Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT117 Search Results

    SF Impression Pixel

    SOT117 Price and Stock

    Nexperia NXS0104GU12X

    Translation - Voltage Levels Dual supply translating transceiver; open drain; auto direction sensing
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI NXS0104GU12X Reel 12,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.282
    		Buy Now

    Nexperia PUSB3FR4Z

    ESD Protection Diodes / TVS Diodes ESD protection for ultra high-speed interfaces
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PUSB3FR4Z Reel 5,000 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.071
    		Buy Now

    Nexperia PESD4USB3UCTBR-QZ

    ESD Protection Diodes / TVS Diodes ESD protection for high-speed interfaces
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PESD4USB3UCTBR-QZ Reel 5,000 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.099
    		Buy Now

    Nexperia NXB0104GU12X

    Translation - Voltage Levels Dual supply translating transceiver; auto direction sensing; 3 - state
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI NXB0104GU12X Reel 4,000 4,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.281
    		Buy Now

    Nexperia PESD4USB5U-TBSX

    ESD Protection Diodes / TVS Diodes ESD protection for high-speed interfaces
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI PESD4USB5U-TBSX Reel 8,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.112
    		Buy Now
    Find more SOT117 price and stock on Findchips.com

    SOT117 Datasheets (21)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT117-1 Philips Semiconductors Dip28: Plastic Dual In-line Package 28 Leads (600 Mil) Original PDF
    SOT1172-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT1172-2 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT1172-2_118 NXP Semiconductors HTSSOP28; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT1172-3 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad Original PDF
    SOT1173-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based Original PDF
    SOT1174-1 NXP Semiconductors Plastic, extremely thin quad flat package; no leads 12 terminals Original PDF
    SOT1174-1 NXP Semiconductors Footprint for reflow soldering SOT1174-1 Original PDF
    SOT1174-1 NXP Semiconductors SOT1174 _T1_ packing info 12NC ending 115 Original PDF
    SOT1174-1_115 NXP Semiconductors Standard product orientation 12NC ending 115 Original PDF
    SOT1175-1 NXP Semiconductors Plastic small outline package; 7 leads; body width 3.9 mm Original PDF
    SOT1176-1 NXP Semiconductors Reflow soldering footprint1176-1 Original PDF
    SOT1176-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals Original PDF
    SOT1177-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals Original PDF
    SOT1178-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 9 terminals Original PDF
    SOT1178-1 NXP Semiconductors Footprint for reflow soldering SOT1178-1 Original PDF
    SOT1179-1 NXP Semiconductors Footprint for reflow soldering SOT1179-1 Original PDF
    SOT1179-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 12 terminals Original PDF
    SOT1179-1_135 NXP Semiconductors HVSON12; reel pack; standard product orientation; 12NCending 135 Original PDF
    SOT1179-2 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm Original PDF

    SOT117 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    HVSON12

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-1 Gx D 0.105 P C SPx nSPx SPy Hy Gy SLy nSPy By Ay SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit


    Original     		HVSON12 OT1179-1 sot1179-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XQFN12 package SOT1174-1 2.25 2 0.45 0.22 CU 11x 0.32 CU (1×) 0.45 (1×) 2.55 1 CU 2.05 2.3 CU 0.4 (7×) 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper


    Original     		XQFN12 OT1174-1 sot1174-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-2 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w


    Original     		HTSSOP28: OT1172-2 MO-153 sot1172-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.0 x 1.7 x 0.5 mm SOT1177-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 5 C C A B C v w b y1 C y L1 k L 10 5 1 Dimensions Unit 1


    Original     		XSON10: OT1177-1 sot1177-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-2 X A B D A E A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L K Eh 12


    Original     		HVSON12: OT1179-2 MO-229 sot1179-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: SOT1174-1 Standard product orientation 12NC ending 115 Rev. 01 — 18 Oct 2010 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1174 115 180 x 8


    Original     		OT1174-1 OT1174 OT1174 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline XQFN12: plastic, extremely thin quad flat package; no leads; 12 terminals; body 1.70 x 2.00 x 0.50 mm SOT1174-1 X B D A terminal 1 index area E A A1 A3 detail X ∅v ∅w b 5 C C A B C y1 C y 7 e1 e 1 11 terminal 1 index area L1 L 1 2 mm scale


    Original     		XQFN12: OT1174-1 MO-288 sot1174-1 PDF

    DIP28

    Abstract: dip-28 DIP28- 600 sot117 600MIL
    Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil 1995 Jan 14 1 SOT117-1


    Original     		DIP28: OT117-1 DIP28 dip-28 DIP28- 600 sot117 600MIL PDF

    sot117

    Abstract: No abstract text available
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)


