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Vishay Huntington FSOT5509E50R00KE RES CHAS MNT 50 OHM 10% 55W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FSOT5509E50R00KE	Bulk	60		1	1 $16.19 10 $10.011 100 $6.69 1000 $6.69 10000 $6.69	Buy Now
Vishay Huntington FSOT5509E150R0JE14 RES CHAS MNT 50 OHM 5% 55W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FSOT5509E150R0JE14	Bulk	1		1	1 $18.85 10 $18.85 100 $18.85 1000 $18.85 10000 $18.85	Buy Now
Vishay Huntington FSOT5509ER2500KE RES CHAS MNT 0.25 OHM 10% 55W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FSOT5509ER2500KE	Bulk			100	1 - 10 - 100 $8.4125 1000 $8.4125 10000 $8.4125	Buy Now
Vishay Huntington FSOT5509E1R000KE RES CHAS MNT 1 OHM 10% 55W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FSOT5509E1R000KE	Bulk			100	1 - 10 - 100 $8.225 1000 $8.225 10000 $8.225	Buy Now
Vishay Huntington FSOT5509E5K000KE RES CHAS MNT 5K OHM 10% 55W
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	FSOT5509E5K000KE	Bulk			100	1 - 10 - 100 $8.225 1000 $8.225 10000 $8.225	Buy Now

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SOT550 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT550-1		NXP Semiconductors	Plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm		Original	PDF

SOT550 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
BGA304 Abstract: sot550 Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X k k C e1 v M B b e ∅w M AC AB AA Y W V U T R P N M L K J H G F E	Original	PDF	BGA304: OT550-1 BGA304 sot550
BGA304 Abstract: MS-034 sot550 Text: Package outline Philips Semiconductors BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm D SOT550-2 B D1 A ball A1 index area A A2 E1 E A1 detail X C e1 ∅v ∅w b e AC AB AA Y W V U T R P N M L K J H G F E D C B A M M y1 C C A B	Original	PDF	BGA304: OT550-2 MS-034 BGA304 MS-034 sot550
Untitled Abstract: No abstract text available Text: Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 b e y y1 C ∅v M C A B ∅w M C AC AB AA Y W V U T R P N M L K J H G F E D C B A e e2 1 shape 2 optional 4x	Original	PDF	BGA304: OT550-1 MS-034
BGA304 Abstract: MS-034 Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA304: plastic ball grid array package; 304 balls; body 31 x 31 x 1.75 mm SOT550-1 B D A D1 ball A1 index area A A2 A1 E1 E detail X C e1 y y1 C ∅v M C A B b e ∅w M C AC AB AA Y W V U T R P N M L	Original	PDF	BGA304: OT550-1 MS-034 BGA304 MS-034
b0239c Abstract: diode GG 66 diode 2U 66 MEAB to-53 2U 39 diode Text: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 2N5000 2N5150 2N5602 2N5154 2N6717 92GU06 92PU06 B0379-16 ~~~~~ 30 SOT5513 SOT5513 SOT5913 B0379-25 2SC3474 2S01914 2S01981 SK3512 - :g~~:~ - 25 35 -40 45 -50 RCA1A03 S2N4863-2 S2N4863-3 SMl5509 SMl5514	Original	PDF	OT5503 OT5903 2N6409 2S01516 b0239c diode GG 66 diode 2U 66 MEAB to-53 2U 39 diode
b0345 Abstract: B0815 to-53 TO53 2SC840 KT934V Matsua 2SC840 2S0288 Text: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 2N1711B 2SC1419 2SC1419 2Nl085 2S0330 2S0331 BSS1S NSOS179 ~~g~~~oo 25 30 SK32SS 2S011S0Y 92GU45A 2S0288 2S0289 KT9340 KT934V B0827-10 ~~~~~~7 35 40 SML5512 SML5902 SML5907 SML5912 ST440 ST450 2S013	Original	PDF	B0373A 2NS705 92PE37A B0375-10 B037M O-12S b0345 B0815 to-53 TO53 2SC840 KT934V Matsua 2SC840 2S0288
B0813 Abstract: PT9787 8C440 MJ3237 trw PT9787 MM4048 MJE42C MJ2841 MOTOROLA MM1758 mmt2857 Text: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 NA31KY NA31MH NA31 MY SK3248 NA31KI NA31MI NA31KJ NA31MJ ~~~~g: 25 30 2NS204 S15-28 SMl5501 SMl550S SMl5511 SMl5901 SMl590S SMl5911 ~~~j~~ 35 40 80Y10 80Y10 PT9787 PT9787A 2N4431 2S022S 2S0226 SOT4301	Original	PDF	2SC109S 2NS714 92PU01 2S0180S MPSU01 NSOU01 92GU01 NA31KY B0813 PT9787 8C440 MJ3237 trw PT9787 MM4048 MJE42C MJ2841 MOTOROLA MM1758 mmt2857
handbook philips ic26 packaging Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50 Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3	Original	PDF	AN01026 BGA256 OT466-1 OT471-1 BGA292 OT489-1 BGA304 OT550-1 BGA316 handbook philips ic26 packaging AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	PDF	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package