SOLDER BALL Search Results

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X

Contextual Info: Reflow soldering footprint Footprint information for reflow soldering of XFBGA24 package SOT1342-1 Hx ball A1 index area P P Hy see detail X Cu pad CP solder land (SL) solder paste deposit (SP) solder land plus solder paste (SR) SR/SL SP occupied area CP

Kester 197

Contextual Info: R560 Water-Soluble Solder Paste Product Description Physical Properties Data given for Sn63Pb37, 90% metal, -325+500 mesh Kester R560 is an organic acid, water-soluble solder paste formula specifically designed to reduce voiding in Ball Grid Array (BGA) solder

V356

Contextual Info: NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y14.5M-1994. 2. THE BASIC SOLDER BALL GRID PITCH IS 1.27mm. 3. THE MAXIMUM SOLDER BALL MATRIX SIZE IS 20 X 20. 4. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 400. A A 8

Contextual Info: UNLESS OTHERWISE SPECIFIED ALIL DIMENSIONS AND TOLERANCES CONFORM TO A3ME Y14.6M -19B4. THE BASIC SOIDER BALL GRID PITCH IS O.&Omm. THE MAXIMUM SOLDER BAN. MATRIX SIZE IB 10 X 10. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 100. DIMENSION IS MEASURED AT THE MAXIMUM SOLDER BALL DIAMETER.

sn63pb37 solder wire

Abstract: SN63PB37 ROSIN FLUX TYPE ROL0 kester Sn63pB37 sn63pb37 solder wire flux 232
Contextual Info: 2011RECOMMENDED RECOMMENDED 2012 ElectronicsAssembly Assembly Materials Materials Electronics Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information

passivation

Contextual Info: Wafer Bumping Wafer bumping services are offered as a preparatory step for flip-chip bonding or as bumping service alone. The types of solder bumping available include high lead solder, eutectic solder and lead free solder. Lead free bump, which is composed of tin-silver alloy, can meet the WEEE

ph0n

Contextual Info: B O TTO M VIEW 2 4 0 SO LD ER BALLS NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS AND TOLERANCES CONFORM TO ASME Y14.5M -1994. 2. THE BASIC SOLDER BALL GRID PITCH IS 1.00mm. 3. THE MAXIMUM SOLDER BALL MATRIX SIZE IS 18 X 18. 4. THE MAXIMUM ALLOWABLE NUMBER OF SOLDER BALLS IS 324.

all ic data

Abstract: EIAJ SO 8 solder heating profile intel 80486 DX4 INTEL DX4 paste profile SMT Process dx4 208 SQFP 80c196kb 1988 diode databook intel 80486
Contextual Info: Board Solder Reflow Process Recommendations - Leaded SMT 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables including the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile

all ic data

Abstract: land pattern for TSOP 2 pace craft 100 82425EX intel 80486 80486 DX4 80c196kb 1988 QFP PACKAGE thermal resistance 55A5 TSOP infrared
Contextual Info: CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS INTRODUCTION In reflowed board assemblies the solder joint quality is affected by several variables such as board design SMT Surface Mount Technology assembly equipment solder paste component and reflow profile

Intel reflow soldering profile BGA

Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
Contextual Info: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.

Kyocera capacitor

Contextual Info: TECHNICAL INFORMATION SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR Solder reflow mounting of the small 0603 “TACmicrochip” requires a rethink from the established mounting of the 0603 ceramic chip or

avx taj

Abstract: kyocera ceramic package
Contextual Info: TECHNICAL INFORMATION SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR SOLDER REFLOW MOUNTING “TACmicrochip” TANTALUM CAPACITOR Solder reflow mounting of the small 0603 “TACmicrochip” requires a rethink from the established mounting of the 0603 ceramic chip or

full automatic Washing machines circuit diagram

Abstract: automatic washing machine control system circuit fully automatic washing machine electronic circuit A6S-4101-H A6S-1104-PH 9101h full automatic Washing machines state diagram 4 pole 3 way rotary switch diagram
Contextual Info: DIP Switch A6S-H Previous A6S Model Upgraded to Surface-mounting Type with Increased Solder Heat Resistance • Designed to enable replacement of previous (A6S) model, featuring the same dimensions and improved solder heat resistance (peak solder temperature: 260°C).

