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    SOT825 Search Results

    SOT825 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT825-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm Original PDF
    SOT825-1 NXP Semiconductors Footprint for reflow soldering SOT825-1 Original PDF

    SOT825 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA183 package SOT825-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		LFBGA183 OT825-1 OT825-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm SOT825-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1


    Original     		LFBGA183: OT825-1 OT825 MO-205 PDF

    MO-205

    Abstract: sot825
    Text: PDF: 2003 Jul 15 Philips Semiconductors Package outline LFBGA183: plastic low profile fine-pitch ball grid array package; 183 balls; body 12 x 12 x 1.05 mm SOT825-1 A B D ball A1 index area E A A2 A1 detail X C e1 e 1/2 e ∅v M b ∅w M y y1 C C A B C P N


    Original     		LFBGA183: OT825-1 MO-205 MO-205 sot825 PDF