type II 9749 cel 9200 140C 8361H JESD22 Cypress 44LD

    84-1LMI

    Abstract: Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity
    Text: Cypress Semiconductor Qualification Report QTP# 97205 VERSION 1.0 September, 1997 44 Ld, 400 mil TSOP Type II Package Hyundai-Korea Assembly Cypress Semiconductor Assembly: Hyndai, Korea Package: TSOP Type II QTP# 97205 V. 1.0 Page2 of 4 June, 1997 PLASTIC PACKAGE/ASSEMBLY DESCRIPTION


    Original     		PDF 400-mil S320CR 84-1LMI Gold1021-ZSC CY7C1021-ZSC 84-1LMI Ablebond 84-1LMI TSOP 48 thermal resistance Ablebond 841LMI 140C JESD22 moisture sensitivity

    tsop II 44

    Abstract: TSOP 44-40 Package 44P3W-R
    Text: 44P3W-R Plastic 44pin 400mil TSOP EIAJ Package Code TSOP II 44/40-P-400-0.80 JEDEC Code – Weight(g) 0.47 Lead Material Alloy 42 e b2 l2 F 32 23 ME 35 Recommended Mount Pad E Symbol 1 10 13 A 22 c L D L1 HE 44 e y b A2 Detail F A A1 A2 b c D E e HE L


    Original     		PDF 44P3W-R 44pin 400mil 44/40-P-400-0 tsop II 44 TSOP 44-40 Package 44P3W-R

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M10 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Reverse bend


    Original     		PDF FPT-44P-M10 44-pin FPT-44P-M10) F44015S-1C-2

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M18 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M18)


    Original     		PDF FPT-44P-M18 44-pin FPT-44P-M18) F44025S-1C-1

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M17 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 300 mil Lead shape Gullwing Sealing method Plastic mold (FPT-44P-M17)


    Original     		PDF FPT-44P-M17 44-pin FPT-44P-M17) F44024S-2C-1

    TSOP044-P-0400-1

    Abstract: TSOP04 MAX4435 FPT-44P-M07
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Normal bend Sealing method


    Original     		PDF FPT-44P-M07 TSOP044-P-0400-1 44-pin FPT-44P-M07) heigh04) F44016S-1C-2 TSOP044-P-0400-1 TSOP04 MAX4435 FPT-44P-M07

    725004

    Abstract: FPT-44P-M08 MAX4435
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC FPT-44P-M08 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-44P-M08)


    Original     		PDF FPT-44P-M08 44-pin FPT-44P-M08) F44017S-1C-2 F44017S-1C-2 725004 FPT-44P-M08 MAX4435

    Untitled

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 44 PIN PLASTIC FPT-44P-M10 44-pin plastic TSOP II Lead pitch 0.80mm Package width 10.16mm Lead shape Gullwing Lead bend direction Reverse bend Sealing method Plastic mold (FPT-44P-M10) * : Resin protrusion. (Each side : 0.15 (.006) Max)


    Original     		PDF FPT-44P-M10 44-pin FPT-44P-M10) F44015S-1C-2

    TSOP 86 Package

    Abstract: tsop 86
    Text: SMALL OUTLINE L-LEADED PACKAGE 86 PIN PLASTIC FPT-86P-M01 86-pin plastic TSOP II Lead pitch 0.50mm Package width 400mil Lead shape Gullwing Sealing method Plastic mold (FPT-86P-M01) 86-pin plastic TSOP (II) (FPT-86P-M01) 86 44 Details of "A" part 0.25(.010)


    Original     		PDF FPT-86P-M01 400mil 86-pin FPT-86P-M01) F86001S-1C-1 TSOP 86 Package tsop 86

    Untitled

    Abstract: No abstract text available
    Text: Package Dimensions 44-pin Plastic TSOP - Type II T N E H 1 D SEATING PLANE A L B e α A1 T Inches Millimeters No. Pins 44 44 Symbol Min Nom Max Min Nom Max A 0.039 — 0.047 1.00 — 1.20 A1 0.002 — 0.008 0.05 — 0.20 B 0.012 0.014 0.016 0.30 0.35 0.40


    Original     		PDF 44-pin

    TSOP044-P-0400-1

    Abstract: MAX4435
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 44 PIN PLASTIC To Top / Package Lineup / Package Index FPT-44P-M07 EIAJ code : TSOP044-P-0400-1 44-pin plastic TSOP II Lead pitch 0.80 mm Package width 10.16 mm Lead shape Gullwing Lead bend direction


    Original     		PDF FPT-44P-M07 TSOP044-P-0400-1 44-pin FPT-44P-M07) F44016S-1C-2 TSOP044-P-0400-1 MAX4435

    Untitled

    Abstract: No abstract text available
    Text: MEMORY ICS FUNCTION GUIDE 2. PRODUCT GUIDE Density 4M bit Org. Power Supply 512KX 3 5V±10% Part Number KM29N040T Speed Features Package = 32B Page Mode 4KB Block size 44 40 TSOP II 256B Page Mode 4KB Block size 44(40) TSOP II tR 15US tR C = 1 2 0 n s 3.3V±10%


    OCR Scan     		PDF 512KX KM29N040T KM29V040T KM29N16000T/R KM29N16000TS/RS KM29N16000ET/ER KM29N16000ETS/ERS KM29N16000AT/AR KM29N16000ATS/ARS KM29V16000AT/AR

    Untitled

    Abstract: No abstract text available
    Text: 16 M E G :x4,x8 MICRON I TECHNOLOGY, INC. Q FEATURES 44-Pin TSOP x4 NC DQ0 NC DQ1 - MARKING 4M 4 2M 8 - - • W RITE Recovery OWR/tDPL *WR = 1 CLK *WR = 2 CLK C on tact facto ry for availability.) Al A2 • Plastic Package - OCPL 44-pin TSOP (400 mil) Note:


    OCR Scan     		PDF 44-Pin 096-cycle