Untitled
Abstract: No abstract text available
Text: Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C Y W e V U T R P N M L e2 K J 1/2 e H F D B G E C A shape optional 4x
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BGA256:
OT471-1
MS-034
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D 2395
Abstract: BGA256 17 X 17 BGA256 MS-034
Text: PDF: 2003 Jan 23 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C Y W e V U T R P N M L
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BGA256:
OT471-1
MS-034
D 2395
BGA256 17 X 17
BGA256
MS-034
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BGA256
Abstract: No abstract text available
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 B D A D1 ball A1 index area A E1 E A2 A1 detail X k k C e1 v M B b e ∅w M y y1 C v M A Y W V U e T R P N M L e1 K
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BGA256:
OT471-1
BGA256
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA256 package SOT471-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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BGA256
OT471-1
OT471-1
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sot471
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline BGA256: plastic ball grid array package; 256 balls; body 27 x 27 x 1.55 mm SOT471-1 D D1 ball A1 index A2 E1 E A A1 detail X k k A ZD b e y v A ∅w M ZE Y W V U T R P e N M L K J H G F E D C B A 2 1
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BGA256:
OT471-1
sot471
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PDF
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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PZ3320C10BE
Abstract: PZ3320C10EB PZ3320C7BE PZ3320C7EB PZ3320N8BE PZ3320N8EB
Text: INTEGRATED CIRCUITS PZ3320C/PZ3320N 320 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 22 IC27 Data Handbook Philips Semiconductors 1999 Apr 16 Philips Semiconductors Product specification 320 macrocell SRAM CPLD PZ3320C/PZ3320N FEATURES
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PZ3320C/PZ3320N
PZ3320
PZ3320C10BE
PZ3320C10EB
PZ3320C7BE
PZ3320C7EB
PZ3320N8BE
PZ3320N8EB
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ph 4148 zener diode
Abstract: philips zener diode ph 4148 pcf0700p Zener Diode ph 4148 PCA1318P ck2605 pcf0700p/051 philips Pca1318p on4673 Zener Diode 4148
Text: PHILIPS SEMICONDUCTORS PRODUCT DISCONTINUATION NOTICE NUMBER DN-40 DATED DECEMBER 31, 1998 EXHIBIT 'A' PHILIPS PHILIPS PHILIPS PART NUMBER PKG PART DESCRIPTION LAST TIME LAST TIME REPLACEMENT STATUS 12 NC NUMBER BUY DATE DLVY DATE PART CODE S COMMENTS DISCONTINUED INTEGRATED CIRCUIT PRODUCTS
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DN-40
74ABT126
74ABT2240
X3G-BZX84-C7V5
X3G-BZX84-C9V1
ph 4148 zener diode
philips zener diode ph 4148
pcf0700p
Zener Diode ph 4148
PCA1318P
ck2605
pcf0700p/051
philips Pca1318p
on4673
Zener Diode 4148
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PZ3320C10BE
Abstract: PZ3320C10EB PZ3320C7BE PZ3320C7EB PZ3320N8BE PZ3320N8EB XCR3320
Text: INTEGRATED CIRCUITS Xilinx has acquired the entire Philips CoolRunner Low Power CPLD Product Family. For more technical or sales information, please see: www.xilinx.com XCR3320 320 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 22 IC27 Data Handbook
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XCR3320
PZ3320
PZ3320C10BE
PZ3320C10EB
PZ3320C7BE
PZ3320C7EB
PZ3320N8BE
PZ3320N8EB
XCR3320
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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Untitled
Abstract: No abstract text available
Text: Philips Semiconductors Product specification 320 macrocell SRAM CPLD PZ3320C/PZ3320N FEATURES DESCRIPTION • 320 macrocell SRAM based CPLD The PZ3320 device is a m em ber of the CoolRunner fam ily of high-density SRAM -based CPLDs Com plex Program mable Logic
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OCR Scan
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PZ3320C/PZ3320N
PZ3320
LQFP160:
OT435-1
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PDF
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Untitled
Abstract: No abstract text available
Text: INTEGRATED CIRCUITS [M m s ^ e eI It Xiiinx has acquired the entire Philips CoolRunner Low Power CPLO Product Family« For more technical or sales Information; piease see: www.xilinx.com XCR3320 320 macrocell SRAM CPLD Product specification Supersedes data of 1998 Jul 22
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XCR3320
XGR3320
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PDF
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