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    Philips Semiconductors TSA5522T

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    MS-6G

    Abstract: ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f
    Text: PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material Wafer FAB Package Assembly Testing Others: . Affected Product s :


    Original     		PDF Z200-PCN-PA20070101 14X20MM 14X14MM G600F) 48LQFP SB5627 W6694ACD SB5627001 MS-6G ms-7g sa5522 SUMITOMO g600f W83303D w99682bcdg W55U01-A2 ms 6g w89c35d g600f