SOT116 Search Results

Contextual Info: Package outline HUSON16: plastic, thermal enhanced ultra thin small outline package; no leads; 16 terminals; body 1.35 x 3.3 x 0.55 mm SOT1168-1 X A B D E A A1 c terminal 1 index area detail X terminal 1 index area e1 e v w b 1 8 C C A B C y1 C y L k Eh 16

Contextual Info: SOT1161-1 Standard product orientation 12NC ending 115 Rev. 02 — 27 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1161-1 115

Contextual Info: SOT1160-1 Standard product orientation 12NC ending 115 Rev. 01 — 18 Oct 2010 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1160-1 115

Contextual Info: Package outline DFN2510-10: plastic, extremely thin small outline package; no leads; 10 terminals; body 1 x 2.5 x 0.5 mm SOT1165-1 X A B D E A A1 c terminal 1 index area detail X e1 b1 e terminal 1 index area 1 5 C C A B C v w b y1 C y L k 10 6 Terminal#3 identification

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HUSON12 package SOT1167-1 Hx Gx D 0.05 P 0.05 Ay Gy SPy By SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: SOT1160-1 Standard product orientation 12NC ending 115 Rev. 02 — 27 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1160-1 115

sot116

Contextual Info: PDF: 1999 Apr 16 Philips Semiconductors Package outline seating plane DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 12 22 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

DIP22 Package

Contextual Info: PDF: 2000 Jan 04 Philips Semiconductors Package outline seating plane DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME D A2 L A A1 c e Z w M b1 (e 1) b MH 12 22 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Contextual Info: Package outline BGA582: plastic ball grid array package; 582 balls; with stiffner ring SOT1162-1 B D D1 J1 J3 A ball A1 index area J2 E1 E A A2 A1 detail X J3 e1 e AF AD AC AA V R M J Y U P L H F C E 1/2 e ∅v ∅w b AB e W T e2 N 1/2 e K G D B 1 2 4 3 5

Contextual Info: Package outline DIP22: plastic dual in-line package; 22 leads 400 mil SOT116-1 ME seating plane D A2 L A A1 c e Z w M b1 (e 1) b 22 MH 12 pin 1 index E 1 11 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max.

Contextual Info: Package outline HUSON12: plastic, thermal enhanced ultra thin small outline package; no leads; 12 terminals; body 1.35 x 2.5 x 0.55 mm SOT1167-1 X A B D E A A1 c terminal 1 index area detail X terminal 1 index area e1 e v w b 1 6 C C A B C y1 C y L k Eh 12

Contextual Info: Package outline HBGA360: plastic, thermal enhanced ball grid array package; 360 balls; heatsink SOT1163-1 B D D1 A ball A1 index area E1 j E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e heatsink e2

Contextual Info: Package outline XQFN16: plastic, extremely thin quad flat package; no leads; 16 terminals; body 1.80 x 2.60 x 0.50 mm SOT1161-1 X A B D terminal 1 index area E A A1 A3 detail X e1 e 5 8 C C A B C v w b y1 C y L 4 9 e e2 1 12 terminal 1 index area 16 L1 13

Contextual Info: Package outline XQFN10: plastic, extremely thin quad flat package; no leads; 10 terminals; body 1.40 x 1.80 x 0.50 mm SOT1160-1 X A B D terminal 1 index area E A A1 A3 detail X e1 e 3 5 C C A B C v w b y1 C y L 2 6 1 7 e2 terminal 1 index area 10 L1 8 1 Dimensions

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1160-1 1.95 1.7 CU 1.25 0.45 0.4 6x 0.22 CU (10×) 2.35 1 CU 0.85 2.1 CU 0.5 CU 0.6 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper

Contextual Info: Package outline BGA360: plastic ball grid array package; 360 balls; SOT1164-1 B D D1 A ball A1 index area E1 E A2 A A1 detail X e1 e 1/2 e ∅v ∅w b AB AA Y W V U T R P N M L K J H G F E D C B A C C A B C y y1 C e e2 1/2 e 1 3 5 7 9 11 13 15 17 19 21 shape

Contextual Info: SOT1161-1 Standard product orientation 12NC ending 115 Rev. 01 — 18 Oct 2010 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1161-1 115

XQFN16

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XQFN16 package SOT1161-1 2.35 2.1 CU 1.65 0.4 12x 0.45 0.22 CU (16×) 3.15 1.8 CU 1.65 2.9 CU 0.9 CU 1 CU placement area solder land plus solder paste solder land solder resist, 0.0625 around copper

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HUSON16 package SOT1168-1 Hx Gx D 0.05 P 0.05 Ay SPy By Gy SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of HUSON8 package SOT1166-1 Hx Gx D 0.05 P 0.05 Ay Gy By SPy SPy tot SLy nSPy Hy nSPx SPx SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land

Contextual Info: Package outline HUSON8: plastic, thermal enhanced ultra thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.55 mm SOT1166-1 X A B D E A A1 c terminal 1 index area detail X terminal 1 index area e1 e 1 4 C C A B C v w b y1 C y L k Eh 8 5

NX3DV2567

Contextual Info: NX3DV2567 Low-ohmic four-pole double-throw analog switch Rev. 1 — 28 September 2010 Product data sheet 1. General description The NX3DV2567 is a four-pole double-throw analog switch 4PDT optimized for switching WLAN-SIM supply, data and control signals. It has one digital select input (S)

IP4283CZ10

Abstract: TSSOP10 XSON10U IP4220CZ6 SOT1059-1 sot552-1
Contextual Info: IP4283CZ10 series ESD protection for ultra high-speed interfaces Rev. 2 — 27 August 2010 Product data sheet 1. Product profile 1.1 General description The devices are designed to protect high-speed interfaces such as High-Definition Multimedia Interface HDMI , DisplayPort, external Serial Advanced Technology

NX3008NBKMB

Abstract: IP4303CX4 PCMF2DFN1
Contextual Info: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL