TQFN 48 7X7
Abstract: MAX3987 4340X
Text: MAX3987 RELIABILITY REPORT FOR MAX3987ETM+ PLASTIC ENCAPSULATED DEVICES January 27, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX3987
MAX3987ETM+
/-4000V
JESD22-A114.
/-100mA
JESD78.
TQFN 48 7X7
MAX3987
4340X
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Untitled
Abstract: No abstract text available
Text: MAX2064 RELIABILITY REPORT FOR MAX2064ETM+ PLASTIC ENCAPSULATED DEVICES January 18, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Operations Maxim Integrated Products. All rights reserved.
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MAX2064
MAX2064ETM+
JESD22A114.
100mA
JESD78.
SXMZBQ001E,
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Untitled
Abstract: No abstract text available
Text: MAX14830 RELIABILITY REPORT FOR MAX14830ATM+ PLASTIC ENCAPSULATED DEVICES June 10, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX14830
MAX14830ATM+
/-2500V
JESD22A114.
/-100mA
JESD78.
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MAX2135A
Abstract: 56-pin 7x7 QFN Tuner dvb-t I2C program DVB-T Tuner I2C program
Text: MAX2135A RELIABILITY REPORT FOR MAX2135AETN+ PLASTIC ENCAPSULATED DEVICES March 04, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Don Lipps Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.
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MAX2135A
MAX2135AETN+
96hrs.
C/150
MAX2135A
56-pin 7x7 QFN
Tuner dvb-t I2C program
DVB-T Tuner I2C program
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Untitled
Abstract: No abstract text available
Text: MAX5885 RELIABILITY REPORT FOR MAX5885EGM+D PLASTIC ENCAPSULATED DEVICES July 19, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX5885
MAX5885EGM
/-2500V
/-250mA.
QM80BQ002D,
QM80BQ002C,
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Untitled
Abstract: No abstract text available
Text: MAX19705 RELIABILITY REPORT FOR MAX19705ETM+ PLASTIC ENCAPSULATED DEVICES November 29, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX19705
MAX19705ETM+
QJBABQ002B
/-2500V
JESD22-A114.
/-250mA.
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MAX1781
Abstract: maxim max1781 MAX1781ETM max1781etm data 320x2 MAX1781ETM+
Text: MAX1781 RELIABILITY REPORT FOR MAX1781ETM+ PLASTIC ENCAPSULATED DEVICES July 8, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX1781
MAX1781ETM+
InformaESD22-A114.
/-250mA.
TML1J2435A,
TML1J2260C,
MAX1781
maxim max1781
MAX1781ETM
max1781etm data
320x2
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AP07-1
Abstract: No abstract text available
Text: MAX16920B RELIABILITY REPORT FOR MAX16920BATJ/V+ PLASTIC ENCAPSULATED DEVICES May 9, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX16920B
MAX16920BATJ/V+
JESD22-A114
JESD22-C101
100mA
JESD78.
AP07-1
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AP07-1
Abstract: No abstract text available
Text: MAX16920 RELIABILITY REPORT FOR MAX16920BATJ/V+T PLASTIC ENCAPSULATED DEVICES April 14, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Richard Aburano Quality Assurance Manager, Reliability Engineering Maxim Integrated Products. All rights reserved.
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MAX16920
MAX16920BATJ/V
JESD22-A114
JESD22-C101
100mA
JESD78.
AP07-1
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JESD22-A114-D
Abstract: No abstract text available
Text: MAX2034CTM+ RELIABILITY REPORT FOR MAX2034CTM+ PLASTIC ENCAPSULATED DEVICES January 7, 2009 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Ken Wendel Quality Assurance Director, Reliability Engineering Maxim Integrated Products. All rights reserved.
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MAX2034CTM+
1000hrs.
C/150
JESD22-A114-D
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S45 sensor
Abstract: C0801 TQFN 48 7X7
Text: MAXQ7666 RELIABILITY REPORT FOR MAXQ7666BATM+ PLASTIC ENCAPSULATED DEVICES February 8, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAXQ7666
MAXQ7666BATM+
/-2500V
JESD22-A114.
/-100mA.
MAXQ7666AATM+
S45 sensor
C0801
TQFN 48 7X7
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Untitled
Abstract: No abstract text available
Text: MAX1058 RELIABILITY REPORT FOR MAX1058BETM+ PLASTIC ENCAPSULATED DEVICES September 12, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX1058
MAX1058BETM+
IEQ0BQ003B
/-2000V
/-250mA.
