Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SIGC68T170R3 Search Results

    SF Impression Pixel

    SIGC68T170R3 Price and Stock

    Infineon Technologies AG SIGC68T170R3X1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC68T170R3X1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC68T170R3X1SA1 Waffle Pack 46
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    		Get Quote

    Infineon Technologies AG SIGC68T170R3EX1SA1

    IGBT CHIPS - Gel-pak, waffle pack, wafer, diced wafer on film (Alt: SIGC68T170R3EX1SA1)
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Avnet Americas SIGC68T170R3EX1SA1 Waffle Pack 20 Weeks 3,528
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $9.34298
    		Buy Now

    SIGC68T170R3 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SIGC68T170R3 Infineon Technologies IGBT Chip Original PDF
    SIGC68T170R3 Infineon Technologies For drive application, Trench-and Fieldstop technology Original PDF

    SIGC68T170R3 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC68T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology  low turn-off losses  short tail current  positive temperature coefficient  easy paralleling This chip is used for:  power modules C Applications:  drives G


    Original     		SIGC68T170R3E L7761M, L7761T, L7761E, PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC68T170R3E IGBT3 Power Chip Features: • 1700V Trench & Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling This chip is used for: • power modules C Applications: • drives G


    Original     		SIGC68T170R3E L7761T, PDF

    SIGC68T170R3

    Abstract: No abstract text available
    Text: Preliminary SIGC68T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC68T170R3 VCE ICn 1700V 50A This chip is used for:


    Original     		SIGC68T170R3 Q67050sawn A4147-A001 761-A, SIGC68T170R3 PDF

    SIGC68T170R3

    Abstract: No abstract text available
    Text: SIGC68T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC68T170R3 VCE ICn 1700V 50A This chip is used for: • power module


    Original     		SIGC68T170R3 Q67050A4147-A001 761-A, SIGC68T170R3 PDF

    Untitled

    Abstract: No abstract text available
    Text: Preliminary SIGC68T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC68T170R3 VCE ICn 1700V 50A This chip is used for:


    Original     		SIGC68T170R3 Q67050sawn A4147-A001 761-A, PDF

    Untitled

    Abstract: No abstract text available
    Text: SIGC68T170R3 3 IGBT Chip FEATURES: • 1700V Trench + Field Stop technology • low turn-off losses • short tail current • positive temperature coefficient • easy paralleling Chip Type SIGC68T170R3 VCE ICn 1700V 50A This chip is used for: • power module


    Original     		SIGC68T170R3 Q67050A4147-A001 761-A, PDF