SOP32 Search Results

diode 447

Abstract: SOP32 SOP32 Package SOP32-L1 SOP32L
Contextual Info: PACKAGE DIMENSIONS SOP32-L1 0 ~ 8° 17 1 16 0. 8 11. 3 ± 0. 2 32 14. 1 ± 0. 4 20. 447 ± 0. 2 2. 7 ± 0. 15 0. 2 ± 0. 05 0. 2 ± 0. 1 0. 935 0. 10 1. 27 0. 4 ± 0. 1 0. 12 M UNIT : mm

SOP32 data sheet

Abstract: PDIP32 PDIP-32-600
Contextual Info: U631H1708 Advanced Information SoftStore 128K x 8 nvSRAM Description 5 5 5 0 to 70 ° C -40 to 85 °C CECC 90000 Quality Standard ESD protection > 2000 V MIL STD 883C M3015.7 Packages: SOP32 (450 mil) PDIP32 (600 mil) Pin Configuration n.c. A16 A14 A12 A7

wireless optical mouse controller

Abstract: SOP32 Package mechanical mouse wireless mouse 27 MHZ transmitter 27-MHz Wireless Mouse 27 MHZ circuit transmitter wireless SSOP-28 SSOP28
Contextual Info: The wireless communication solution provider SOP32 HP7301 SSOP28 Wireless Mouse Transmitter Controller SoC FEATURES 1K word mask ROM; 48 bytes of RAM Built-in 27 MHz PLL, 3.3 V DC-to-DC, and power amplifier with programmable Power control Low battery detection and LED alarm

303F

Abstract: PDIP32 U634H256
Contextual Info: U634H256 PowerStore 32K x 8 nvSRAM F Packages: PDIP32 600 mil Features F F F F F F F F F F F F F F F F SOP32 (300 mil) High-performance CMOS nonvolatile static RAM 32768 x 8 bits 25, 35 and 45 ns Access Times 10, 15 and 20 ns Output Enable Access Times ICC = 15 mA at 200 ns Cycle Time

Contextual Info: SOP32-P-525-1.27-K Mirror finish 5 Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating (≥5µm) 1.32 TYP. 5/Fev. 10, 1997

SOP32 525mil

Abstract: SOP32 525-mil
Contextual Info: SANYO Semiconductor Small Outline Package 32Pin Plastic SOP32 525mil Precautions concerning information given on package drawings Basically, SANYO Semiconductor Company’s packages are named and coded in compliance with JEITA regulations (ED-7303A), which stipulate the names and codes for integrated circuit packages. However, the

Contextual Info: パッケージ外形図 SOP32-L1 0 ~ 8° 17 1 16 0. 8 11. 3 ± 0. 2 32 14. 1 ± 0. 4 20. 447 ± 0. 2 2. 7 ± 0. 15 0. 2 ± 0. 05 0. 2 ± 0. 1 0. 935 0. 10 1. 27 0. 4 ± 0. 1 0. 12 M 単位 : mm

HM2V8100TTI5SE

Abstract: HM216514TTI5SE M5M51008DFP-70HIST HM216514 M5M51008DFP-55HIBT hm28100tti5se R1LV1616HSA-4SI M5M51008DFP-70HI M5M5V108DVP-70HIST R1LV0408DSP-5SI
Contextual Info: LPSRAM Part Number Guide Density Configuration 256K 32k x8 Voltage 3.0-3.6 & 4.5-5.5V Package SOP28 TSOP28 4.5-5.5V SOP28 Speed 70ns 70ns 55ns 70ns TSOP28 55ns 70ns 1M 128k x8 2.7-3.6V SOP32 SOP32 SOP32 4.5-5.5V SOP32 70ns 70ns 70ns 55ns 70ns SOP32 55ns

Contextual Info: SOP32-P-525-1.27-K Mirror finish 5 パッケージ材質 リードフレーム材質 端子処理方法・材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 42 アロイ 半田メッキ (≥5µm) 1.32 TYP. 5 版/97.2.10

SOP32

Abstract: SOP32 data sheet
Contextual Info: SOP32 LSI Assembly Units : mm • SOP32 20.21±0.3 17 1 16 2.7±0.1 0.15 0.6Min. 14.1±0.3 11.3±0.2 32 1.27 0.4±0.1 ∗ The contents described herein are subject to change without notice. 0.2±0.1 0.10

1Z16

Abstract: SOP32 PRSP0032DC-A FP-32D D-3217 PSOP-32
Contextual Info: JEITA Package Code P-SOP32-11.3x20.45-1.27 RENESAS Code PRSP0032DC-A *1 Previous Code FP-32D/FP-32DV MASS[Typ.] 1.3g NOTE 1. DIMENSIONS"*1 Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F D 32 17 bp Index mark Terminal cross section

