SOT528 Search Results

SOT528 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT528-1		NXP Semiconductors	Plastic rectangular-DIL-bent-SIL power package; 13 leads		Original	PDF
SOT528-2		NXP Semiconductors	Plastic rectangular-DIL-bent-SIL power package; 13 leads		Original	PDF

SOT528 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions	Original	PDF	RDBS13P: OT528-2
Untitled Abstract: No abstract text available Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions	Original	PDF	RDBS13P: OT528-1
sot528 Abstract: No abstract text available Text: PDF: 2000 Oct 19 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions	Original	PDF	RDBS13P: OT528-2 sot528
Untitled Abstract: No abstract text available Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 Q c 13 1 e1 Z e v M w M bp 5 L1 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2	Original	PDF	RDBS13P: OT528-1
Untitled Abstract: No abstract text available Text: Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-2 non-concave Dh x D Eh view B: mounting base side A2 d B j E A L e2 1 Q c 13 e1 Z bp e L1 v M w M 5 10 mm scale DIMENSIONS mm are the original dimensions UNIT A A2	Original	PDF	RDBS13P: OT528-2
sot528 Abstract: No abstract text available Text: PDF: 2000 Apr 10 Philips Semiconductors Package outline RDBS13P: plastic rectangular-DIL-bent-SIL power package; 13 leads SOT528-1 non-concave Dh x D Eh view B: mounting base side d A2 B j E A L e2 1 Q c 13 e1 Z bp e v M w M 5 L1 10 mm scale DIMENSIONS mm are the original dimensions	Original	PDF	RDBS13P: OT528-1 sot528
Untitled Abstract: No abstract text available Text: INTEGRATED CIRCUITS DATA SHEET TDA3682 Multiple voltage regulator with power switches Product specification Supersedes data of 2000 Nov 20 2002 Mar 11 Philips Semiconductors Product specification Multiple voltage regulator with power switches TDA3682 FEATURES	Original	PDF	TDA3682 TDA3682 SCA74 753503/02/pp20
philips capacitor 1200 k 400 MKT Abstract: No abstract text available Text: INTEGRATED CIRCUITS DATA SHEET TDA3682 Multiple voltage regulator with power switches Preliminary specification File under Integrated Circuits, IC01 2000 Nov 20 Philips Semiconductors Preliminary specification Multiple voltage regulator with power switches	Original	PDF	TDA3682 753503/25/01/pp20 philips capacitor 1200 k 400 MKT
saf7730hv Abstract: saf7730 saa7709h saa7709 Philips SAF7730HV philips SAA7709 SAF773x SAF7730H Philips SAF7730 saf7730 audio Text: Philips Semiconductors Philips Semiconductors is a worldwide company with over 100 sales offices in more than 50 countries. For a complete up-to-date list of our sales offices please e-mail sales.addresses@www.semiconductors.philips.com A complete list will be sent to you automatically.	Original	PDF
SOT411 Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050 Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which	Original	PDF
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	PDF	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package