IEQ0FQ003A,
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Untitled
Abstract: No abstract text available
Text: MAX19707 RELIABILITY REPORT FOR MAX19707ETM+ PLASTIC ENCAPSULATED DEVICES May 25, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX19707
MAX19707ETM+
QJBCBQ002B
CA21-2
/-2500V
JESD22-A114.
/-250mA.
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Untitled
Abstract: No abstract text available
Text: MAX19700 RELIABILITY REPORT FOR MAX19700ETM+ PLASTIC ENCAPSULATED DEVICES January 4, 2011 MAXIM INTEGRATED PRODUCTS 120 SAN GABRIEL DR. SUNNYVALE, CA 94086 Approved by Sokhom Chum Quality Assurance Reliability Engineer Maxim Integrated Products. All rights reserved.
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MAX19700
MAX19700ETM+
QJBDBA005A
CA21-3
/-2500V
JESD22-A114.
/-250mA.
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TQFP 100 pin ic
Abstract: tqfp 7x7 1.4 tray tqfp 7x7 tray MS-026 JEDEC tray standard 17 x 17 tqfp 64 thermal resistance MS-026 TQFP TQFP Package 44 lead tqfp 32 thermal resistance CO-124
Text: LEADFRAME data sheet TQFP Features: Thin Quad Flat Pack TQFP Packages: Amkor offers a broad line of TQFP IC packages. IC packaging engineers, component specifiers and systems designers will find our TQFPs help to solve issues such as increasing board density, die shrink
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MS-026
TQFP 100 pin ic
tqfp 7x7 1.4 tray
tqfp 7x7 tray
MS-026
JEDEC tray standard 17 x 17
tqfp 64 thermal resistance
MS-026 TQFP
TQFP Package 44 lead
tqfp 32 thermal resistance
CO-124
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MS-026 lqfp 80
Abstract: DS170G MS-026 JEDEC Matrix Tray outlines LQFPPOWERQUAD2 CS-007
Text: LEADFRAME data sheet LQFP PowerQuad 2 Features: LQFP PowerQuad® 2 Packages: LQFP PowerQuad® 2 PQ2 is the same Amkor patented, advanced IC packaging technology used in plastic QFPs but applied to Low Profile 1.4 mm QFPs (LQFP). This breakthrough in IC packaging
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JEDEC MS-026
Abstract: MS-026 Amkor mold compound lqfp 7x7 tray jedec MS-026-A
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
JEDEC MS-026
MS-026
Amkor mold compound
lqfp 7x7 tray
jedec MS-026-A
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lqfp 7x7 tray
Abstract: MS-026 7X748LD amkor
Text: LEADFRAME data sheet LQFP Features: Low Profile Quad Flat Pack LQFP Packages: Amkor offers a broad line of LQFP IC packages designed to provide the same great benefits as MQFP packaging with a 1.4 mm body thickness. This allows IC packaging engineers, component specifiers and systems designers
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MS-026
lqfp 7x7 tray
MS-026
7X748LD
amkor
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IPC-7527
Abstract: PCB design for 0.2mm pitch csp package IPC7527 tssop 16 exposed pad stencil metcal VPI-1000 qfn 44 PACKAGE footprint 7x7 DIe Size qfn 48 7x7 stencil QFN 16 CARSEM package outline QFN 8 CARSEM APR-5000
Text: MLP Application Note APPLICATION NOTE Comprehensive User’s Guide April 2002 April 2002 Cover Page Page MLP Application Note CONTENTS 1.0 1.1 THE CARSEM MICRO LEADFRAME PACKAGE MLP Introduction 2.0 2.1 MANUFACTURING CONSIDERATIONS SMT Process 3.0 3.1 3.2
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses
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DUAL ROW QFN leadframe
Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Text: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This
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LQFP-48 thermal pad
Abstract: CS-007 TQFP 100 pin ic pcb design 0,5 mm pitch 5x5 matrix LD176 tqfp 7x7 tqfp 7x7 1.4 tray tqfp 7x7 tray LD48
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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TQFP 100 pin ic
Abstract: 208ld
Text: LEADFRAME data sheet ExposedPad LQFP / TQFP Features: ExposedPad LQFP/TQFP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard LQFP and TQFP packages. The ExposedPad LQFP /
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HL832N
Abstract: FCCSP HL832 Amkor CSP mold compound cu pillar amkor cabga thermal resistance CABGA 6x6 flip chip bga 0,8 mm BGA 64 PACKAGE thermal resistance amkor Cu pillar
Text: LAMINATE data sheet fcCSP Features: fcCSP Packages: Amkor Technology is now offering the Flip Chip CSP fcCSP package - a flip chip solution in a CSP package format. This package construction utilizes Pb-Free (or Eut. SnPb) flip chip interconnect technology, in either area array or
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