SOT431 Search Results

SOT431 Datasheets (1)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT431-1		NXP Semiconductors	Plastic thermal enhanced shrink quad flat package; 208 leads (lead length 1.3 mm); body 28 x 28 x 3.4 mm; high stand-off height; heatsink		Original	PDF

SOT431 Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline HSQFP208: plastic thermal enhanced shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height; heatsink SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2	Original	PDF	HSQFP208: OT431-1
Untitled Abstract: No abstract text available Text: Package outline HSQFP208: plastic thermal enhanced shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height; heatsink SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2 A1 (A 3) wM θ Lp bp pin 1 index L detail X	Original	PDF	HSQFP208: OT431-1
sot431 Abstract: SOT431-1 Text: PDF: 2000 Feb 24 Philips Semiconductors Package outline HSQFP208: plastic, heatsink shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT431-1 c y X A Dh 156 157 105 104 ZE e E HE Eh A A2 A1 (A 3) wM θ	Original	PDF	HSQFP208: OT431-1 sot431 SOT431-1
b0345 Abstract: B0815 to-53 TO53 2SC840 KT934V Matsua 2SC840 2S0288 Text: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 2N1711B 2SC1419 2SC1419 2Nl085 2S0330 2S0331 BSS1S NSOS179 ~~g~~~oo 25 30 SK32SS 2S011S0Y 92GU45A 2S0288 2S0289 KT9340 KT934V B0827-10 ~~~~~~7 35 40 SML5512 SML5902 SML5907 SML5912 ST440 ST450 2S013	Original	PDF	B0373A 2NS705 92PE37A B0375-10 B037M O-12S b0345 B0815 to-53 TO53 2SC840 KT934V Matsua 2SC840 2S0288
but46a Abstract: PEC730 Text: POWER SILICON NPN Item Number Part Number I C 5 10 20 25 -30 2SC251SM 2SC2535 2SC2535 2SC3570 STI401 STI413 IR413 BU129 BUT11 SPT3439 BUT11F BUT11F 2SC2518L MJ425 MJ425 MJ425 BUT46 BU120 ~~6~~1SK 35 40 2S09S7 PMS5K425 SOT1015 BUS11A BUT11A BUW11AF BUX46A	Original	PDF	OT430 OT431 2N5241 OTS431 STA9364 STS430 but46a PEC730
B0813 Abstract: PT9787 8C440 MJ3237 trw PT9787 MM4048 MJE42C MJ2841 MOTOROLA MM1758 mmt2857 Text: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 NA31KY NA31MH NA31 MY SK3248 NA31KI NA31MI NA31KJ NA31MJ ~~~~g: 25 30 2NS204 S15-28 SMl5501 SMl550S SMl5511 SMl5901 SMl590S SMl5911 ~~~j~~ 35 40 80Y10 80Y10 PT9787 PT9787A 2N4431 2S022S 2S0226 SOT4301	Original	PDF	2SC109S 2NS714 92PU01 2S0180S MPSU01 NSOU01 92GU01 NA31KY B0813 PT9787 8C440 MJ3237 trw PT9787 MM4048 MJE42C MJ2841 MOTOROLA MM1758 mmt2857
b0349 Abstract: B0817 1/transistor b0349 to-53 2N3577 blx10 diode 300U 2S078 B0379 b0371 Text: POWER SILICON NPN Item Number Part Number I C 5 10 >= 20 SOT5512 SOT5512 SOT5912 B0377-25 2S01083 2S0975 B0321 B0321 ~g~~~ 25 30 2S01779 2N3138 2N3140 2N3142 2N3144 BOY11 BOY11 2S012A ~~~1~8U 35 40 BSS15 2N5320 NS06178 2N6179 S2N4150 S2N4150-1 BOB29-10 BOB29-6	Original	PDF	BC441-5 B0377-10 2N5598 2S078 NSOU05 2N6716 92GU05 92PU05 B0377-16 2S078-111 b0349 B0817 1/transistor b0349 to-53 2N3577 blx10 diode 300U B0379 b0371
JEDEC TRAY DIMENSIONS Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors	Original	PDF	manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package