SOT607 Search Results

TSSOP30

Contextual Info: PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A 3 A2 A A1 pin 1 index θ Lp L 1 15 bp e detail X w M 2.5 5 mm

Contextual Info: Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A2 pin 1 index A 3 A1 A θ Lp L 1 15 bp e detail X w M 2.5 5 mm scale DIMENSIONS (mm are the original dimensions).

tssop30

Abstract: sot607
Contextual Info: PDF: 2000 Feb 07 Philips Semiconductors Package outline TSSOP30: plastic thin shrink small outline package; 30 leads; body width 4.4 mm; lead pitch 0.5 mm SOT607-1 E D A X c HE y v M A Z 16 30 A2 A 3 A A1 pin 1 index θ Lp L 1 15 bp e detail X w M 2.5 5 mm

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors