SIGNETICS DATA Search Results

SIGNETICS

Abstract: 10X10MM TQFN 72-QFN
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFN Sawn Signetics TQFN, WQFN, and UQFN The Signetics QFN package is a low cost, lead frame packaging solution that offers excellent thermal and electrical performance with minimal costs. Electrical performance

SIGNETICS

Abstract: QFP minimum pitch size qfp 0.4mm lead frame QFP lead frame gold wire MQFP
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics QFP Signetics MQFP, MQFP LOC, MQFP H/S, LQFP, LQFP Sensor, QFP EPP, and TQFP The Signetics QFP package family is a lead frame based package with gull wing style leads on four sides. Signetics offers an array of QFP’s including standard MQFP,

JEDEC TSSOP 28 LEAD PACKAGE

Abstract: SIGNETICS TSSOP 28 Ablestik 12-1
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSSOP Signetics Thin Shrink Small Outline Package Cross Section View of TSSOP Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSSOP packages are available in 8 - 56 lead counts with 0.50 / 0.65mm lead

TSOP 48 thermal resistance

Abstract: TSOP 48 thermal resistance type1 thin TSOP 8x20 package tray TSOP 32 thermal resistance TSOP 48 package tray JEDEC tray standard 13 Ablestik 12-1 signetics TSOP package tray TSOP1-48
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 1 Signetics Thin Small Outline Package Type1 Cross Section View of TSOP Type 1 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type1 packages are available in 32 - 48 lead counts with 0.50mm lead

SIGNETICS

Abstract: JEDEC tray standard 13 Signetics OR Mullard package tray outline 12X20 signetics data
Contextual Info: Signetics Flip Chip Package Data Sheet Signetics Data Sheet Signetics TSOP Type 2 Signetics Thin Small Outline Package Type2 Cross Section View of TSOP Type 2 Mold Compound Gold Wire Lead frame Die Die Attach Adhesive Signetics’ s TSOP Type 2 package is available in 50 lead counts with 0.80mm lead pitches

SIGNETICS

Abstract: 10X10MM FLGA
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics FLGA Signetics Fine Pitch Land Grid Array Package FLGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and are cost effective because they are manufactured in a high-utilization

signetics

Abstract: epbga EBGA epbga 304 signetics data book
Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics EPBGA Signetics Enhanced Performance Ball Grid Array Package EPBGA is a cavity-down package that uses a laminate substrate mounted to a copper heat spreader. The package offers superior electrical and thermal performance by the

Signetics

Abstract: 19X19 19X19MM
Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics FBGA Signetics Fine Pitch Ball Grid Array Package FBGA is a laminate-based, nearly chip-scale package. They provide excellent electrical performance and can be customized for use in an infinite number of applications. This

signetics

Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics STBGA Signetics Tape Ball Grid Array Package STBGA is a cavity-down package that uses a tape-based substrate mounted to a copper heat spreader. The package offers superior electrical performance by the

signetics

Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics Stacked CSP Signetics Stacked Chip Scale Package Stacked CSP is a laminate-based, nearly chip-scale package containing at least two die that are stacked vertically. This package solution provides a very high silicon content

hspbga

Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics PBGA / HSPBGA Signetics Plastic Ball Grid Array Package PBGA packages have a wire bonded die mounted to a laminate substrate which is then over molded. This configuration offers excellent performance and cost that enables use

RDRAM SOP

Abstract: SIGNETICS Bt epoxy rohs
Contextual Info: Data Sheet Signetics Signetics Flip Chip Package Data Sheet Signetics BOC Signetics Board On Chip BOC is a laminate-based, nearly chip-scale package with the die mounted topside down. Wire bonds are made through a cavity in the center of the substrate and both

tfbga

Abstract: SIGNETICS 48TFBGA 48-TFBGA
Contextual Info: Data Sheet Signetics Data Sheet Signetics Flip Chip Package Signetics TFBGA Signetics Tape Fine Pitch Ball Grid Array Package TFBGA is a package that uses a tape-based substrate with plastic over mold, offering a near chip scale solution. TFBGA packages are cost efficient and provide excellent

