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    SOT684 Search Results

    SOT684 Datasheets (10)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT684-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm Original PDF
    SOT684-1 NXP Semiconductors Footprint for reflow soldering SOT684-1 Original PDF
    SOT684-10 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals Original PDF
    SOT684-11 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals Original PDF
    SOT684-1_118 NXP Semiconductors HVQFN56; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT684-2 Philips Semiconductors Original PDF
    SOT684-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm Original PDF
    SOT684-4 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm Original PDF
    SOT684-5 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm Original PDF
    SOT684-6 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm Original PDF

    SOT684 Datasheets Context Search

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    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


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    PDF HVQFN56 OT684-1 OT684-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1


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    PDF HVQFN56: OT684-5 MO-220

    MO-220

    Abstract: sot684 HVQFN56
    Text: PDF: 2003 Mar 19 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-3 terminal 1 index area A A1 E c detail X C e1 e 1/2 e 28 L y y1 C v M C A B w M C


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    PDF HVQFN56: OT684-3 MO-220 MO-220 sot684 HVQFN56

    MO-220

    Abstract: jedec package MO-220 SOT684-1 HVQFN-56 HVQFN56
    Text: PDF: 2001 Aug 14 Philips Semiconductors Package outline HVQFN56: plastic, heatsink very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A A4 E detail X C e1 1/2 e e 15 y y1 C ∅v M C A B b ∅w M C


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    PDF HVQFN56: OT684-1 MO-220 MO-220 jedec package MO-220 SOT684-1 HVQFN-56 HVQFN56

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN56 package SOT684-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


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    PDF HVQFN56 OT684-2 OT684-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e Eh1 Eh e2 1/2 e


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    PDF HVQFN56: OT684-4 MO-220

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b 29 14 e e2 Eh 1/2 e 1 42 terminal 1


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    PDF HVQFN56: OT684-2 met75 MO-220

    MO-220

    Abstract: sot684 HVQFN56
    Text: Package outline Philips Semiconductors HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-4 B D D1 A terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C v M C A B w M C b


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    PDF HVQFN56: OT684-4 MO-220 MO-220 sot684 HVQFN56

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e b 15 L y y1 C v M C A B w M C 28 29 14 e e2 Eh 1/2 e 1 42 terminal 1


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    PDF HVQFN56: OT684-1 pro75 MO-220

    MO-220

    Abstract: sot684
    Text: PDF: 2003 Nov 24 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-5 A D D1 B terminal 1 index area A E1 A4 c E A1 detail X C e1 1/2 e e 15 28 L y y1 C


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    PDF HVQFN56: OT684-5 MO-220 MO-220 sot684

    Untitled

    Abstract: No abstract text available
    Text: SOT684-1 HVQFN56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 18 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


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    PDF OT684-1 HVQFN56; 001aak603 OT684-1

    sot684

    Abstract: sot684-10
    Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm SOT684-10 B D D1 A terminal 1 index area E1 E A4 A c A1 detail X e1 e 1/2 e L 15 28 14 C C A B C v w b y y1 C 29 e e2 Eh 1/2 e 1 42


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    PDF HVQFN56: OT684-10 OT684-10 sot684-10 sot684

    MO-220

    Abstract: sot684 HVQFN56 HVQFN-56
    Text: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e b 15 28 L y y1 C v M C A B


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    PDF HVQFN56: OT684-1 MO-220 MO-220 sot684 HVQFN56 HVQFN-56

    MO-220

    Abstract: sot684
    Text: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-2 terminal 1 index area E A A1 c detail X C e1 1/2 e e 15 28 L y y1 C v M C A B


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    PDF HVQFN56: OT684-2 MO-220 MO-220 sot684

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm B D SOT684-6 A terminal 1 index area E A A1 c detail X C e1 e 1/2 e ∅v ∅w b 15 28 L M M C A B C y y1 C 29 14 e Eh Ek e2 1/2 e Ej


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    PDF HVQFN56: OT684-6

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN56: plastic thermal enhanced very thin quad flat package; no leads; 56 terminals; body 8 x 8 x 0.85 mm A B D SOT684-11 terminal A1 index area E A A1 c detail X e1 e L 1/2 e 15 28 14 C C A B C v w b y1 C y 29 e e2 Eh 1/2 e 1 42 56 terminal A1


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    PDF HVQFN56: OT684-11 MO-220 sot684-11

