SOLDER PASTE, INDIUM REFLOW PROCESS CONTROL Search Results

72116

Abstract: tamura solder paste solder paste tlf 204 29 tamura solder paste PROFILE NC-SMQ92J solder paste solder paste tamura tlf 204 29 UP78 multicore RP15 tamura No clean solder paste Loctite rp15
Contextual Info: AN825 Vishay Siliconix The Solderability of the PowerPAKr SO-8 and PowerPAK 1212-8 When Using Different Solder Pastes and Profiles Jess Brown and Kandarp Pandya INTRODUCTION Next-generation PowerPAK packages from Vishay Siliconix feature very low thermal resistances, enabling higher power

Solder Paste, Indium, Type 3

Abstract: d012 relay d012 w32 transistor fbr166 W32 MARKING FBR160
Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

lf 12201

Abstract: Solder Paste, Indium, Type 3
Contextual Info: POWER RELAY 1 POLE—15 to 25 A FOR AUTOMOTIVE APPLICATIONS FBR161,166 Series RoHS compliant n FEATURES Suitable for automotive applications such as motor load controls, door locks, power windows, wipers, etc. l Variety of contact materials covering wide current switching

LGA voiding

Abstract: Indium 5.8LS Type 4 solder paste SAC305 alpha metal PCB LAYOUT OF WATER LEVEL INDICATOR CCL-HL-832 alpha OM-5300 SAC305 indium TAIYO PSR 4000 Indium 5.8LS Type 6 OM-325
Contextual Info: Assembly Considerations for Linear Technology ModuleTM LGA Packages September 2010 Linear Technology Corporation Outline • • • • Package Construction PCB Design Guidelines Moisture Sensitivity, Pack, Ship & Bake Board Assembly Process – Screen Print

entek Cu-56

Abstract: Cu-56 pcb warpage* in smt reflow pcb warpage after reflow Solder Paste, Indium, Type 3 thick bga die size bga thermal cycling reliability
Contextual Info: Surface Laminar Circuit SLC Ball Grid Array (BGA) Eutectic Surface Mount Assembly Application Note 5026 Introduction Printed Circuit Design Package Description Avago Technologies used Entek Cu-56 surface for all evaluations. This document outlines the design and assembly guidelines for surface laminar circuitry (SLC) ball grid array

fujitsu relay 57d24

Abstract: 57D24 FBR57 DC-12 FBR57ND24-W 57D24-N MICRO TX1
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—30 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other

fujitsu relay 57d24

Abstract: 57D24-N
Contextual Info: COMPACT HIGH POWER RELAY 1 POLE—12 A 28 VDC (FOR 24 V BATTERY AUTOMOTIVE APPLICATIONS) FBR57 SERIES RoHS compliant n FEATURES High power contact capacity (carrying current: 40 A/2 minutes, 30 A/1 hour) l Suitable for controlling 24 V motors in trucks and other

LGA rework

Abstract: AN2920 cte table flip chip substrate Solder Paste, Indium reflow process control LGA voiding AN1902 AN3241 BGA cte reflow profile FOR LGA COMPONENTS ceramic rework
Contextual Info: Freescale Semiconductor Application Note Document Number: AN3241 Rev. 1.0, 10/2009 Land Grid Array LGA Package Rework 1 Introduction This application note describes rework considerations for the Land Grid Array (LGA) style package. Freescale has introduced radio frequency (RF) modules

entek Cu-56

Abstract: bga thermal cycling reliability Solder Paste, Indium, Type 3 pcb warpage* in smt reflow Solder Paste Indium reflow process control BGA Solder Ball 1mm BGA PACKAGE thermal profile BGA cte BGA Ball Crack JEDEC SMT reflow profile
Contextual Info: HITCE* Ball Grid Array Surface Mount Assembly for Lead BGA Balls Application Note 5055 Introduction Printed Circuit Design This document outlines the design and assembly guidelines for High Thermal Coefficient of Expansion HITCE ball grid array (BGA) surface mount assembly packages.

AN1035

Abstract: tamura solder paste SN62 PB36 ag2 kester IRF6604 DirectFet SN62 PB36 ag2 Copper Tamura kaken 100N IRF6601 IRF6602
Contextual Info: AN-1035 DirectFET TM Technology Board Mounting Application Note page Device construction 2 Design considerations 3 Assembly considerations 4 Mechanical test results 5 International Rectifier AN-1035 DirectFET Technology Board Mounting Application Note Introduction

Contextual Info: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce

Contextual Info: RMPA2265 28dBm WCDMA Power Amplifier Module General Description Features The RMPA2265 power amplifier module PAM is designed for WCDMA applications. The 2 stage PAM is internally matched to 50Ω to minimize the use of external components and features a low-power mode to reduce

tamura tlf-206-93f

Abstract: p10 LED matrix single color module CANADA ICES 003. CLASS B mother board tamura tlf sac305 S131CL-5-RMM-2450S tamura solder paste SAC305 indium MMCX connector Sn 4011 SAC387 solder
Contextual Info: PRELIMINARY DATA SHEET MATRIX Transceiver Modules ZMXM-400 Series Integrated Transceiver Module for ZigBee / IEEE 802.15.4 Evaluation Kits available DESCRIPTION The Matrix module is a 2.4 GHz IEEE 802.15.4 RF transceiver providing a cost- effective solution for data links and wireless networks. The module design is

Contextual Info: February 2005 RMPA2263 i-Lo WCDMA Power Amplifier Module 1920–1980 MHz Features General Description • 40% WCDMA efficiency at +28 dBm Pout ■ 14% WCDMA efficiency 85 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm

Contextual Info: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the

Solder Paste Indium reflow process control

Contextual Info: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local

CDMA2000-1X

Abstract: ECJ-1VB1H102K RMPA1963 ECJ1VB1C104K
Contextual Info: May 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local

ECJ-1VB1H102K

Abstract: RMPA2266 SN63 SN96
Contextual Info: May 2006 RMPA2266 i-Lo WCDMA Power Amplifier Module, 1920–1980 MHz Features General Description • 40% WCDMA efficiency at +28dBm Pout The RMPA2266 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface mount modules targeting UMTS/WCDMA/HSDPA

ECJ-1VB1H102K

Abstract: RMPA1966 SN63 SN96
Contextual Info: PRELIMINARY RMPA1966 i-Lo WCDMA Band II Power Amplifier Module, 1850–1910 MHz Features General Description • 40% WCDMA efficiency at +28.5dBm Pout The RMPA1966 Power Amplifier Module PAM is Fairchild’s latest innovation in 50Ω matched, surface

Contextual Info: April 2005 RMPA1963 i-Lo US-PCS CDMA, CDMA2000-1X and WCDMA Power Amplifier Module iL o ™ General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout The RMPA1963 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting US-PCS CDMA/WCDMA/HSDPA and Wireless Local

Contextual Info: February 2005 RMPA0963 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 38% CDMA/WCDMA efficiency at +28 dBm Pout ■ 14% CDMAA/WCDMA efficiency 80 mA total current at +16 dBm Pout ■ Linear operation in low-power mode up to +19 dBm

Solder Paste Indium reflow process control

Abstract: ECJ-1VB1H102K RMPA2263 SN63 SN96
Contextual Info: RMPA2263 i-Lo i L o ™ Features General Description • 40% WCDMA efficiency at +28 dBm Pout The RMPA2263 Power Amplifier Module PAM is Fairchild’s latest innovation in 50 Ohm matched, surface mount modules targeting UMTS/WCDMA/HSDPA applications. Answering the

CDMA2000-1X

Abstract: ECJ-1VB1H102K RMPA0966 fairchild microwave power transistor
Contextual Info: November 2005 RMPA0966 i-Lo Cellular CDMA, CDMA2000-1X and WCDMA Power Amplifier Module Features General Description • 42% CDMA/WCDMA efficiency at +28 dBm Pout ■ 21% CDMA/WCDMA efficiency 56 mA total current at +16 dBm Pout ■ Meets HSDPA performance requirements