Contextual Info: Philips Components-Signetics Quality and Reliability Data Communication Products SIGNETICS QUALITY Signetics has put together winning processes for manufacturing. Our standard is zero defects, and current customer quality statistics demonstrate our commitment to this

defect ppm sampling

Abstract: signetics
Contextual Info: Signetics Quality and Reliability Military Products SIGNETICS MILITARY PRODUCT QUALITY SIGNETICS SHIP-TO-STOCK STS PROGRAM Signetics Quality leadership begins with the In­ dustry's firstzerodefect warranty. If a single de­ fect is found in any lot that we ship, the entire lot

60c31

Abstract: AD347 AD7ME 80C31BH 80C31BH/BQA
Contextual Info: Signetics 80C31BH/80C51BH CMOS Single-Chip 8-Bit Microcontroller Product Specification Military Microprocessor Products DESCRIPTION The Signetics 80C31BH/80C51BH is a high-performance microcontroller fabri­ cated with Signetics high-density CMOS technology.

PHD48N22

Contextual Info: Philips Components-Signetics SLICE 10 Signetics Logic Integration Computer Environment Programmable Logic Development Software FEATURES • Easy to learn and use GENERAL DESCRIPTION they are introduced. The devices currently supported are: • Supports Signetics PLD line

signetics 723

Abstract: 20L8D M7MJ PLUS20R8
Contextual Info: PLUS20L8, PLUS20R8 Signetics PAL -Type Devices Signetics Programmable Logic Product Specification Military Application Specific Products • Series 24 FEATURES DESCRIPTION • Ultra high-speed The Signetics PLUS20XX family is an ultra high-speed version of existing Series

t-con Application Note

Abstract: 8XC752
Contextual Info: Philips Components-Signetics Application Specific Product Section 3 - 80C51 family derivatives 8XC752 OVERVIEW The Signetics 83C752/87C752 is a single-chip control oriented microcontroller fabricated with Signetics high-density CMOS technology minimizing CMOS latch-up sensi­

SCC2691AC1N24

Abstract: diagram remote control receiver and transmitter SCC2691AC1A28 T-75-37-05 SCC2691 SCC2691AA1D24 SCC2691AA1N24 SCC2691AC1D24 bts312 bbS312
Contextual Info: S'îE D NAPC/ SIGNETICS Signetics bbS3T24 GDSSIST 1 .7=7Sr-37-ar SCC2691 Universal Asynchronous Receiver/Transmitter UART Product Specification Communications and Industrial Products Group c PIN CONFIGURATIONS DESCRIPTION FEATURES The Signetics SCC2691 Universal Asyn­

textool socket dil 40

Abstract: 30A27 47 16L xn PAL 007 B MO-C47AA textool socket dil 24 c16v8 PLC16V8-25 PAL 007 E 16H8
Contextual Info: a^E D NAPC/ SIGNETICS • bbS3TS4 QGSMQMO 1 ■ T~*U>- 3rH7 c Signetics PLC16V8-25/-35 Erasable and OTP Universal PALMype Devices Signetics Programmable Logic Product Specification Application Specific Products • Series 20 FEATURES • 20-pln Universal Programmable

P34QJ

Abstract: SC80C51 SC80C652 SC83C652 C0126 0023H EXO 3 8K
Contextual Info: ? Signetics -5 SC80C652/ SC83C652 CMOS Single-Chip 8-Bit Microcontroller Objective Specification Microprocessor Products DESCRIPTION FEATURES The SC80C652/83C652 is a derivative of the SC8051 family, fabricated with Signetics high-density CMOS technolo­ gy. Signetics epitaxial substrate mini­

SCN2650

Abstract: scn2651
Contextual Info: Philips Semlconductors-Signetics Data Communications Products Product specification Programmable communications interface PCI DESCRIPTION • Asynchronous operation The Signetics SCN2651 PCI is a universal synchronous/asynchronous data communications controller chip designed for

88C681

Abstract: DUART EXAR XR SC26C92 DOG MARKING "Pin compatible" Signetics
Contextual Info: TAN - 014 A Comparison between Exar’s XR-88C681 with Signetics’ SC26C92 DUART Devices Comparison of EXAR DUART XR-88C681 device with that of Signetics (SC26C92) Introduction Although the XR-88C681 and the Signetics SC26C92 devices have exactly the same pin