LFBGA267 Search Results
LFBGA267 Datasheets Context Search
| Catalog Datasheet | Type | Document Tags | |
|---|---|---|---|
|
Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X |
Original |
LFBGA267 OT1332-1 sot1332-1 | |
|
Contextual Info: Package outline LFBGA267: plastic low profile fine-pitch ball grid array package; 267 balls A B D SOT1332-1 ball A1 index area A A2 A1 detail X E C e1 e Y W V U T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 13 15 17 19 |
Original |
LFBGA267: OT1332-1 sot1332-1 |