4x20

Abstract: PRSP0032DA-A PSOP-32 SOP32 P-SOP32-11
Contextual Info: JEITA Package Code P-SOP32-11.4x20.75-1.27 RENESAS Code PRSP0032DA-A Previous Code 32P2M-A E 17 *1 F 1 NOTE 1. DIMENSIONS "*1" AND "*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION "*3" DOES NOT INCLUDE TRIM OFFSET. Index mark 16 c A2 *2 Reference Symbol D A S

303F

Abstract: PDIP32 U634H256
Contextual Info: U634H256 PowerStore 32K x 8 nvSRAM F Packages: PDIP32 600 mil Features F F F F F F F F F F F F F F F F SOP32 (300 mil) High-performance CMOS nonvolatile static RAM 32768 x 8 bits 25, 35 and 45 ns Access Times 10, 15 and 20 ns Output Enable Access Times ICC = 15 mA at 200 ns Cycle Time

i232

Abstract: 525mil
Contextual Info: 32P2M-A Plastic 32pin 525mil SOP EIAJ Package Code SOP32-P-525-1.27 JEDEC Code – Weight g 1.29 Lead Material Alloy 42 e 17 E Recommended Mount Pad Symbol 1 16 F A A2 D e y L b A1 L1 HE e1 I2 32 b2 A A1 A2 b c D E e HE L L1 y c Detail F b2 e1 I2 Dimension in Millimeters

Contextual Info: U634H256 PowerStore 32K x 8 nvSRAM Features Description S High-performance CMOS non- S RoHS compliance and Pb- free S Packages: SOP32 300 mil , S S S S S S S S S S S S S S S volatile static RAM 32768 x 8 bits 25, 35 and 45 ns Access Times 10, 15 and 20 ns Output Enable

SOP32 data sheet

Abstract: PDIP32 U632H1708 a14g
Contextual Info: U632H1708 Advanced Information PowerStore 128K x 8 nvSRAM Description 5 5 5 0 to 70 °C -40 to 85 °C CECC 90000 Quality Standard ESD protection > 2000 V MIL STD 883C M3015.7 Packages: SOP32 (450 mil) PDIP32 (600 mil) Pin Configuration VCAP A16 A14 A12 A7

JEP95

Abstract: SOP32 MO-119
Contextual Info: March 1997 1. Amendment November 1997 ZMD-Standard Package SOP32 300 mil MDS 745 Dimensions in millimetres Based on JEDEC: JEP95 MO-119 A2 X A 1 Dimensions View X k x 45 0,1 1 Z bp e HE E 0,2 M D Dimensions of Sub-Group B1 Dimensions of Sub-Group C1 Amax

SOP32 525mil

Abstract: SOP32
Contextual Info: SANYO Semiconductor Small Outline Package 32Pin Plastic SOP32 525mil 外形図情報に関するご注意 三洋半導体パッケージは基本的に JEITA の名称付与規定（ED-7303A）に準じています。 ただし、従来のパッケージに用いている名称については、そのまま継続しています。

Contextual Info: SOP32-P-525-1.27-K Mirror finish Package material Lead frame material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin 42 alloy Solder plating( 5 m) 1.32 TYP. 5/Feb.10,1997

SOP32

Abstract: 32P2W-A 32P2W
Contextual Info: 32P2W-A Plastic 32pin 450mil SOP EIAJ Package Code SOP32-P-450-1.27 Weight g 0.67 JEDEC Code – Lead Material Alloy 42 e1 17 E Recommended Mount Pad Symbol 1 16 A F D A2 b L e A1 L1 HE 32 b2 I2 e y c Detail F A A1 A2 b c D E e HE L L1 y b2 e1 I2 Dimension in Millimeters

SOP32 525mil

Contextual Info: 32P2M-B Plastic 32pin 525mil SOP EIAJ Package Code SOP32-P-525-1.27 Weight g 1.29 JEDEC Code – Lead Material Alloy 42 e I2 A 17 e1 32 b2 1 F Symbol L1 HE E Recommended Mount Pad A A1 A2 b c D E e HE L L1 y 16 y b L e A1 A2 D c Detail F b2 e1 I2 Dimension in Millimeters

Contextual Info: SOP32-P-525-1.27-K Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.

A18D0

Abstract: TC534000AP
Contextual Info: Slsllllf I I I ! llllll ¡11 4M BIT 512K W O R D x 8 B IT CMOS MASK ROM DESCRIPTION The TC534000AP/AF is a 4,194,304 bits read only memory organized as 524,288words by 8bits. The TC534000AP / AF is fabricated using Toshiba’s advanced CMOS technology which provides the

Contextual Info: TOSHIBA TENTATIVE TMPN3120FE5M TOSHIBA CMOS DIGITAL INTEGRATED CIRCUIT SILICON MONOLITHIC TMPN31 20FE5M Neuron Chip For Distributed Intelligent Control Networks L on W o r k s The Neuron Chip TMPN3120FE5M provides double the perform ance o f previous Neuron Chips. It supports a