    ISP1582BSUM

    Abstract: ISP1582BS-UM ISP1582BS ISP1582BSGA ISP1582 AN1004 st-ericsson AN10071
    Text: ISP1582 Hi-Speed USB peripheral controller Rev. 09 — 29 September 2009 Product data sheet 1. General description The ISP1582 is a cost-optimized and feature-optimized Hi-Speed Universal Serial Bus USB peripheral controller. It fully complies with Ref. 1 “Universal Serial Bus Specification


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    PDF ISP1582 ISP1582 ISP1582BSUM ISP1582BS-UM ISP1582BS ISP1582BSGA AN1004 st-ericsson AN10071

    LPC2148 i2c

    Abstract: BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent
    Text: Building blocks for vibrant media Highlights of the NXP product portfolio Building blocks for vibrant media  At NXP Semiconductors, the new company founded by Philips, we’re driven by a single purpose — to deliver vibrant media technologies that create better sensory experiences.


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    PDF OT363 SC-88) LPC2148 i2c BGB210S lpc2148 interfacing 2.8" TFT LCD DISPLAY BGB210 embedded c code to interface lpc2148 with sensor BGW200 TDA8932T tda8920bj NXP PN531 TDA8947J equivalent

    ISP1362

    Abstract: TFBGA128 portable dvd player power supply ISP1583 CP2147 philips ISP1362 pSOS PXA255 ISP1761 HVQFN14
    Text: Semiconductors Application Matrix Carkit Digital still camera Digital TV Digital video camera Digital video recorder DVD recorder Dongle/bridge Game console Hub Hub: device bay Hub: docking station Hub: monitor Media player Mobile phone Modem: cable/DSL MP3/audio jukebox


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    PDF

    HVQFN-56

    Abstract: No abstract text available
    Text: DAC1628D1G25 Dual 16-bit DAC: JESD204B interface: up to 1.25 Gsps; x2, x4 and x8 interpolating Rev. 1.1 — 10 October 2011 Objective data sheet 1. General description The DAC1628D1G25 is a high-speed high-performance 16-bit dual channel digital-to-analog converter DAC . The device provides a sample rate up to 1.25 Gsps with


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    PDF DAC1628D1G25 16-bit JESD204B DAC1628D1G25 HVQFN-56

    AN01026

    Abstract: MO-220 PIP212-12M smd EH1 PIP212M-12M hazel grove
    Text: PIP212-12M DC-to-DC converter powertrain Rev. 02 — 2 March 2005 Preliminary data sheet 1. General description The PIP212M-12M is a fully optimized powertrain for high current high frequency synchronous buck DC-to-DC applications. The PIP212M-12M replaces two power


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    PDF PIP212-12M PIP212M-12M AN01026 MO-220 PIP212-12M smd EH1 hazel grove

    isp1582

    Abstract: ISP1582BS "USB" peripheral
    Text: ISP1582 Hi-Speed Universal Serial Bus Peripheral Controller Rev. 05 — 1 February 2007 Product data sheet 1. General description The ISP1582 is a cost-optimized and feature-optimized Hi-Speed Universal Serial Bus USB Peripheral Controller. It fully complies with Ref. 1 “Universal Serial Bus


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    PDF ISP1582 ISP1582 ISP1582BS "USB" peripheral

    Untitled

    Abstract: No abstract text available
    Text: SSTVF16859 13-bit 1 : 2 SSTL_2 registered buffer for DDR Rev. 02 — 19 July 2005 Product data sheet 1. General description The SSTVF16859 is a 13-bit to 26-bit SSTL_2 registered driver with differential clock inputs, designed to operate between 2.3 V and 2.7 V for PC1600-PC2700 applications or


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    PDF SSTVF16859 13-bit SSTVF16859 26-bit PC1600-PC2700 PC3200

    JESD204

    Abstract: ADC1113D125 JESD204A ADC ic 0808 pin diagram FK17
    Text: ADC1213D series Dual 12-bit ADC; 65 Msps, 80 Msps, 105 Msps or 125 Msps; serial JESD204A interface Rev. 6 — 9 February 2011 Product data sheet 1. General description The ADC1213D is a dual-channel 12-bit Analog-to-Digital Converter ADC optimized for high dynamic performance and low power at sample rates up to 125 Msps. Pipelined


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    PDF ADC1213D 12-bit JESD204A JESD204 ADC1113D125 ADC ic 0808 pin diagram FK17