Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA272 package SOT579-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA272
OT579-1
OT579-1
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BGA272
Abstract: MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K
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BGA272:
OT579-1
MS-034
BGA272
MS-034
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BGA272
Abstract: MS-034 sot579
Text: Package outline Philips Semiconductors BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W V U T R P N M L K J H G F E D C B A
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Original
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BGA272:
OT579-1
MS-034
BGA272
MS-034
sot579
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PDF
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BGA272
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA272: plastic ball grid array package; 272 balls; body 27 x 27 x 1.55 mm SOT579-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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Original
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BGA272:
OT579-1
BGA272
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