SC275S045 Search Results

Contextual Info: Bulletin I0118J rev. A 05/01 SC275.5. Series SCHOTTKY DIE 275 x 275 mils a 0.35 ± 0.01 14 ± 0.4 c NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS). 2. CONTROLLING DIMENSION: (MILS). C b d D A Ø 40 (157) 3. DIMENSIONS AND TOLERANCES: a = 6.98 + 0, - 0.01

60cmq

Abstract: 403CNQ IOR 445
Contextual Info: International IöR Rectifier Wofei Port Number Die Pail Number 3D Schottky Diodes Die A' length/Side in. mm Anode Bond Pad 'B' length/Side Metalization Tray (in.) mm (top side) Process Quantity Equivalent Finished Products S C I75S060A W B SCI75S060A (,|75i

SC043H100

Abstract: SC090H150 SC043H100S SC175h045s SC175S060A SC125H100A SC090H150A SC175H045 SC200H100S SC066S060
Contextual Info: AN-987 Utilizing SCHOTTKY Rectifier Die In Assembly by Bret Daniels Introduction Probing This application note describes the Schott ky rectifiers available from International Rectifier in die and wafer form. These epitaxial diode die feature a proprietary, high

Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION:

S1025

Abstract: sc275s045 s045x5x
Contextual Info: Bulletin I0118J rev. D 03/07 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)

SC275H100S

Abstract: 61-cmq SC200H100S 403CNQ 60HQ
Contextual Info: 1 I n t e r n a t io n a l R e c t if ie r Schottky Diodes DU Wahr Pvt Number (3) Di* Part Number (4) Di*‘A’ Ungth/Sid* pn.)mm (4) Bond Pad 'B’ Length/Side (injmm Anodi Metalation (topside) Process Tray Quantity 1 Equivalent Finished Product Schottky Die

Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION:

sc275s045

Abstract: IRF 830 equivalent S1025
Contextual Info: Bulletin I0118J 07/00 SC275.5. Series SCHOTTKY DIE 275 x 275 mils a 0.35 ± 0.01 0.14 ± 0.0004 c b d D NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (INCHES). 2. CONTROLLING DIMENSION: (INCH). C A Ø 40 (1.57) 3. DIMENSIONS AND TOLERANCES: a = 6.98 + 0, - 0.05

Contextual Info: Bulletin I0118J rev. D 03/07 SC275.5. Series SCHOTTKY DIE 275 x 275 mils 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS)

Contextual Info: Bulletin I0118J rev. C 09/03 SC275.5. Series 40 157 Wafer flat alligned with side b of the die 0.35 ± 0.01 c (14 ± 0.4) C d b D a A Ø NOTES: 1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS (MILS) Ø 125 (492) 2. CONTROLLING DIMENSION: (MILS) 3. LETTER DESIGNATION: