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    TS15B Price and Stock

    Advanced Thermal Solutions Inc ATS-15B-07-C2-R0

    HEATSINK 45X45X12.7MM XCUT T766
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ATS-15B-07-C2-R0 Tray 25 1
    • 1 $4.01
    • 10 $3.901
    • 100 $3.7124
    • 1000 $3.7124
    • 10000 $3.7124
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    Advanced Thermal Solutions Inc ATS-15B-32-C2-R0

    HEATSINK 57.9X36.83X11.43MM T766
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    DigiKey ATS-15B-32-C2-R0 Bulk 25 1
    • 1 $5.94
    • 10 $5.777
    • 100 $5.94
    • 1000 $5.94
    • 10000 $5.94
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    Advanced Thermal Solutions Inc ATS-15B-09-C2-R0

    HEATSINK 45X45X20MM XCUT T766
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    DigiKey ATS-15B-09-C2-R0 Tray 25 1
    • 1 $4.08
    • 10 $3.975
    • 100 $4.08
    • 1000 $4.08
    • 10000 $4.08
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    Advanced Thermal Solutions Inc ATS-15B-10-C2-R0

    HEATSINK 45X45X25MM XCUT T766
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ATS-15B-10-C2-R0 Tray 25 1
    • 1 $4.2
    • 10 $4.09
    • 100 $4.2
    • 1000 $4.2
    • 10000 $4.2
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    Advanced Thermal Solutions Inc ATS-15B-34-C2-R0

    HEATSINK 57.9X36.83X22.86MM T766
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey ATS-15B-34-C2-R0 Bulk 25 1
    • 1 $6.23
    • 10 $6.058
    • 100 $6.23
    • 1000 $6.23
    • 10000 $6.23
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    Find more TS15B price and stock on Findchips.com

    TS15B Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    TS15B National Semiconductor TS15B 15 Lead Molded TO-263 Original PDF
    TS(15)B-SQ JST Manufacturing Connector: Wire to Board Connector: HDR: 15: 2.54: RATHRU Original PDF

    TS15B Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TS15B

    Abstract: No abstract text available
    Text: 15 Lead Molded TO-263 NS Package Number TS15B All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


    Original     		PDF O-263 TS15B TS15B

    SmD TRANSISTOR a42

    Abstract: TRANSISTOR BC 136 TRANSISTOR BC 157 transistor BC 945 TRANSISTOR BC 187 SNA10A TRANSISTOR BC 413 MO-220-WGGD-2 pdf on BC 187 TRANSISTOR MO-220-WKKD-2
    Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


    Original     		PDF

    JAPAN transistor

    Abstract: TO263 transistor TS11B to263-7 TS5B TS15B TS7B to-263
    Text: Transistor Outline TO-263 3 Lead Molded TO-263 NS Package Number TS3B 2000 National Semiconductor Corporation MS101190 www.national.com Transistor Outline (TO-263) May 1999 Transistor Outline (TO-263) 5 Lead Molded TO-263 NS Package Number TS5B www.national.com


    Original     		PDF O-263) O-263 MS101190 JAPAN transistor TO263 transistor TS11B to263-7 TS5B TS15B TS7B to-263

    vjp44a

    Abstract: MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd
    Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


    Original     		PDF MS011798 vjp44a MO-16B-AB TA11B TF11B cu50 ad 153 transistor transistor bd 905 transistor BC 185 mkt 344 MS-026-bcd

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		PDF MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		PDF MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray

    T03A

    Abstract: TO-202 transistor mkt 344 Cu50 TRANSISTOR BC 136 MTL 728 MS-026-bcd M03A BD 669 V84A
    Text: Plastic Package Dimensional/Thermal Data The following table identifies all of the plastic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the plastic packages


    Original     		PDF