SOT542 Search Results

TFBGA56

Abstract: MO-195 TFBGA-56
Contextual Info: PDF: 2002 Jun 10 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A A2 E A1 detail X C e1 e 1/2 e ∅v M C A B b y y1 C ∅w M C K J H e G F e2

Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A

Contextual Info: Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A E A2 A1 detail X C e1 e 1/2 e y y1 C ∅v M C A B b ∅w M C K J H e G F e2 E 1/2 e D C B A ball A1 index area 1 2 3

sot542

Contextual Info: PDF: 1999 Jun 08 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm SOT542-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4 5 6 7 8

MO-195

Abstract: TFBGA56 TFBGA-56
Contextual Info: PDF: 2000 Nov 21 Philips Semiconductors Package outline TFBGA56: plastic thin fine-pitch ball grid array package; 56 balls; body 6 x 6 x 0.8 mm D SOT542-1 A B ball A1 index area A A2 E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E D C B A

Contextual Info: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10

handbook philips ic26 packaging

Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Contextual Info: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

JEDEC TRAY DIMENSIONS

Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Contextual Info: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors