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    SOLDER PASTE Search Results

    SOLDER PASTE Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    CN-AC3MMDZBAU Amphenol Cables on Demand 3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) Datasheet
    CN-DSUB50PIN0-000 Amphenol Cables on Demand Amphenol CN-DSUB50PIN0-000 D-Subminiature (DB50 Male D-Sub) Connector, 50-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD62PN-000 Amphenol Cables on Demand Amphenol CN-DSUBHD62PN-000 High-Density D-Subminiature (HD62 Male D-Sub) Connector, 62-Position Pin Contacts, Solder-Cup Terminals Datasheet
    CN-DSUB25SKT0-000 Amphenol Cables on Demand Amphenol CN-DSUB25SKT0-000 D-Subminiature (DB25 Female D-Sub) Connector, 25-Position Socket Contacts, Solder-Cup Terminals Datasheet
    CN-DSUBHD26SK-000 Amphenol Cables on Demand Amphenol CN-DSUBHD26SK-000 High-Density D-Subminiature (HD26 Female D-Sub) Connector, 26-Position Socket Contacts, Solder-Cup Terminals Datasheet
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    SOLDER PASTE Price and Stock

    Digi-Key DKS-SOLDERPASTE15G

    SOLDER PASTE NO-CLEAN 63/37 5CC
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey DKS-SOLDERPASTE15G Bag 80 1
    • 1 $23.53
    • 10 $23.53
    • 100 $15.3274
    • 1000 $13.17384
    • 10000 $13.17384
    		Buy Now

    Olimex SOLDER-PASTE-SN63PB37-CLASS4

    SOLDER PASTE SN63PB37 CLASS4
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey SOLDER-PASTE-SN63PB37-CLASS4 Bulk 1
    • 1 $48.98
    • 10 $48.98
    • 100 $48.98
    • 1000 $48.98
    • 10000 $48.98
    		Buy Now

    SOLDER PASTE Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 4.55 4.30 2.30 2.25 1.70 1.60 0.90 2x solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD80C sod080c

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA170 package SOT1315-1 Hx P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X Dimensions in mm


    Original     		PDF LFBGA170 OT1315-1 sot1315-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X


    Original     		PDF LFBGA267 OT1332-1 sot1332-1

    sod962

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962 0.85 0.4 0.4 R0.025 8x 0.22 (2×) 0.12 (2×) 0.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD962 sod962

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1192-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 www.nxp.com r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area


    Original     		PDF OT1192-1 sot1192-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HXQFN60 package SOT1134-2 4.25 0.5 0.3 0.3 3.9 2.55 0.35 5.2 5.8 6.25 1.1 0.45 1.1 1.9 solder land solder paste deposit 125 mm stencil solder land plus solder paste occupied area solder resist


    Original     		PDF HXQFN60 OT1134-2 sot1134-2 Publicat35

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of TFBGA208 package SOT950-1 Hx P P Hy 0.475 see detail X solder land CL solder paste deposit SR CU solder land plus solder paste SP occupied area solder resist detail X Dimensions in mm


    Original     		PDF TFBGA208 OT950-1 sot950-1

    sod323 reflow

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD323 3.05 2.1 0.5 2x 1.65 0.95 0.6 (2×) 2.2 0.5 (2×) 0.6 (2×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD323 sod323 sod323 reflow

    SOT-457

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of TSOP6 package SOT457 3.45 1.95 0.45 0.55 6x (6×) 0.95 3.3 2.825 0.95 0.7 (6×) 0.8 (6×) 2.4 solder land solder land plus solder paste solder paste deposit solder resist occupied area


    Original     		PDF OT457 sot457 liceSOT457 SOT-457

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2 0.85 0.4 0.4 R0.025 8x 0.22 (2×) 0.12 (2×) 0.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD962-2 sod962-2

    SOD123W

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD123W 4.4 2.9 2.8 1.1 1.2 2x (2×) 2.1 1.6 1.1 (2×) 1.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD123W sod123w

    SOD128

    Abstract: SOD-128
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD128 6.2 4.4 4.2 1.9 2.1 2x (2×) 3.4 2.5 1.2 (2×) 1.4 (2×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD128 sod128 SOD-128

    SOD123F footprint

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD123F 4.4 2.9 2.8 1.1 1.2 2x (2×) 2.1 1.6 1.1 (2×) 1.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD123F sod123f SOD123F footprint

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT323 2.65 1.85 1.325 2 2.35 3 0.6 3x 1.3 1 0.5 (3×) 0.55 (3×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OT323 sot323

    SOD523 footprint

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523 2.15 1.4 0.5 0.6 2x (2×) 1.2 0.4 (2×) 0.5 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area


    Original     		PDF OD523 sod523 SOD523 footprint

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1194-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm


    Original     		PDF OT1194-1 sot1194-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD323F 3.05 2.2 2.1 0.5 2x 1.65 0.95 0.6 (2×) 0.5 (2×) 0.6 (2×) solder land solder land plus solder paste solder paste deposit solder resist


    Original     		PDF OD323F sod323f

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of DFN1608D-2 package SOD1608 1.15 0.75 1.05 0.65 0.95 0.55 0.9 0.8 0.7 0.7 0.8 0.9 1 2 0.1 1.8 0.2 1.9 2.0 solder land solder land plus solder paste solder paste deposit solder resist Dimensions in mm


    Original     		PDF DFN1608D-2 OD1608 sod1608

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1049-3 Hx Gx pa + oa 2.000 P 0.500 D 9x 0.0125 0.0125 Hy Gy pa + oa By Ay Bx D1 Ax solder land solder paste deposit solder land plus solder paste occupied area solder resist


    Original     		PDF XQFN10 OT1049-3 sot1049-3

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small plastic package; 3 solder lands SOT883 1.3 0.7 R0.05 12x 0.9 0.6 0.7 0.25 (2×) 0.3 (2×) 0.3 0.4 (2×) 0.4 solder land solder land plus solder paste solder paste deposit


    Original     		PDF OT883 sot883

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT23 3.3 2.9 1.9 3 0.6 3x 0.7 (3×) solder land solder paste deposit 0.5 (3×) solder land plus solder paste 0.6 (3×) solder resist 1 occupied area


    Original     		PDF sot023

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of SOD923 package SOD923 1.4 0.9 0.9 0.4 2x 0.3 (2×) 0.3 (2×) 0.5 (2×) 0.2 (2×) 0.4 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area


    Original     		PDF OD923 OD923 sod923

    Untitled

    Abstract: No abstract text available
    Text: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste


    OCR Scan     		PDF 18x18

    Robinson Nugent

    Abstract: Robinson Nugent pga 18x18 Nugent
    Text: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid­ ing an exact amount of solder * Eliminates the need for solder paste and


    OCR Scan     		PDF 13x13 18x18 Robinson Nugent Robinson Nugent pga Nugent