    Original     		DIP28: OT117-2 OT117-2 MS-011AB sot117 PDF

    MS-011

    Abstract: DIP28
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil ; long body SOT117-2 ME D A2 L A A1 c e Z w M b1 b 28 (e 1) MH 15 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions)


    Original     		DIP28: OT117-2 051G06 MS-011 SC-510-28 MS-011 DIP28 PDF

    DIP28 package

    Abstract: SC-510-28 DIP28
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane handbook, full pagewidthdual in-line package; 28 leads 600 mil DIP28: plastic SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		DIP28: OT117-1 051G05 MO-015 SC-510-28 DIP28 package SC-510-28 DIP28 PDF

    sot1178

    Abstract: No abstract text available
    Text: Package outline Footprint information for reflow soldering of XSON9 package SOT1178-1 Hx C Hy Ay By 0.025 D P 0.025 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		OT1178-1 sot1178-1 sot1178 PDF

    sot1176

    Abstract: 02K1
    Text: Package outline XSON10: plastic extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm SOT1176-1 X B D A E A A1 A3 terminal 1 index area detail X e1 terminal 1 index area e v w b 1 5 C C A B C y1 C y L1 k L 10 6 1 Dimensions Unit 1


    Original     		XSON10: OT1176-1 OT1176-1 sot1176-1 sot1176 02K1 PDF

    051G05

    Abstract: DIP28
    Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline seating plane DIP28: plastic dual in-line package; 28 leads 600 mil SOT117-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 15 28 pin 1 index E 1 14 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		DIP28: OT117-1 051G05 MO-015 SC-510-28 051G05 DIP28 PDF

    HTSSOP28

    Abstract: No abstract text available
    Text: SOT1172-2 HTSSOP28; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 12 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		OT1172-2 HTSSOP28; 001aak603 OT1172 HTSSOP28 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-1 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 L 14 e w


    Original     		HTSSOP28: OT1172-1 MO-153 sot1172-1 PDF

    stencil

    Abstract: XSON10
    Text: Reflow soldering footprint Footprint information for reflow soldering of XSON10 package SOT1176-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		XSON10 OT1176-1 sot1176-1 stencil PDF

    DIP28

    Abstract: DIP28- 600
    Text: Philips Semiconductors Package outlines DIP28: plastic dual in-line package; 28 leads 600 mil ; long body 1995 Mar 11 5-6 SOT117-2


    Original     		DIP28: OT117-2 DIP28 DIP28- 600 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON12: plastic thermal enhanced very thin small outline package; no leads; 12 terminals; body 4 x 6 x 0.85 mm SOT1179-1 X A B D E A A1 c terminal 1 index area detail X e1 1/2 e terminal 1 index area e 1 6 C C A B C v w b y y1 C L Eh 12 7


    Original     		HVSON12: OT1179-1 MO-229 sot1179-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP28: plastic thermal enhanced thin shrink small outline package; 28 leads; body width 4.4 mm; lead pitch 0.65 mm; exposed die pad SOT1172-3 D A E X c y exposed die pad side Z HE v A Dh 28 15 Q Eh A2 pin 1 index A A1 A3 θ Lp 1 e bp 14


    Original     		HTSSOP28: OT1172-3 MO-153 sot1172-3 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline SO7: plastic small outline package; 7 leads; body width 3.9 mm SOT1175-1 D A E X c HE y v A Z 7 5 Q A2 A A1 A3 θ pin 1 index Lp L 1 4 e detail X w bp 2.5 5 mm scale Dimensions Unit mm A A1 A2 A3 bp c max 1.75 0.250 1.45 0.49 0.25 nom 0.175 1.35 0.25 0.40 0.20


    Original     		OT1175-1 sot1175-1 PDF

    sot1178

    Abstract: No abstract text available
    Text: Package outline XSON9: plastic extremely thin small outline package; no leads 9 terminals; body 1 x 2.1 x 0.5 mm SOT1178-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e 1 3 5 C C A B C v w b y1 C y L k 9 6 0.5 Dimensions Unit 1


    Original     		OT1178-1 OT1178-1 sot1178-1 sot1178 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON12 package SOT1179-2 Gx D 0.105 P C nSPx SPx nSPy Hy Gy SLy SPy By Ay SLx solder land solder paste deposit solder land plus solder paste occupied area DIMENSIONS in mm P Ay By


    Original     		HVSON12 OT1179-2 sot1179-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN64R: plastic thermal enhanced very thin quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 0.8 mm A B D SOT1173-1 terminal 1 index area E A detail X e1 e L1 L 1/2 e 17 32 C C A B C v w b y y1 C 33 16 e e2 Eh 1/2 e 1 terminal 1


    Original     		HVQFN64R: OT1173-1 sot1173-1 PDF