SURFACE MOUNT CIRCUIT BOARD "BOND PAD" CONDUCTOR Search Results

smema

Abstract: land pattern for TSOP ultrasonic bond tensile-strength soft solder die bonding IPC-SM-780 TO metal package aluminum kovar dual beam laser land pattern for SOP material composition of chip capacitors
Contextual Info: CHAPTER 13 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.

CERAMIC PIN GRID ARRAY wire lead frame

Abstract: IPC-SM-780 nickel corrosion electroplating
Contextual Info: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.

IPC-SM-780

Contextual Info: Glossary A Access hole: A hole or series of holes in successive layers of a multilayer board that provide s access to the surface of the land in one or more layers of the board. All-metal package: A hybrid circuit package made solely of metal, excluding glass or ceramic.

IPC-SM-780

Contextual Info: 2 Glossary 1/17/97 11:08 AM GLOSSARY.DOC INTEL CONFIDENTIAL until publication date 2 GLOSSARY A Access hole: A hole or series of holes in successive layers of a multilayer board that provide(s) access to the surface of the land in one or more layers of the board.

ECF564A

Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Contextual Info: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output

84-1LMI epoxy adhesive

Abstract: TS0300W3 TS0500W3
Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

Technical Brochure

Abstract: Catalytic capacitors coefficient of thermal expansion Kester sn62 tinning SN62 Ceramic Dielectric Axial Capacitors Glass Encapsulated CERAMICS CAPACITORS 0402 88Au novacap epoxy silver
Contextual Info: NOVACAP TECHNICAL BROCHURE O. CHIP USER GUIDELINES Multilayer ceramic capacitors are sold as chip leadless components, or as encapsulated leaded devices. Traditionally, the chip version has been used in densely packed hybrid and delay line circuits, while the

Contextual Info: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap­ around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and

schematic WELDER

Abstract: gold melting furnace ultrasonic bond
Contextual Info: Bonding and Handling Procedures for Chip Devices DISCUSSION Chip diode devices for use in integrated circuit and hybrid integrated circuits have proliferated in the last few years. Today's circuit designer is faced with a multiplicity of alter­ natives in the selection of diodes and packaging with each

Contextual Info: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.

TS0300

Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Contextual Info: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used

surface mount circuit board "bond pad" conductor

Contextual Info: AT C H I G H P O W E R R E S I S T I V E P R O D U C T S Attachment Recommendations for Leaded Resistors and Terminations When mounting chips, the solder interface to the mounting surface has a crucial bearing on performance. Even with very careful soldering technique,

Contextual Info: High Power Resistive Products Resistors and Terminations: Mounting and Attachment Recommendations CHIP ATTACHMENT AND PC BOARD RECOMMENDATIONS For the mounting of chip or leaded devices, it is important to obtain a good solder joint between the device’s ground plane and

Ablestik 84-1LMI

Abstract: gold melting furnace 84-1LMI epoxy adhesive
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with

jb smd

Abstract: HERMETIC SMD pd smd smd transistor 2x smd resistors mechanical dimension FR4 substrate with dielectric constant 4 smd package variety SMD Devices TO-25X CLCC 64 pins footprint
Contextual Info: The Hermetic Surface Mount Device SMD , Its Advantages and Solutions to Assembly Integration Tiva Bussarakons International Rectifier, Inc. El Segundo, California Introduction Hermetic surface mount packages have been in existence for more than 15 years. While the leaded

tm 1628 smd

Abstract: AN598 78610 3002 ic equivalent cte table epoxy IC 3004 200B hear HEINEMANN
Contextual Info: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of

WLCSP smt

Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Contextual Info: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None

jb smd

Abstract: smd transistor 2x 2x smd Capacitors 10-16 L smd smd resistors packages 2X smd transistor HERMETIC SMD SMD Devices
Contextual Info: Application Note AN-1016 Hermetic Surface Mount Device SMD , Its Advantages and Solutions to Assembly Integration by Tiva Bussarakons International Rectifier, Inc. El Segundo, California Introduction Hermetic surface mount packages have been in existence for more than 15 years. While the leaded

200B

Abstract: AN598 DK-2750 RG41 popcorn defect analysis to-220
Contextual Info: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of

SMD Hall sensors

Abstract: surface mount circuit board "bond pad" conductor
Contextual Info: OPTEK TECHNOLOGY INC 4ÔE D M ^ÔSÔO 0DD12fll CHb • OT* - T 'H Z S I OPTO HYBRID FEATURES Chip-on-board design can provide several advantages: SIZE: Used where the function cannot be accomplished with conventional through hole, leaded components. Space savings can be as much as 80% as compared with discrete packaged parts.

1n4733 smd

Abstract: moisture during operation triac scr schematic AN599 capacitors coefficient of thermal expansion soft solder die bonding TP2222A triac triggering ic DS00598A-page Triac soft turn on
Contextual Info: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of

84-1LM

Abstract: ECF564A
Contextual Info: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with

Moisture Sensitivity Levels MICROCHIP PIC Package

Abstract: 78610 delamination leadframe barber excursion AN598
Contextual Info: AN598 Plastic Packaging and the Effects of Surface Mount Soldering Techniques Author: John Barber Surface Mount Technology Team PURPOSE This application note is intended to inform and assist the customers of Microchip Technology Inc. with Surface Mount Devices SMD’s . The process of

IRf 447 MOSFET

Abstract: TO-25X smd diode IF
Contextual Info: Application Note AN-1016 Hermetic Surface-Mount Discrete Semiconductor, Solutions to Assembly Integration By Tiva Bussarakons Table of Contents Page Introduction . …….2