c 6090

Abstract: IPC-A-610 k type thermocouple Thermocouple Type K oven 65psi
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimpot Products Process Description Materials 1. Apply solder paste to test board 8 - 10 mil thick Temperature Time Interval • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste

mutoh ip-220

Contextual Info: Database for Properties of Lead-Free Solder Alloys DATABASE FOR PROPERTIES OF LEAD-FREE SOLDER ALLOYS Version 1.0 This database is a joint project of ELFNET and COST 531 Action. COST 531 ACTION ON LEAD-FREE SOLDER ALLOYS EURPEAN LEAD-FREE SOLDERING NETWORK

all ic data

Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
Contextual Info: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as

C 6090

Abstract: g10 smd transistor SMD g10 Water soluble water soluble cleaning reflow profile 245 solder paste
Contextual Info: Lead Free Solder Reflow Profile - SMD Trimmers Process Description 1. Apply solder paste to test board 8 - 10 mil thick Materials Time Interval Temperature • Sn 96.5 / Ag 3.0 / Cu 0.5 Room temperature Alloy water soluble or no clean solder paste (see note 1)

57-20140

Abstract: Cinch 97-22640-91 57-10360 57-30500 rj21 cable connector right angle 68 pin MALE PCB SCSI CONNECTOR Centronics connector footprint DSS14 Flat Ribbon Connector 2x5 IDC RJ21
Contextual Info: MINIATURE RIBBONS IDC SUPERIBBON & Metal Shell Vertical Mount Compliant Pin Solder Cup Right-Angle Solder Tail Wire Wrap Vertical Mount Solder Tail Accessories & Application Tooling .085 in. 2.16mm Density Miniature Ribbon Introduction The Miniature Ribbon connector has been a mainstay in the electronics

Contextual Info: 新製品紹介 実装接合用Cuコア鉛フリーはんだボール Cu Cored Pb-Free Solder Ball for Solder Jointing Cu cored Pb-free solder ball：CNSA3A5C, CNSAC タブレット端末に代表されるよう めっきが均一に施されており滑らか

FR4 substrate height and thickness

Abstract: FR4 0.8mm thickness FR4 substrate height and thickness 1.2 FR4 height thickness substrate ltcc chip distance ring ltcc fr4 substrate
Contextual Info: NETWORKS Hybrid IC MULTI CHIP MODULE • SYSTEM iN PACKAGE MCM CONSTRUCTION SMD SMD Bonding Wire Bonding Wire Solder BallBall Solder Bare Chip Bare Chip Substrate Substrate Several semiconductors in one package offers downsized system with high performance and standardization

24-7068-1407

Abstract: 24-6337-8817 GR-63-CORE Zone 4 test 2460400010 24-6337-0027 K100LD sn62pb36ag2
Contextual Info: 2013 RECOMMENDED Electronics Assembly Materials Table of Contents Table of Contents 2 Products Pages Solder Paste Fluxes Solder Wire Bar Solder Additional Flux Materials TSF Products Other products Helpful Information 3-7 8-11 12-13 14-15 16 17 18 19 | 800 253 7837 | WWW.kester.com

A3232

Abstract: bga 7x7 CSP2 BGA thermal resistance 6x8 bga 6x8 Package BGA 48 PACKAGE thermal resistance
Contextual Info: FBGA Chip Scale BGA Encapsulant Au Wire Die Mold Resin Die Au Wire Polyimide Tape Substrate Solder Laminate Substrate Solder Ball Die Attach Super CSP Si Al SON BCC™ Leadless Redistribution Line Cu Leadframe Metal post (Cu/Barrier) Polyimide Layer SiN

smema specifications

Abstract: smema AN038 smema control EAN-102068
Contextual Info: DESIGN APPLICATI0N NOTE - AN038 Solder Reflow Recommendations Sn/Pb and Pb Free for Plastic RFICs Overview The stages used in a solder profile We are often asked what the solder reflow profile should be for SMDI devices mounted on PCB’s using high volume production equipment. The reflow profile is